category: System-Level Design

category: IoT, Security & Automotive

Debug Solutions For Designers Accelerate Time To Verification
By Neil Hand - 28 Oct, 2021 - Comments: 0

Complexity continues to explode as designs become larger and more complicated with more functionality and more aggressive expectations. The cost of doing business as usual, for the entire design and verification team, in turn, grows exponentially, in terms of time, effort, and dollars. Fig. 1: Discovering issues later than possible requires more effort to find and fix. (Source: Wilson Rese... » read more

Intelligent Coverage Optimization: Verification Closure In Hyperdrive
By Anika Malhotra - 28 Oct, 2021 - Comments: 0

Coverage dominates every aspect of verification for today’s complex IP and chip designs. Coverage metrics provide critical feedback on what has been verified and what has not, especially when automated stimulus generation techniques are used. All modern hardware design and verification languages include constructs for functional coverage specification and support a range of structural coverag... » read more

Customize Off-The-Shelf Processor IP
By Roddy Urquhart - 28 Oct, 2021 - Comments: 0

Processor customization is one approach to optimizing a processor IP core to handle a certain workload. In some case it makes sense to design a dedicated core from scratch, but in many cases an existing core may partially meet your requirements and can be a good starting point for your optimized core. In the past some processor IP vendors, notably ARC and Tensilica, offered extensible cores ... » read more

Microchip Sees Significant Productivity Gains In Mature-Node Custom IC Design With In-Design Signoff DRC
By Siemens EDA - 27 Oct, 2021 - Comments: 0

Microsemi pioneered the design of innovative chips that are used for multiple purposes across a variety of industries, using both mature and advanced process nodes. In mature node custom design implementation, layout designers still spend a significant amount of their valuable time fixing DRC errors—time that could be more beneficially spent ensuring their designs meet their PPA goals. By rep... » read more

Co-Packaged Optics And The Evolution Of Switch/Optical Interconnects In Data Centers
By Synopsys - 27 Oct, 2021 - Comments: 0

Driven by a need to reduce power and increase bandwidth density in data center network switches and other devices, the data networking industry is moving toward adoption of co-packaged optics (CPO). This paper provides a brief overview of the history of copper and optical interconnects, the limitations of existing interconnect solutions, and the future of co-packaged optics, including the benef... » read more

Blog Review: Oct. 27
By Jesse Allen - 27 Oct, 2021 - Comments: 0

Siemens EDA's Ray Salemi continues looking into using Python for verification by looking at how pyuvm simplifies and refactors the UVM TLM system to take advantage of the fact that Python has multiple inheritance and no typing. Cadence's Paul McLellan listens in as Larry Disenhof explains the impact that export regulations have on EDA tools and IP products and changes in a rapidly shifting l... » read more

Hierarchical Verification for EC-FPGA Flow
By OneSpin Solutions - 27 Oct, 2021 - Comments: 0

This document describes the methodology to apply EC-FPGA verification using hierarchical netlists. This approach is recommended in case the verification of the overall design has issues with convergence. The document contains a step-by-step description of different methods while providing reasoning for the soundness of each approach. It is assumed for this document that the reader is familiar w... » read more

The Road To Osmosis
By Rob van Blommestein - 27 Oct, 2021 - Comments: 0

It’s happening. Some may have speculated that, with the acquisition of OneSpin by Siemens, the OneSpin user group meeting, more commonly known as Osmosis, would be formally (pun intended) absorbed into a larger Siemens event. Well, I’m here to tell you that Osmosis is officially on the books and will continue to focus on the specific area of formal verification. The team has been working di... » read more

3D-IC Design Challenges And Requirements
By Cadence - 27 Oct, 2021 - Comments: 0

As demands accelerate for increasing density, higher bandwidths, and lower power, many IC design and packaging teams are taking a close look at vertical stacking multiple chips and chiplets. This technology, called 3D-IC, promises many advantages over traditional single-die planar designs. Some are using the term “More-than-Moore” to describe the potential of this new technology. Integratio... » read more

Week In Review: Design, Low Power
By Jesse Allen - 22 Oct, 2021 - Comments: 0

Tools Cadence's digital and custom/analog flows were certified for TSMC's N3 and N4 process technologies. Updates for the digital flow includes efficient processing of large libraries, additional accuracy during library cell characterization and static timing analysis, and support for accurate leakage calculation required in N3 and static power calculation for new N3 cells. Synopsys' digita... » read more

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