Five Digital Threads Unify And Simplify Electronic Systems Design And Manufacturing

By Matt Walsh - 25 Jan, 2024 - Comments: 0

By Matthew Walsh and Matt Bromley Digital transformation involves the integration of digital technologies and the reimagining of business processes to enhance operations, improve customer experiences, and drive innovation. Digital threads are a key component of this transformation, as they enable the seamless flow of data and information across various stages of a process, system, or organiz... » read more

Shifting Left Using Model-Based Engineering

By Karen Heyman - 25 Jan, 2024 - Comments: 0

As heterogenous integration increases design complexity and forces engineers out of long-standing silos, model-based systems engineering (MBSE) is becoming essential for improving quality and reducing failures in the field. While it may seem like a new buzzword, MBSE's principles date back to the 1990s. In essence, it's a process of building models that enable early decisions, which pays off... » read more

Will 2024 Be The Year Of Layered Realities?

By Frank Schirrmeister - 25 Jan, 2024 - Comments: 0

January is always the month of predictions. Our team has already contributed to Semiconductor Engineering's 2023 Look Back and 2024 Outlook. My personal tradition has become to combine the outlook with a look back at what industry experts thought of a decade ago. While this involved a trip to my garage to pick up the respective January IEEE Spectrum issue a decade ago, the new reality is that a... » read more

Why Is The Power Device Market So Hot Right Now?

By Dermott Lynch - 25 Jan, 2024 - Comments: 0

Growing adoption of electric vehicles (EVs) and renewable energy sources is putting the spotlight on power semiconductor devices. These power devices have always been essential in determining the efficiency of a variety of systems, from small household electronics to equipment used in outer space. But as calls to reduce carbon emissions get louder, the market for these chips continues to flouri... » read more

TSMC Reports 4Q2023 Earnings: N2 Still On Track For 2025 Production

By Barry Pangrle - 25 Jan, 2024 - Comments: 0

TSMC reported their 4th quarter and end of year financial numbers for 2023. Year over year, net revenue was down 4.5% to NT$2,161.74 billion, but quarter over quarter revenue was essentially flat at NT$625.52 billion, so it appears that as 3nm is ramping up that revenue is improving. For the fourth quarter, 3nm contributed 15% of TSMC’s total wafer revenue, up from 6% in the third quarter ... » read more

Optimizing IP Management For Chiplet-Based Designs

By Emily Yan - 25 Jan, 2024 - Comments: 0

Chiplets are making big waves in the semiconductor industry, with its global market size growing at 71.3% from 2023 to 2031. Through heterogeneous integration of multiple components of different nodes and technologies, design teams are reinvigorating Moore’s law and paving the way for designs featuring multi-billion transistors and hundreds of IP blocks. These chiplet-based designs are a... » read more

Can Data Centers Afford To Turn Up The Heat?

By Mark Seymour - 25 Jan, 2024 - Comments: 0

Typically, when we discuss digital twin software for data centers, we highlight how engineers can use data center software to model complex thermals using physics-based simulation and find effective ways to cool IT equipment. However, there are compelling efficiency and cost-saving reasons for data center operators to actively seek to run their data centers hotter. But how can this be done wit... » read more

Mastering Complexity Leveraging Digital Threads For Electronics Systems Design And Manufacturing

By Siemens EDA - 25 Jan, 2024 - Comments: 0

The rapid advancement of technology and its integration into various industries, particularly the electronics sector, has led to a significant increase in complexity. Digital threads offer a seamless framework for data flow throughout a product’s lifecycle, from ideation to utilization, fostering collaboration and informed decision-making. They intersect various domains, ensuring information ... » read more

Blog Review: Jan. 24

By Jesse Allen - 24 Jan, 2024 - Comments: 0

Siemens' John McMillan finds that while 3D-IC capabilities are ready for mainstream, mass adoption success depends on how easily, effectively, and efficiently a solution can be delivered and points to five workflow adoption focus areas. Cadence's Andre Baguenie shows how to easily convert a logic signal to an electrical value using Verilog-AMS and the transition filter. Synopsys' Chris Cl... » read more

Understanding Noise And Sensitivity In Spectrum Analyzers

By Keysight - 24 Jan, 2024 - Comments: 0

Using a spectrum analyzer to measure noise signals requires several additional factors, such as sensitivity or how well the instrument can measure small signals. The analyzer’s noise floor specifies the average noise level (DANL) in dB, which is the amount of internally generated noise. Analyzers apply noise floor extension using an algorithm applied to subtract the analyzer’s noise contrib... » read more

← Older posts Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.