category: System-Level Design

category: Auto, Security & Edge AI

Best Options For Using AI In Chip Design
By Ed Sperling - 20 Aug, 2025 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss how and where AI can be applied to chip design to maximize its value, and how that will impact the design process, with Chuck Alpert, Cadence Fellow; Sathish Balasubramanian, head of product marketing and senior director for custom IC at Siemens EDA; Anand Thiruvengadam, senior director and head of AI product management at S... » read more

Launching The Full Potential Of 3D IC With Front-End Architectural Planning
By Siemens EDA - 19 Aug, 2025 - Comments: 0

3D IC and chiplet-based design have the potential to accelerate the pace of semiconductor industry innovation. 3D IC design teams pack more functionality closer together and achieve higher levels of systems integration and performance in a smaller footprint faster than what’s possible with traditional SoC implementation. To achieve the full potential of 3D IC, teams need cost-effective fro... » read more

Blog Review: Aug. 6
By Jesse Allen - 06 Aug, 2025 - Comments: 0

Cadence's Shyam Sharma checks out key features of the LPDDR6 specification, including data transfer speeds that can reach up to 14.4Gbps, two sub-channels per device, metadata built into the data packets, and row hammer mitigation. Synopsys' Frank Malloy and Vincent van der Leest describe the essential role that a hardware root of trust plays in providing a secure foundation for all other se... » read more

Hallucination And Innovation At DAC
By Brian Bailey - 31 Jul, 2025 - Comments: 0

At DAC this year, I had the pleasure of moderating an intimate chat between Alon Shtepel, senior director for ASIC at Micron, and Abhi Kolpekwar, vice president and general manager for digital verification technology at Siemens EDA. The assigned topic was generative AI in design and verification, with the more provocative subtitle asking if we are hallucinating or innovating? L-R: Brian ... » read more

Baby, It’s Hot Outside!
By Paul Carpine - 31 Jul, 2025 - Comments: 0

Electronics manufacturing production sites are ideal places to be during the summer because they maintain controlled temperatures. It’s well known that 23°C (74°F) is the ideal temperature inside electronics manufacturing areas. However, when the outside temperature reaches 40°C (104°F), the air conditioning system may struggle to maintain this lower value indoors. Many companies estab... » read more

UEC-LLR: The Future Of Loss Recovery In Ethernet For AI And HPC
By Krunal Patel - 31 Jul, 2025 - Comments: 0

As Artificial Intelligence (AI) and High-Performance Computing (HPC) systems become the backbone of modern data centers, they generate and consume a massive amount of data. Traditional Ethernet was not built for such high-bandwidth traffic. In HPCs and AI models, computations are distributed across the nodes and the data is shared in real time with low latency and lossless communication. As ... » read more

For Chip Developers, HW/SW Co-Design Key To Data Center Efficiency
By Liz Allan - 31 Jul, 2025 - Comments: 0

Data centers and high-performance computing (HPC) are the primary enablers of today’s power-hungry AI-driven technology, but chip designers, EDA vendors, and the data centers themselves have a long list of options available to them to help curb AI's power consumption. Chip designers play a critical role in ensuring energy efficient processing from the bottom up, whether that is hardware-so... » read more

System Integration With Standards-Based Automation
By Insaf Meliane - 31 Jul, 2025 - Comments: 0

Today’s semiconductor designs support a broad range of applications, from mobile and edge devices to AI accelerators and data center systems. To keep pace, design teams are shifting from monolithic systems-on-chip (SoCs) to increasingly complex multi-die and chiplet-based architectures. These heterogeneous systems often incorporate IP developed at different times, by different teams, or sourc... » read more

What Is The Next Generation In RF Circuit Simulation And Optimization?
By Richard Duvall - 31 Jul, 2025 - Comments: 0

Throughout a modern radio frequency integrated circuit (RFIC) design and fabrication process, engineers run many types of simulations to verify and validate their decisions, including: electronic circuit simulations RF circuit simulations electromagnetic (EM) simulations thermal simulations and electro-thermal co-simulations post-layout mixed signal (analog and digital) simulat... » read more

Multi-Modal AI In EDA Development Flows
By Brian Bailey - 31 Jul, 2025 - Comments: 0

RTL coding is a critical step in the development of semiconductors, but many would argue it is not the most difficult. Things become a lot more complex as you get closer to implementation, and as the system context becomes larger than can be comprehended by text alone. In both cases, layout, timing, power, and many other factors come into play, but none is as easily represented by text, and the... » read more

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