category: System-Level Design

category: IoT, Security & Automotive

The Drive To Disrupt: How Digital Twins Are Fueling Automotive Innovation
By Jenn Mullen - 27 Apr, 2023 - Comments: 0

It can be argued that disruptive innovation in the auto sector has defined each of the modern eras. Through history, engineering breakthroughs have shaped the human experience. The wheel and calendar, printing press and cotton gin, electricity and the assembly lines are the vehicles by which we tell the story of human progress. Henry Ford's assembly line not only democratized motor vehicle owne... » read more

Working With The NimbleAI Project To Push The Boundaries Of Neuromorphic Vision
By Tora Fridholm - 27 Apr, 2023 - Comments: 0

At the end of 2022, the EU kicked off a cool project that aims to implement neuromorphic vision. But what is that? Let’s take a deeper look at the project and our contribution. First, if you are not familiar with Codasip Labs, I want to mention this briefly. Codasip Labs is in fact our innovation hub where we explore new technologies and try to contribute to the technology of the future. ... » read more

Easy-To-Use Reliability Checks Throughout The Design Cycle From IP To Full-Chip Tapeout
By Hossam Sarhan - 27 Apr, 2023 - Comments: 0

By Hossam Sarhan and Alexandre Arriordaz With the increasing complexity of design layouts and shorter tapeout cycles, waiting until signoff verification is no longer practical for design teams. There is a constant push to shift targeted verification activities “left” to earlier stages in the design flow. Finding and eliminating selected errors earlier during design and implementation, wh... » read more

Improved DSP And AI Performance On An MCU Core
By Eldar Sido - 27 Apr, 2023 - Comments: 0

In the world of embedded devices, there's a growing demand for advanced machine learning and signal processing capabilities. ARM Cortex-M85, the latest general-purpose core, aims to meet these demands with its 32-bit Armv8.1-M architecture, offering high performance and power efficiency. The core's Helium technology, M-profile vector extension (MVE), provides significant uplift for ML/DSP appl... » read more

Notes From CadenceLIVE Silicon Valley 2023
By Paul McLellan - 27 Apr, 2023 - Comments: 0

Last week was CadenceLIVE Silicon Valley, held at the Santa Clara Convention Center, and took place, as usual, over two days. It was very well attended and everywhere seemed fairly crowded. The structure of CadenceLIVE was that the first morning was taken up with four keynotes. Then the rest of the day and all of the following day were taken up with about ten parallel technical tracks. And at l... » read more

Pre-Layout, Post-Layout Circuit Reliability
By Siemens EDA - 26 Apr, 2023 - Comments: 0

With the increasing complexity of design layouts and shorter tapeout cycles, waiting until signoff verification to check design reliability is no longer practical for design teams. Designers must now apply reliability verification checks throughout the design flow, from intellectual property (IP) level to full-chip level, to ensure they meet tapeout schedules while confirming design reliability... » read more

Impacts Of Process Flow, Scaling, And Variability On Interconnect Performance
By Lam Research - 26 Apr, 2023 - Comments: 0

Virtual fabrication is used to evaluate the performance of interconnects (line and via resistance, capacitance, etc.) across pitches compatible with either EUV single exposure or SADP for three different process flows: single damascene, dual damascene, and semi-damascene (subtractive metal etch). The effects of process variation for the three flows are also investigated to determine the relativ... » read more

Meeting The Major Challenges Of Modern Memory Design
By Synopsys - 26 Apr, 2023 - Comments: 0

Memory lies at the heart of every electronics application, and demand is growing all the time. Users want ever greater capacity, throughput, and reliability. At the same time, time to market (TTM) goals and competitive pressures mandate that memories be developed in ever shorter project schedules. These requirements put enormous pressure on designers of discrete memory chips, memory dies in 2.5... » read more

Blog Review: April 26
By Jesse Allen - 26 Apr, 2023 - Comments: 0

Codasip's Tora Fridholm introduces the NimbleAI project, an effort to design a neuromorphic sensing and processing 3D integrated chip that implements an always-on sensing stage, highly specialized event-driven processing kernels and neural networks to perform visual inference of selected stimuli using the bare minimum amount of energy. Synopsys' Anjaneya Thakar discusses computational lithog... » read more

Automated HW/SW Co-Design Of DSP Systems Composed Of Processors And Hardware Accelerators
By Cadence - 26 Apr, 2023 - Comments: 0

Seemingly overnight, data acquisition and digital signal processing have gone from a hidden background function in special purpose-built subsystems, such as PC graphics cards and airborne missile guidance systems, to the foreground in the form of in-ear IoT devices, smartphones, and autonomous vehicles. As the number of smart data-acquisition devices grows, so does the amount of data requiring ... » read more

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