category: System-Level Design

category: Auto, Security & Edge AI

Data Acquisition Software: The Brains Behind The Hardware
By Bernard Ang - 28 Mar, 2024 - Comments: 0

We have previously talked about how data acquisition systems streamline the testing of various test scenarios. However, the data acquisition (DAQ) hardware is just one-half of the equation. To make the hardware useful for various test scenarios, you need suitable data acquisition software and firmware that can take advantage of that powerful hardware and bridge the gap between your needs and... » read more

Navigating Design Challenges
By Siemens EDA - 28 Mar, 2024 - Comments: 0

Explore the future of IC design with the Calibre Shift left initiative. In this paper, author David Abercrombie reveals how Siemens is changing the game for block/chip design-stage verification by moving Calibre verification and reliability analysis solutions further left in the design flow, including directly inside your P&R tool cockpit. Discover how you can reduce traditional long-loop v... » read more

Jumpstarting The Automotive Chiplet Ecosystem
By Steve Brown - 28 Mar, 2024 - Comments: 0

The automotive industry stands on the cusp of a technological renaissance, ushering in an era where vehicles aren't just tools of transportation, but interconnected nodes within a vast network of software-defined mobility. Central to this transformation is the concept of chiplets—miniaturized, modular components that can be mixed, matched, and scaled to create powerful, application-specific i... » read more

Everything You Need to Know About Wi-Fi 7
By Keysight - 27 Mar, 2024 - Comments: 0

The IEEE 802.11be standard introduces several new features for improving WLAN efficiency, capacity, and coverage. Features such as multi-link operation (MLO) and multiple resource units (multi-RUs) increase the number of configurations and test scenarios to validate a device thoroughly. In addition to physical-layer testing, test engineers must emulate signaling to verify interactions between a... » read more

Leveraging Automotive Chip Design Techniques For Space-Borne Applications
By Synopsys - 27 Mar, 2024 - Comments: 0

Space-borne electronics must operate in an unforgiving environment with harsh conditions and little opportunity to repair failing components. A combination of functionally safe design, RHBD, and robust IP is required. Fortunately, automotive applications share many of the same challenges, and techniques to address these challenges are well established and proven. This white paper surveys the ma... » read more

Sea Of Processors Use Case
By Movellus - 27 Mar, 2024 - Comments: 0

Core counts have been increasing steadily since IBM's debut of the Power 4 in 2001, eclipsing 100 CPU cores and over 1,000 for AI accelerators. While sea of processor architectures feature a stamp and repeat design, per-core workloads aren't always going to be symmetrically balanced. For example, a cloud provider (AI or compute) will rent out individual core clusters to customers for specialize... » read more

Blog Review: Mar. 27
By Jesse Allen - 27 Mar, 2024 - Comments: 0

Cadence's Steve Brown suggests that multi-die technologies will be a key part of the path toward a faster, more efficient chip ecosystem that can support the compressed development cycles now emerging in the automotive industry. Synopsys' John Swanson, Madhumita Sanyal, and Priyank Shukla point to the role of simulation in ensuring seamless operation in the Ethernet ecosystem though rigorous... » read more

Cadence Cerebrus In SaaS And Imagination Technologies Case Study
By Cadence - 27 Mar, 2024 - Comments: 0

Artificial Intelligence (AI) has made noteworthy progress and is now ready and available for electronic design automation. The Cadence Cerebrus Intelligent Chip Explorer utilizes AI—specifically, reinforcement machine learning (ML) technology—combined with the industry-leading Cadence digital full flow to deliver better power, performance, and area (PPA) more quickly. However, this highl... » read more

The Data Crisis Is Unfolding — Are We Ready?
By Alphawave Semi - 27 Mar, 2024 - Comments: 0

The rapid advancement of technology has led to an unprecedented amount of data being generated, captured, and consumed globally. However, this reliance on data comes at a considerable cost. The widespread sharing and processing of data is necessary to navigate our everyday lives. Still, any disruption to this process can have severe consequences, threatening our ability to function as a society... » read more

3D-IC Intensifies Demand For Multi-Physics Simulation
By Ann Mutschler - 20 Mar, 2024 - Comments: 0

The introduction of full 3D-ICs will require a simultaneous analysis of various physical effects under different workloads, a step-function change that will add complexity at every step of the design flow, expand and alter job responsibilities, and bring together the analog and digital design worlds in unprecedented ways. 3D-ICs will be the highest-performance advanced packaging option, in s... » read more

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