category: Top Stories

category: IoT, Security & Automotive

Building Complex Chips That Last Longer
By Ed Sperling - 23 Sep, 2021 - Comments: 0

Semiconductor Engineering sat down to talk about design challenges in advanced packages and nodes with John Lee, vice president and general manager for semiconductors at Ansys; Shankar Krishnamoorthy, general manager of Synopsys' Design Group; Simon Burke, distinguished engineer at Xilinx; and Andrew Kahng, professor of CSE and ECE at UC San Diego. This discussion was held at the Ansys IDEAS co... » read more

Data Tsunami Pushes Boundaries Of IC Interconnects
By Ann Mutschler - 22 Sep, 2021 - Comments: 0

Rapid increases in machine-generated data are fueling demand for higher-performance multi-core computing, forcing design teams to rethink the movement of data on-chip, off-chip, and between chips in a package. In the past, this was largely handled by the on-chip interconnects, which often were a secondary consideration in the design. But with the rising volumes of data in markets ranging fro... » read more

The Silicon Carbide Race Begins
By Patrick Waurzyniak - 20 Sep, 2021 - Comments: 0

The growing adoption of silicon carbide (SiC) for a variety of automotive chips has reached the tipping point where most chipmakers now consider it a relatively safe bet, setting off a scramble to stake a claim and push this wide-bandgap technology into the mainstream. SiC holds great promise for a number of automotive applications, particularly for battery electric vehicles. It can extend d... » read more

Gearing Up For Next-Gen Power Semis
By Mark LaPedus - 16 Sep, 2021 - Comments: 0

After years in R&D, several vendors are moving closer to shipping power semiconductors and other products based on next-generation wide-bandgap technologies. These devices leverage the properties of new materials, such as aluminum nitride, diamond, and gallium oxide, and they are also utilized in different structures, such as vertical gallium-nitride power devices. But while many of thes... » read more

System-In-Package Thrives In The Shadows
By Mark LaPedus - 16 Sep, 2021 - Comments: 0

IC packaging continues to play a big role in the development of new electronic products, particularly with system-in-package (SiP), a successful approach that continues to gain momentum — but mostly under the radar because it adds a competitive edge. With a SiP, several chips and other components are integrated into a package, enabling it to function as an electronic system or sub-system. ... » read more

Nudging 2D semiconductors forward
By Katherine Derbyshire - 16 Sep, 2021 - Comments: 1

The buzz about 2D materials replacing silicon appears to be premature. While 2D semiconductors have emerged as potential successors, it's not clear when or even if that will happen. As Iuliana Radu, Imec's director of quantum and exploratory computing observed, the “end” of silicon has been predicted many times before. It is not clear when 2D semiconductors will need to be ready. In fac... » read more

Challenges With Chiplets And Packaging
By Mark LaPedus - 15 Sep, 2021 - Comments: 0

Semiconductor Engineering sat down to discuss IC packaging technology trends, chiplets, shortages and other topics with William Chen, a fellow at ASE; Michael Kelly, vice president of advanced packaging development and integration at Amkor; Richard Otte, president and CEO of Promex, the parent company of QP Technologies; Michael Liu, senior director of global technical marketing at JCET; and Th... » read more

Long-Haul Trucking With Fewer Drivers
By Ann Mutschler - 13 Sep, 2021 - Comments: 1

The trucking industry is betting heavily on increasing levels of autonomy and electrification to reduce the cost of moving goods and to overcome persistent problems. The economics of autonomous driving are compelling, not least of which is an almost perpetual shortage of qualified drivers. But there also are a number of technical hurdles to making this work. On top of the challenges facing t... » read more

Wrestling With Analog At 3nm
By Brian Bailey - 09 Sep, 2021 - Comments: 0

Analog engineers are facing big challenges at 3nm, forcing them to come up with creative solutions to a widening set of issues at each new process node. Still, these problems must be addressed, because no digital chip will work without at least some analog circuitry. As fabrication technologies shrink, digital logic improves in some combination of power, performance, and area. The process te... » read more

Tradeoffs Between Edge Vs. Cloud
By Brian Bailey - 09 Sep, 2021 - Comments: 0

Increasing amounts of processing are being done on the edge, but how the balance will change between what's computed in the cloud versus the edge remains unclear. The answer may depend as much on the value of data and other commercial reasons as on technical limitations. The pendulum has been swinging between doing all processing in the cloud to doing increasing amounts of processing at the ... » read more

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