Shifting Left With DFT To Optimize Productivity, Testability, And Time-To-Market


This paper discusses one of the Siemens EDA shift-left strategies in the RTL-to-signoff flow: shift-left design-for-test (DFT). Tessent RTL Pro software automates the analysis and insertion of Tessent VersaPoint test point technology, LBIST-OST test points, dedicated scan wrapper cells and x-bounding logic as behavioral code at the RTL level. Tessent RTL Pro builds on Tessent’s market-leading... » read more

Atomic Force Microscopy: The Definitive AFM Modes Handbook


This handbook illustrates the wide variety of operating modes available on Bruker AFMs, going well beyond the standard high‑resolution topographic imaging capabilities of AFM. The modes are broken into seven separate categories: morphology, electromagnetic properties, thermal properties, mechanical properties, chemical properties, electrochemical properties, and manipulation. Each category be... » read more

Overview of Silicon Carbide Technology: Status, Challenges, Key Drivers, and Product Roadmap


Abstract: Arguably, SiC technology is the most rapidly expanding IC manufacturing technology driven mostly by the aggressive roadmap for battery electric vehicle penetration and also industrial high-voltage/high-power applications. This paper provides a comprehensive overview of the state of the art of SiC technology focusing on the challenges starting from the difficult and lengthy SiC substr... » read more

Getting Real About AI Processors


There’s a lot of confusion and hype around AI. Nearly every service, product or subject area in the technology industry now has an AI label. A lot of this is valid and there’s no doubt that AI is opening up new capabilities and higher productivity across all industries. This white paper categorises AI and related hardware options, with a particular focus on on-device (i.e. edge) AI, givi... » read more

Enhancing AI Datacenter PSUs With Hybrid-Si, SiC, And GaN Power Devices


The rapid growth of artificial intelligence (AI) is driving an unprecedented demand for processing power in data centers, resulting in a surge in power demand at the rack level. With the existing data center rack sizes, the challenge is to deliver more power and efficiency in the same physical footprint apart from costs and cooling. To address this, Infineon has developed a range of hybrid powe... » read more

Flex PCBs Explained: From Materials to Applications Technical eBook


This ebook provides a comprehensive overview of flex PCBs, highlighting their unique benefits, materials used, common challenges, and how you can overcome them. Learn about the various applications of rigid-flex/flex PCBs in modern electronics and gain insights into the future of flex design. Read more here. Fig.1: Small Flex PCB.  Source: Cadence. » read more

Multi-Die Design Start Guide


If you are exploring a multi-die project and need guidelines on getting started, this white paper is for you. Any engineer on a semiconductor design project has read many articles about the power, performance, and area (PPA), functional scalability, and time-to-market advantages of multi-die designs using 2.5D and 3D technologies. The advantages are the main reason the adoption of multi-die des... » read more

Accelerating SI/PI Signoff: A Shift-Left Approach to PCB Design


In high-speed PCB design, late-stage signal integrity (SI) and power integrity (PI) issues can lead to costly redesigns and delays. This white paper explores how in-design analysis helps engineers catch and fix SI/PI challenges early, saving time, reducing risks, and ensuring first-pass success. What You’ll Learn: The Shift-Left Advantage – How early SI/PI analysis minimizes late-s... » read more

Combination of Coherent and Non-Coherent NoCs Facilitates Cutting-Edge SoC Design


SCALINX, a fabless semiconductor company specializing in the design of system-on-chip (SoC) devices, was looking to develop a large, next-generation SoC integrating analog, digital, mixed-signal, and RF functionality. Business Challenge • Develop a large, next-generation SoC integrating analog, digital, mixed-signal, and RF functionality. Design Challenges • Ensure different portions ... » read more

Modeling Flux-Quantizing Josephson Junction Circuits


We introduce Josephson junction and inductor models in Keysight ADS that feature an auxiliary flux port, and facilitate the expression of flux quantization conditions in simulation of superconducting microwave circuits. We present several examples that illustrate our methodology for constructing flux-quantizing circuits, including dc- and rf-SQUIDs, tunable couplers, and parametric amplifiers u... » read more

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