category: Whitepapers

category: IoT, Security & Automotive

Measurements and Simulation-Based Characterization Of eFuses
By Fraunhofer IIS/EAS - 11 Jun, 2025 - Comments: 0

In conventional safety systems, the off state can be assumed to be safe. With ADAS, this is no longer automatically the case. This makes it necessary to adopt new approaches to fuse protection, which will subsequently spread to other industries. Traditionally, the vehicle electrical system was protected by sacrificial fuses. These reliably disconnect the power supply in the event of overcurr... » read more

Introducing a Digital Engineering Methodology To Aid All Engineers
By Ansys - 11 Jun, 2025 - Comments: 0

A systems engineer developing a novel system-on-a-chip (SoC) design. A CFD engineer studying the airflow over the wing of a new electric airplane design. A safety engineer reviewing the design of a new pacemaker to confirm that it is compliant with existing regulations and requirements. What do all these people have in common? One connecting thread is the ever-present need to efficiently col... » read more

Configurability In The Design Of Integrated Chipsets
By Expedera - 11 Jun, 2025 - Comments: 0

The semiconductor industry is experiencing significant changes as the requirements for processing data are evolving. Computing systems must manage unparallel massive amounts of data created by users, whether machines or humans. Artificial Intelligence is the mechanism by which this data gets processed, and it is driving a rethinking of the architectures of the computing systems. In conjunction ... » read more

Designing For Reliability With A System Life Estimator
By Cadence - 11 Jun, 2025 - Comments: 0

From big machines to small handheld equipment, all typically come with varying warranty timelines based on estimations. If this number is overestimated or underestimated, it can incur millions of dollars in losses to manufacturers. That’s why it’s important to look at the lifetime system estimation as a bottom-up process. The efficiency in this approach results in a robust method to formula... » read more

Stress-Related Local Layout Effects In FinFET Technology And Device Design Sensitivity
By PDF Solutions - 10 Jun, 2025 - Comments: 0

Abstract: "Transistor characteristics in advanced technology nodes are strongly impacted by devices design and process integration choices. Variation in the layout and pattern configuration in close proximity to the device often causes undesirable sensitivities known as Local Layout Effects (LLEs). One of the sensitivities is related to carrier mobility dependence on mechanical stress, modul... » read more

A New RF Platform For Silicon MMIC And System Design
By Cadence - 04 Jun, 2025 - Comments: 0

Next generation wireless modules combine innovative and proven RFIC/MMIC designs into a single package―delivering superior performance, lower power consumption, and reduced size, weight, and cost. Advanced system engineering plays a crucial role in this progress, with a strong focus on packaging interconnect design, RF analysis, and thermal and electromagnetic (EM) awareness that enable se... » read more

A New Era Of Edge AI: E-Series GPU IP
By Imagination Technologies - 04 Jun, 2025 - Comments: 0

Welcome to the Age of Parallel Compute The age of parallel compute has arrived. The emergence of artificial intelligence is having profound implications on hardware development in every single market. Data centres are being built with massive compute resources to handle the demands of training and connected inference. At the edge, embedded hardware system designers are dealing with the chal... » read more

Next Level Inductive Sensing For New Metallic, Waterproof And Robust HMI Touch Designs
By Infineon - 04 Jun, 2025 - Comments: 0

The need for advanced and improved human machine interfaces (HMIs) is increasing due to increasing digitalization trends including Industry 4.0, the Internet of Things (IoT), the Artificial Intelligence of Things (AIoT), and more. At the same time, product designers use various HMI touch technologies to improve and differentiate their designs from competitors. Liquid tolerance and sleek metalli... » read more

The Hidden Cost Of Automotive Software Integration – A Shortcut That Changes Everything
By Synopsys - 04 Jun, 2025 - Comments: 0

Automotive software is developed in silos but must function as one integrated system. This organizational reality isn’t going away, and yet its consequences remain painful: late feedback, expensive debugging, and fragile, hardware-bound integration. This white paper introduces a pragmatic, scalable solution: horizontal integration with virtual electronic control units (vECUs), test automat... » read more

Thermo-Mechanical Stress On Active Chiplets In A 3D-IC Heterogeneous Package Assembly
By Siemens EDA - 29 May, 2025 - Comments: 0

The move to heterogeneous multi-chip/chiplet products improves yield, performance and modularity while reducing power and overall product footprint. However, this shift to heterogeneous assembly also introduces new complexities that can influence chip warpage and circuit behavior due to thermo-mechanical stress impacts. In heterogeneous 3D IC architectures, the interaction between the chips ... » read more

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