category: Whitepapers

category: IoT, Security & Automotive

Adaptive Shot Technology To Address Severe Lithography Challenges For Advanced FOPLP
By Onto Innovation - 07 Dec, 2020 - Comments: 0

Fan-out wafer level packaging (FOWLP) is a popular new packaging technology that allows the user to increase I/O in a smaller IC size than fan-in wafer level packaging. Market drivers such as 5G, IoT, mobile and AI will all use this technology. According to Yole Développement’s analysis, the fan-out packaging market size will increase to $3 billion in 2022 from $2.44 hundred million in 2014,... » read more

Systematic Methodology To Solve Reset Challenges In Automotive SoCs
By Mentor, a Siemens Business - 02 Dec, 2020 - Comments: 0

Modern automotive SoCs typically contain multiple asynchronous reset signals to ensure systematic functional recovery from unexpected situations and faults. This complex reset architecture leads to a new set of problems such as possible reset domain crossing (RDC) issues. The conventional clock domain and CDC verification methodologies cannot identify such critical bugs. In this paper, we prese... » read more

Reducing Risk And Increasing Efficiency For IEC61508 And ISO26262 Certified Safety Applications
By Xilinx - 02 Dec, 2020 - Comments: 0

This white paper introduces key dependability aspects for industrial and automotive customers who are designing and developing programmable electronic equipment for safety applications using Xilinx FPGA and SoC devices. The main focus of this white paper is to explain how to create solutions with highly integrated, high-performance certifiable systems that target IEC 61508 / ISO 26262 norms. Th... » read more

Using Formal To Verify Safety-Critical Hardware For ISO 26262
By OneSpin Solutions - 02 Dec, 2020 - Comments: 0

Automotive technology has come a long way since the days of the Ford Model T. Today's smart vehicles not only assist their drivers with tasks such as parking, lane management, and braking, but also function as a home away from home, with WiFi hotspots and sophisticated entertainment systems. These sophisticated features are made possible by increasingly complex electronic systems—systems that... » read more

System Simulation For RF Link Budget Analysis
By Cadence - 02 Dec, 2020 - Comments: 0

This white paper examines how a more rigorous link budget analysis of an entire system can be determined through simulation, and how performing link budget analysis enables designers to address losses, gains, and power levels to meet the operational requirements of the radio communications system. Click here to read more. » read more

Detecting And Preventing Automotive Hardware Security Vulnerabilities
By Tortuga Logic - 02 Dec, 2020 - Comments: 0

In this new whitepaper, you will learn: How to detect and prevent hardware security vulnerabilities in automotive applications with Tortuga Logic’s Radix See how using Radix, as part of your Automotive Security Development Lifecycle, automates and enables a security signoff methodology Click here to read white paper. » read more

Software Due Diligence: A Buyer’s Checklist And Guidelines
By Synopsys - 02 Dec, 2020 - Comments: 0

The potential risk and exposure posed by M&A transactions demand thorough and robust due diligence practices. When an acquisition involves software, it's critical to ensure that associated risks are identified and fully understood. Knowing what questions to ask when performing due diligence is key to avoiding potential risks and legal complications. This is especially true for the acquisiti... » read more

Advanced Real‐Time Video Image Recognition
By Arteris - 02 Dec, 2020 - Comments: 0

In this 4-page paper, created with the participation of Mobileye, you will learn how the world's #1 vision-based ADAS company uses Arteris FlexNoC interconnect IP to address demanding high bandwidth and low-latency requirements. By using FlexNoC interconnect IP for its EyeQ3 and EyeQ4 product lines, Mobileye was able to address the following issues: Maintain low latency while connecting... » read more

LDFO SiP For Wearables & IoT With Heterogeneous Integration
By Amkor - 02 Dec, 2020 - Comments: 0

Authors A. Martins*, M. Pinheiro*, A. F. Ferreira*, R. Almeida*, F. Matos*, J. Oliveira*, Eoin O´Toole*, H. M. Santos†, M. C. Monteiro‡, H. Gamboa‡, R. P. Silva* ‡Fraunhofer Portugal AICOS, Porto, Portugal †INESC TEC *AMKOR Technology Portugal, S.A. ABSTRACT The development of Low-Density Fan-Out (LDFO), formerly Wafer Level Fan-Out (WLFO), platforms to encompass the require... » read more

Isolate Security-Critical Applications On Zynq UltraScale+ Device
By Xilinx - 01 Dec, 2020 - Comments: 0

Implementing a TEE on the Zynq UltraScale+ platform (RFSoCs and MPSoCs) greatly reduces the attack surface of security-critical applications. Explore this white paper to find out • What a TEE is • How the requirements for a TEE are easily met on the Zynq UltraScale+ platform • Why a TEE is needed, even if hypervisors are used • An example architecture of Prove & Run’s Proven... » read more

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