category: Whitepapers

category: IoT, Security & Automotive

Integrated, Turnkey Droop Response System: Heterogeneous IP Use Case
By Movellus - 29 May, 2024 - Comments: 0

Whether you serve the ADAS, PC, or networking market, chances are that your SoC is heterogeneous; containing general processors and application-specific accelerators. Your solution might have a systolic array for convolutions, a cluster of CPUs for application code, or a look-aside crypto engine for packet security. While application-specific accelerators significantly improve performance and p... » read more

High-Level Synthesis Enables The Next Generation Of Edge AI Accelerators
By Siemens EDA - 15 May, 2024 - Comments: 0

AI is becoming pervasive. But the ever increasing complexity is a challenge for IoT systems. Achieving the highest levels of performance and efficiency in edge AI means going beyond software and off the shelf hardware. Bespoke hardware accelerators in FPGA or ASICs can deliver much higher performance while consuming less energy. Building these accelerators with High-Level Synthesis slashes desi... » read more

Three Ways To Speed Up Timing Closure Of High-Speed PCB Interfaces
By Cadence - 15 May, 2024 - Comments: 0

On advanced high-speed interfaces, timing closure can be an iterative process that can be time-consuming and frustrating. PCB designers need techniques and tools to make the process more efficient, so they can contribute to an overall faster time to market for the design. This article discusses three ways that the new Cadence Allegro TimingVision environment speeds up timing closure of high-spe... » read more

Innovating Electric Mobility: Simulation Solutions For Electric Machines
By Ansys - 15 May, 2024 - Comments: 0

Automakers desire solutions that can easily scale to new applications of next generation vehicles. Electrified propulsion technology is one main area where EV engineers are pushing the boundaries. Electric machine design and integration choices have system-level impacts that directly influence an automaker’s time to market and even overall market adoption. With Ansys multiphysics simulatio... » read more

How To Calculate The ROI Of Semiconductor IP Management
By Keysight - 15 May, 2024 - Comments: 0

Intellectual property (IP) is a vital asset for technology companies. IP is often a critical factor in the valuation of a company and must be protected from accidental damage, leakage, and other negative consequences of poor handling. In the context of silicon companies that work on building silicon chips, the term IP involves overseeing both internal IP developed by the company itself and exte... » read more

Is The Transformer Era Over?
By Quadric.io - 15 May, 2024 - Comments: 0

The idea of transformer networks has existed since the seminal publication of the Attention is All You Need paper by Google researchers in June 2017.  And while transformers quickly gained traction within the ML research community, and in particular demonstrated superlative results in vision applications (ViT paper), transformer networks were definitely not a topic of trendy conversation ar... » read more

Ambient Intelligence eBook
By Arm - 15 May, 2024 - Comments: 0

Get the lowdown on future ambient computing use cases and benefit from simple considerations you can build into your product roadmap today to ensure your platform is ready to capitalise on this burgeoning trend. This tech trends guide covers: Laying the foundations for ambient experiences Future use cases Challenges facing ambient computing use cases Six considerations to addre... » read more

Using Deep Learning ADC For Defect Classification For Automatic Defect Inspection
By Onto Innovation - 14 May, 2024 - Comments: 0

In traditional semiconductor packaging, manual defect review after automated optical inspection (AOI) is an arduous task for operators and engineers, involving review of both good and bad die. It is hard to avoid human errors when reviewing millions of defect images every day, and as a result, underkill or overkill of die can occur. Automatic defect classification (ADC) can reduce the number of... » read more

Improvement of High-Gradation DDIC Device Test Yield By T6391 High-Accuracy Measurement Solution
By Advantest - 14 May, 2024 - Comments: 0

For DDIC (Display Driver IC) for OLED (Organic Light Emitting Diode) displays for smartphones and IT displays (tablets, laptops) and head mounted displays for AR (Augmented Reality)/VR (Virtual Reality), the output voltage will be divided into more highly-defined steps than in the past. A new per-pin digitizer and comparator module “LCD HP” was developed to measure the output voltage of the... » read more

Return On Investment Of A Pre-Reflow AOI System
By Nordson Test And Inspection - 14 May, 2024 - Comments: 0

This paper describes the losses from defects at the placement process in the SMT line. Two case studies of European and Taiwanese SMT manufacturers illustrate the actual losses from their defects. An evaluation method to select a pre-reflow AOI system maximizing the return on investment (ROI) is introduced. In the end, ROIs of three commercial pre-reflow AOI systems are compared to demonstrate ... » read more

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