Fine-Line RDL Structure Analysis of Fan-Out Chip-on-Substrate Platform


Abstract: "The demand for high bandwidth memory (HBM) has driven the need for advanced packaging solutions, particularly those involving fan-out layers to interconnect wafers within packages. To meet the high-bandwidth requirements of the Fan-Out Chip-on-Substrate (FOCoS) technology platform, additional layers are required. However, as the number of fanout layers increases, significant chall... » read more

Advanced Atomistic Simulation Techniques For Atomic Layer Etching


Continuous downscaling of the critical dimensions in semiconductor devices is the cornerstone of technological revolution. As the technology nodes keep shrinking, innovations in fabrication technologies are needed to continue the trend. We have arrived at the age where atomic level precision in the fabrication of semiconductor devices is needed to keep improving PPA. Thus, advanced film fabrica... » read more

Arm AI Readiness Index


The Arm AI Readiness Index report is a comprehensive analysis of global AI readiness and implementation for enterprises worldwide. Drawing on survey data from business leaders across eight countries, the report offers a range of insights exploring the global opportunities and challenges around AI, including: Business adoption Technology requirement The policy and regulatory landscape... » read more

Discovering Digital Twins: A Complete Guide


As artificial intelligence (AI) and machine learning (ML) continue to revolutionize industries, their integration with simulation is amplifying the capabilities of digital twins. AI/ML, simulation, and reduced-order modeling (ROM) technologies combine to create hybrid digital twins—virtual replicas that blend data-driven insights with the accuracy of physics-based models. This powerful approa... » read more

Is Liquid Cooling Right for Your Data Center: eBook


As data centers face rising chip densities and energy costs, liquid cooling is emerging as a powerful solution. But is it the right fit for your facility? This eBook covers the essentials to help you decide. Who Should Read This eBook: -Senior management of data center operations -Data center designers and consultants -Engineers in IT and facilities management Key Takeaways: -Lear... » read more

Transforming The Semiconductor Industry: Future Roadmap For Generative AI On The Edge


In the third of a three-part series, Expedera, in conjunction with the Global Semiconductor Alliance’s Emerging Technologies (EmTech) group explores “Transforming the Semiconductor Industry: Future Roadmap for Generative AI on the Edge”. This white paper explores key applications for Generative AI and the features they enable, as well as an examination of how model growth and differing mo... » read more

2025-Product Design Enhancement With Test Structures For Non-Contact Detection Of Yield Detractors


Abstract: Detection and monitoring of the yield loss mechanisms and defects in product chips have been a subject of extensive efforts, resulting in multiple useful Design-for-Manufacturing (DFM) and Design-for-Test (DFT) techniques. Defect inspection techniques extend optical inspection further into sub-10 nm nodes, but many buried defects are formed as a result of multi-layer 3-D interaction... » read more

A Universal Deep Learning Model For Segmenting Automated Optical Inspection Images


A new technical paper titled "A Universal AI-Powered Segmentation Model for PCBA and Semiconductor" was published by researchers at Nordson Corporation. "This paper introduces a novel universal deep learning model designed to segment AOI images for both PCBA and 17 semiconductor components, offering a more robust and adaptable solution for defect detection," states the paper. Read more he... » read more

2024 Security IP Year In Review: Innovations And Best Practices


This booklet offers six insightful articles on advanced security IP technologies, helping to fortify digital systems against emerging threats. Learn about: DDR Interface Security: Defend against DRAM attacks. IoT Security: Safeguard IoT devices with SIM and Root of Trust. SRAM PUF Technology: Secure device authentication. Post-Quantum Cryptography: Protect against quantum threa... » read more

Considerations And Guidelines For Using High-Voltage CoolGaN Switches In Power Systems


The design of an electronic switched-mode power system has always been a complex task, requiring both knowledge and experience. With the appearance of gallium nitride (GaN), this task has even become more complex, because the electrical properties of GaN expand the room for possible system solutions. Particularly the lack of a physical body diode and the lateral device operation enable complete... » read more

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