SoC Power Delivery Network (PDN) Telemetry And Applications


PDN characterization needs visibility at the transistor. Through this white paper, we will learn why PDN visibility is crucial to each stage of the silicon lifecycle and its relation to power, performance, and in-field uptime. Register here to download the paper. » read more

AI Infrastructure: Optimized For Model Training


This white paper discusses the critical infrastructure needed for efficient AI model training, emphasizing the role of network capabilities in handling vast data flows and minimizing delays. It outlines challenges in model training and innovative solutions that can enhance performance. AI Revolution: The increasing complexity of AI applications, such as autonomous vehicles and personalized m... » read more

Mastering AI Chip Complexity: Your Guide to First-Pass Silicon Success


This eBook provides a resource for innovators in the fast-changing realm of AI chip development. It delves into the opportunities and challenges of designing cutting-edge AI chips and chiplets, focusing on the transition from traditional monolithic architectures to multi-die and chiplet-based solutions. The content covers essential topics such as architectural exploration, silicon design, a... » read more

Modernizing The Hardware / Software Interface – Life Beyond Spreadsheets


The hardware/software interface (HSI) is the core of advanced semiconductor design, allowing seamless interaction between software and components like accelerators and peripherals. It underpins critical functions such as documentation, firmware, and hardware verification. Inefficient or outdated HSI management reduces collaboration, increases design errors, and threatens the performance and qua... » read more

Agentic AI, Multi-Block Multi-User SoC Design Platform


The semiconductor industry is at an inflection point within its history. The latest technological advancements in AI, quantum computing, 5G, virtual and augmented reality, IoT, autonomous driving, and biotechnology have revolutionized the semiconductor industry. The growing demands of AI workloads and sophisticated model training are spurring highly specialized semiconductor chips with intricat... » read more

Molybdenum: Transforming Semiconductor Manufacturing For Next-Generation Technologies


One trillion semiconductors produced in a single year. A digital foundation powering AI's explosive growth. The next frontier requires chips that are smaller, faster, and exponentially more powerful. A new white paper from Counterpoint Research  reveals how advanced metallization—specifically molybdenum—is becoming a critical enabler for semiconductor manufacturing in this new era. Th... » read more

New Package Solutions for Automotive Optical Sensors


This article introduces the development of a new optical ball grid array (OBGA) packaging platform designed for automotive applications, with a focus on platform development and compliance with the Automotive Electronics Council (AEC) AEC-Q100 Grade 2 reliability standard. The proposed packaging solution extends beyond traditional cavity OBGA packages, which have been primarily utilized for mic... » read more

Intent Meets Implementation


Power efficiency has become a must-have in today’s ASIC and SoC designs. It’s no longer just about squeezing out more performance. It’s about doing so without draining the battery, wasting energy or overheating the system. Whether the chip is headed for a smartphone, a server rack in an AI datacenter or the control system of an autonomous vehicle, managing power wisely is as critical as m... » read more

MIPI in FPGAs for Mobile-Influenced Devices


A new wave of applications for mobile-influenced devices, using technology initially designed for mobile devices, demand high-resolution, high-frame-rate streaming data from vision sensors, especially with the rise of AI inference models performing real-time scene and object classification. These applications include automotive, home automation displays, medical device displays, survei... » read more

Impact of AI On IP And Chip Design


By Global Semiconductor Alliance (GSA) In conjunction with the Global Semiconductor Alliance's IP Interest group, Expedera explores the impact of AI on intellectual property (IP) and Chip Design, providing comprehensive details and multifaceted data to cover all aspects of the semiconductor industry. It highlights AI growth trends, market predictions, and current silicon chip design innovati... » read more

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