Side Wettable Flanks For Leadless Automotive Packaging


The MicroLeadFrame (MLF)/Quad Flat No-Lead (QFN) packaging solution is extremely popular in the semiconductor industry. It is used in applications ranging from consumer electronics and communications to those requiring high reliability performance, such as the automotive industry. The wide acceptance of this packaging design is primarily due to its flexible form factors, size, scalability and t... » read more

2019-2020 Mask Maker Survey Results


The survey results of the 2019-2020 Mask Maker Survey from the eBeam Initiative. • Multi-Beam and EUV Trends Becoming Visible • 558,834 masks reported by 10 different companies than last year • Masks written with Multi-Beam Mask Writers more than doubled • EUV mask yield reported at 91% • MPC usage increasing at leading edge nodes Click here to see the presentation. » read more

Impact Of EUV Resist Thickness On Local Critical Dimension Uniformities For <30nm CD Via Patterning


This paper describes the impact of extreme ultraviolet (EUV) resist thickness on <30 nm via local critical dimension uniformity (LCDU) measured during after development inspection (ADI) and after etch inspection (AEI). For the same post-etch CD targets, increasing resist thickness from 40 to 60 nm helped reduced CD variability. This work was performed via virtual fabrication using Coventor... » read more

SystemVerilog Constraints


This paper looks at two of the most common issues when constraint solver results do not match your intent: Not understanding how Verilog expression evaluation rules apply to interpret the rules of basic algebra and not understanding the affect probability has on choosing solution values. Coding recommendations for improving your code to get better results are provided. To read more, click here. » read more

Maximizing Ansys LS-DYNA Performance With AMD EPYC 7Fx2 Processors


AMD EPYC 7Fx2 processors bring high frequencies and very highs ratios of cache per core to the 2nd Gen EPYC family of processors. EPYC 7Fx2 processors build on the large memory capacity, extreme memory bandwidth and massive I/O of the 2nd Gen EPYC family to deliver exceptional HPC workload performance. This paper describes the excellent performance of these chips in running Ansys LS-DYNA comput... » read more

IP Security Assurance Standard


This whitepaper is available from the IP Security Assurance (IPSA) Working Group that describes Accellera’s initial proposal to address the industry’s security concerns involving IP integration. Since integrators typically treat IP as a “black box,” vulnerabilities may inadvertently be inserted into an SoC/ASIC. The whitepaper details the objectives of the IPSA standard and its approach... » read more

13-Gb/s Transmitter For Bunch Of Wires Chip-To-Chip Interface Standard


Continuous downscaling of integrated circuits has reached a bottleneck. Technologies such as system in a package, multi-chip module and integration of chips on an active or passive interposer can further improve the system performance. Bunch of wires interface standard was recently introduced for chip to chip short interfaces within a package. This standard required both terminated and untermin... » read more

Security Verification of Rambus’ CryptoManager Root of Trust by Tortuga Logic


The confidentiality and integrity of cryptographic key material is critical to maintaining system security. A hardware root of trust, such as the Rambus CryptoManager Root of Trust, is designed to securely generate, store, and employ cryptographic keys. Tortuga Logic has independently verified the policies surrounding access to keys stored within registers in the CryptoManager Root of Trust usi... » read more

Ambiq YieldHUB Case Study


Ambiq Micro is leading the world in energy-efficient micro-controller (MCU) design, redefining "ultra-low-power" with its unique and proprietary SPOT platform. They began working with us a few years ago when their data started scaling (they now produce thousands of wafers a month!) and they needed an effective yield management system to help them. Senior Product Engineer Jerry Kao shares his fa... » read more

What’s WAT? An Overview Of WAT/PCM Data


Wafer acceptance testing (WAT) also known as process control monitoring (PCM) data is data generated by the fab at the end of manufacturing and generally made available to the fabless customer for every wafer. The data will typically have between forty and one hundred tests, each test having a result for each site (or “drop-in”) on the wafer. The sites are located so that the fab can monito... » read more

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