Addressing The Complex Challenges In Low-Power Design And Verification


This paper provides a comprehensive analysis of various complex debug problems faced in low-power design and verification. By using relevant examples it demonstrates how these issues can be either avoided or easily solved. We will also highlight some of the common pitfalls that low-power designers can avoid, which otherwise can lead to complex low-power issues that are difficult to debug at lat... » read more

Modeling Of The Electrical Performance Of The Power And Ground Supply For A PC Microprocessor On A Card


The electrical characteristics of the power and ground supply of a PC microprocessor packaged in a Ball Grid Array (BGA) package mounted on a card are studied by dynamic electromagnetic field analysis. The effects of decoupling capacitors of different types and at different locations are investigated to achieve the objectives of low power and ground impedance and no or insignificant resonances ... » read more

Exploiting The Java Deserialization Vulnerability


In the security industry, we know that operating on untrusted inputs is a significant area of risk; and for penetration testers and attackers, a frequent source of high-impact issues. Serialization is no exception to this rule, and attacks against serialization schemes are innumerable. Unfortunately, developers enticed by the efficiency and ease of reflection-based and native serialization cont... » read more

System Performance Analysis At ARM


Performance analysis is a vital task in modern SoC design. An under-designed SoC may run too slowly to keep up with the demands of the system. An over- designed SoC will consume too much power and require more expensive IP blocks. At ARM we want to help our partners build SoCs that deliver the best performance within their power and area budgets. The simple truth is that this is more difficu... » read more

Electrification: Achieving Next-Level Performance


Engineered electrical systems for energy production, distribution and consumption are incredibly complex — and becoming even more sophisticated as their functionality increases. Dramatically improving the efficiency of these systems means relying on engineering simulation to introduce extreme innovation, quickly and cost-effectively. To read more, click here. » read more

Fine-Pitch Copper Pillar With Bond On Lead (BOL).


Fine pitch copper (Cu) pillar bump adoption has been growing in high-performance and low-cost flip chip packages. Higher input/output (I/O) density and very fine pitch requirements are driving very small feature sizes such as small bump on a narrow pad or bond-on-lead (BOL) interconnection, while higher performance requirements are driving increased current densities. Assembling such packages u... » read more

Design Challenges Of Next-Generation AESA Radar


Phased-array antennas, first used in military radar systems, are gaining in popularity for a variety of applications with new active electronically-scanned arrays (AESAs) being used for radar systems in satellites and unmanned aerial vehicles. As these systems are deployed, meeting size and performance requirements are critical. To support AESA radar development efforts, electronic design autom... » read more

Astronics Test Systems And Tabor Electronics End Obsolescence For NAVAIR


Obsolescence. This is not a favorite word for most end users. Flexibility, options, extended product life – those words bring relief to the testing environments of end users. Yet, nonetheless, obsolescence is a factor that must be faced within the testing industry. When the US Naval Air Systems Command (NAVAIR) faced obsolescence with a major Test & Measurement OEM, they turned to Astr... » read more

Solving The Design And Verification Challenges Of High Density Advanced Packaging


This paper discusses ways in which design teams can apply silicon (IC) type processes to the design and verification of the emerging HDAP packages. High Density Advanced Packaging, or HDAP, is the next-generation architecture for increased functional density, higher performance, lower power, smaller PCB footprints, and thinner profiles. This new “breed” of disruptive packaging technology... » read more

Finally, A Painless Solution For Analog Verification Management


Usually, teams manage analog simulations manually or they use complex and expensive tools that require intricate setup and proprietary test plans before they can be deployed. What teams need is an easy way to manage analog verification in order to track the large number of simulations for each project. Tracking simulation results at all levels for each team member and project managers requires ... » read more

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