category: Whitepapers

category: IoT, Security & Automotive

Using Built-In Self-Test Hardware To Satisfy ISO 26262 Safety Requirements
By Mentor, a Siemens Business - 30 Jun, 2020 - Comments: 0

The promise of autonomous vehicles is driving profound changes in the design and testing of automotive semiconductor parts. The ICs for safety-critical applications need to meet the ISO 26262 standard for functional safety. Among the challenges in the design flow has been aligning the metrics for design-for-test and for functional safety. This paper describes using logic built-in-self-test as b... » read more

Designing An Efficient And Low-Noise Power Supply For Sensors And Encoders
By Maxim Integrated - 30 Jun, 2020 - Comments: 0

Smart, accurate sensors and encoders are bringing new levels of intelligence to automated industrial equipment. Indeed, the smart factory is being realized across a variety of manufacturing landscapes, enhancing productivity and efficiency. Enabling these compact sensors and encoders to perform reliably requires a high level of power efficiency. This paper discusses why conventional power manag... » read more

Detecting And Preventing Automotive Hardware Security Vulnerabilities
By Tortuga Logic - 30 Jun, 2020 - Comments: 0

In this new whitepaper, you will learn: How to detect and prevent hardware security vulnerabilities in automotive applications with Tortuga Logic’s Radix See how using Radix, as part of your Automotive Security Development Lifecycle, automates and enables a security signoff methodology Click here to read white paper. » read more

Managing Web Application Security With Coverity
By Synopsys - 30 Jun, 2020 - Comments: 0

While security practitioners can and should play an active role in web application security, only developers are familiar enough with the code to fix software vulnerabilities. For this reason, security teams can most effectively prevent software vulnerabilities from entering production by equipping their development teams with the tools to fix security issues as they’re building applications.... » read more

EDA In The Cloud — Why Now?
By Mentor, a Siemens Business - 24 Jun, 2020 - Comments: 0

What is the value of cloud computing to my company? Learn how the cloud became a viable option for IC verification, and explore the ways your company can best use cloud resources to expand your compute options for both established nodes and leading-edge technologies. To read more, click here. » read more

Rising To Meet The Thermal Challenge
By Cadence - 24 Jun, 2020 - Comments: 0

Thermal effects on electrical performance have always existed; processor speed limits are set by thermal limits, and power has been a key concern for the mobile and datacenter markets for a decade. Increased electrical content logically generates more heat, which affects system performance. For example, in the automotive market, ADAS and infotainment systems are drastically increasing automotiv... » read more

Eliminate Silicon Respins With Netlist CDC Verification
By Synopsys - 24 Jun, 2020 - Comments: 0

Clock domain crossing (CDC) verification has been an integral part of modern chip design flow for quite sometime. Traditionally CDC verification has been done during the RTL stage. However, for advanced designs and complex flows, there is significant logic optimization during RTL synthesis as well as backend flows at the netlist stage. This mandates clock domain crossing verification a must for... » read more

A Benchmark Study Of Complementary-Field Effect Transistor (CFET) Process Integration Options: Comparing Bulk vs. SOI vs. DSOI Starting Substrates
By Coventor - 17 Jun, 2020 - Comments: 0

Sub-5 nm logic nodes will require an extremely high level of innovation to overcome the inherent real-estate limitations at this increased device density. One approach to increasing device density is to look at the vertical device dimension (z-direction), and stack devices on top of each other instead of conventionally side-by-side. The fabrication of a Complementary-Field Effect Transistor (CF... » read more

SEMI 3D1 – Terminology For Through Silicon via Geometrical Metrology
By SEMI - 17 Jun, 2020 - Comments: 0

Clear and commonly accepted definitions are needed for efficient communication and to prevent misunderstanding between buyers and vendors of metrology equipment and manufacturing services. The purpose of this document is to provide a consistent terminology for the understanding and discussion of metrology issues important to through silicon vias (TSV). Click here to read more, fee for access. » read more

RF And Microwave Solid-State Power Amplifiers Design Is A Speciality
By Wolfspeed, a Cree Company - 17 Jun, 2020 - Comments: 1

In the world of RF and microwave engineering, the design and development of solid-state amplifiers is a specialty. It has always required many years of specialized engineering experience and a suitable collection of test and measurement equipment. While these will always be necessary, to be successful in the marketplace today, it is also essential to use a combination of specialized and general... » read more

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