Body Biasing For Analog Design


This paper presents the practical application of body biasing control of ultra-deep submicron FD-SOI technologies for analog and mixed-signal designs. The body biasing control is dedicated for dynamic control of the trade- off between speed vs. power consumption for advanced digital circuits. However, in this work we focus on trading-off and improvement of analog circuit performances. Three dif... » read more

The Implementation Of Embedded PVT Monitoring Subsystems In Today’s Cutting Edge Technologies


This new whitepaper from Moortec takes a comprehensive look at the Implementation of Embedded PVT Monitoring Subsystems in Today’s Cutting Edge Technologies and how this can benefit today’s advanced node semiconductor design engineers by improving the performance and reliability of SoC designs. With advances in CMOS technology, and the scaling of transistor channel lengths to nanometer (nm)... » read more

Co-modeling: A Powerful Capability For Hardware Emulation


Understanding co-modeling technology, its impact on verification and validation should be a critical aim for anyone selecting and deploying emulation co-modeling resources. This paper explores how emulation co-modeling — specifically for the Veloce Strato emulation platform from Mentor, a Siemens business — is architected to meet the needs of advanced verification and validation. To rea... » read more

Enabling Synchronized Hardware Software Debug With Verdi


Verdi HW SW Debug is an instruction-accurate embedded processor debug solution that offers fully synchronized views between hardware, as RTL or gate-level design models, and software, as C or assembly code enabling co-debug between RTL and software. To read more, click here. » read more

CAE Turns To HPC


How ANSYS is addressing the value of HPC technology within the CAE market, the main challenges to the use or uptake of HPC resources, and the future for HPC in CAE. The paper also briefly describes ANSYS Discovery Live — a new design tool that takes advantage of thousands of cores available in a GPU to produce instantaneous simulation results with every interactive change to the model. Discov... » read more

Reliability Of Embedded Wafer-Level BGA For Automotive Radar Applications


With shrinking of chip sizes, Wafer Level Chip Scale Packaging (WLCSP) becomes an attractive and holistic packaging solutions with various advantages in comparison to conventional packages, such as Ball Grid Array (BGA) with flipchip or wirebonding. With the advancement of various fan-out (FO) WLPs, it has been proven to be a more optimal, low cost, integrated and reliable solution compared to ... » read more

Securing Your Test System


Test systems, like other industrial equipment, are vulnerable to cyber attacks. That requires a phased approach to cyber security, addressing the most likely threats first and communicating with suppliers to understand threats upstream in the supply chain. To read more, click here. » read more

On-Chip Clock And Process Monitoring Using STAR Hierarchical System’s Measurement Unit


Functional safety is one of the most critical priorities for system-on-chips (SoCs) that are involved in automotive, aerospace and industrial applications. These requirements are driven by standards such as ISO 26262 and are the backbone of the design and testing of automotive ICs. Synopsys’ STAR Hierarchical System’s Measurement Unit helps ensure the accuracy of on-chip clock frequency and... » read more

Preventing IoT Edge Device Vulnerabilities


As an EDA toolchain provider, Mentor keeps a close eye on security issues that occur in the world of electronics. We see volumes of research centered on protecting complex SoCs from attacks and interesting studies about detecting malicious logic in these ICs. But, security issues around IoT edge devices are rarely mentioned in the literature. However, the projected billions of IoT edge devices ... » read more

Securing The Industrial Internet Of Things


Objects, sensors, actuators and controllers that were once designed for stand-alone operation are now increasingly connected by means of intelligent software and networks – forming the basis of the Industrial Internet of Things (IIoT). To be sure, GE defines the IIoT as “a network of a multitude of devices connected by communications technologies that results in systems that can monitor, co... » read more

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