Selecting A Portable Stimulus Application Focal Point


The "axes of reuse" are a powerful way to identify a focal point for your application of Portable Stimulus. Picking a focal point helps to identify needed resources and identify the gap between what is needed and what already exists in your organization. Picking an initial focal point for applying Portable Stimulus doesn’t preclude expanding the application of Portable Stimulus in the future.... » read more

Crossover To Memory Expansion With Adesto EcoXiP and NXP’s i.MX RT Crossover Processors


The ‘Crossover Processor’ integrates attributes of a microprocessor such as higher CPU speeds, multimedia interfaces and expandable memory into a microcontroller form factor built for cost effectiveness and fastest development time. This new crossover processor class of device provides embedded developers the ability to solve many problems in today’s fast-moving technology markets. To ... » read more

Machine Learning On Arm Cortex-M Microcontrollers


Machine learning (ML) algorithms are moving to the IoT edge due to various considerations such as latency, power consumption, cost, network bandwidth, reliability, privacy and security. Hence, there is an increasing interest in developing Neural Network (NN) solutions to deploy them on low-power edge devices such as the Arm Cortex-M microcontroller systems. CMSIS-NN is an open-source library of... » read more

End-To-End Cell–Pack–System Solution: Rechargeable Lithium-Ion Battery


Industry has become more interested in developing optimal energy storage systems as a result of increasing gasoline prices and environmental concerns. A major application for energy storage use is hybrid electric vehicles (HEVs) and electric vehicles (EVs). The rechargeable energy storage system is a key design issue, as it dominates overall vehicle performance. The system as a whole must deliv... » read more

FPGA Implementation Tools


Advances in design and manufacturing technology allow increased factory automation, where tasks are automatically performed by sophisticated equipment such as industrial robots. Manufacturing processes require fail-safe mechanisms to prevent human injury or costly downtime. With increasing sophistication and automation of the manufacturing processes, there is increasing need for error detection... » read more

Next-Generation Vehicles Pose Automotive Semiconductor Test Challenges


Various market trends are driving requirements for automotive semiconductor test as technology increasingly defines the future of the automobile. According to IHS Markit, the total market for semiconductors, having reached nearly $500 billion in 2018, will grow at a CAGR of 4.88% through 2022, while the automotive electronics category, reaching more than $40 billion in 2018, will outpace the to... » read more

Hidden Soldier Joints Inspection: 4 Case Studies


IC packaging technologies are becoming smaller and thinner. Ball grid array (BGA) packages were introduced some years ago in order to save space on the PCB, and are now widely used. To overcome the resulting problems with using optical microscopy as an inspection tool, the endoscope found its way into quality engineering departments. To read more, click here. » read more

Best Practices For Saving Measurement Data


You collect data to make decisions. However, an inefficient file format may cause problems when analyzing your data. The key to choosing a file format for your application involves thinking about the current system requirements and how the file can adapt for future application needs. To help you organize your file format for your application, use the guide and checklist of questions: • Ho... » read more

Meeting ISO 26262 Requirements Using Tessent IC Test Solutions


As the industry moves towards greater automation in vehicles, suppliers of the ICs used to drive the automotive electronic systems are rapidly adopting solutions to meet ISO 26262 requirements. The Tessent family of IC test products offers the highest defect coverage, in-system non-destructive memory test, hybrid ATPG/Logic BIST, and analog test coverage measurement. These technologies add up t... » read more

112G XSR And LR SerDes PHYs


The virtuous cycle of increased computing power enabling new applications which demand more computing power continues unabated. Today, applications spanning AI, autonomous vehicles, video streaming, AR and VR all demand more bandwidth, lower latencies and higher speeds. In response, the SoCs powering the terabit routers and switches at the heart of the network must run even faster. The upgrade ... » read more

← Older posts