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A Guide To Fast Optimal Solutions To Complex Problems For Quantum Computers


Most people have already heard the term “quantum computer.” There has been a lot of interest in quantum computers over the last few years, with great expectations that they will dramatically change the world soon. These days, we use computers all the time in our daily lives. Personal computers and smartphones are obvious computers, but there are many more computers hidden in plain sight aro... » read more

Wafer Level Void-Free Molded Underfill For High-Density Fan-out Packages


In this study, experiments and mold flow simulation results are presented for a void-free wafer level molded underfill (WLMUF) process with High-Density Fan-Out (HDFO) test vehicles using a wafer-level compression molding process. The redistribution layer (RDL)-first technology was applied with 3 layers of a fine-pitch RDL structure. The test samples comprised 11.5 x 12.5-mm2 die with tall copp... » read more

Study Of Bondable Laser Release Material Using 355nm Energy To Facilitate RDL-First And Die-First Fan-Out Wafer-Level Packaging (FOWLP)


A thorough evaluation on selecting a bondable laser release material for redistribution layer (RDL)-first and die-first fan-out wafer-level packaging (FOWLP) is presented in this article. Four laser release materials were identified based on their absorption coefficient at 355 nm. In addition, all four of these materials possess thermal stability above 350 °C and pull-off adhesion on a Ti/Cu l... » read more

NVMe-oF: Simple, Invisible Fabric For Distributed Storage Networks


In today’s fast paced world, we need seamless access to huge chunks of data and new-world technologies, such as artificial intelligence (AI), machine learning (ML), cloud computing, and real-time data analytics. AI researchers are deriving applications such as cyber security analysis and intelligent virtual assistants (IVA) where the computer needs to process an intense amount of data. Theref... » read more

Every Walk’s A Hit: Making Page Walks Single-Access Cache Hits


As memory capacity has outstripped TLB coverage, large data applications suffer from frequent page table walks. We investigate two complementary techniques for addressing this cost: reducing the number of accesses required and reducing the latency of each access. The first approach is accomplished by opportunistically "flattening" the page table: merging two levels of traditional 4 KB p... » read more

Building High Voltage Automotive Battery Management Systems


To ensure safety, performance and accuracy over the full system lifetime, it is essential to choose the right BMS components. This can also maximize the range and lifetime obtainable from the Li-ion battery, which is a vital differentiator for carmakers. The paper gives a general introduction to Li-ion batteries and BMS, before presenting Infineon’s products and system approach towards offer... » read more

State-Space Model Of An Electro-Mechanical-Acoustic Contactless Energy Transfer System Based On Multiphysics Networks


Contactless energy transfer systems are mainly divided into acoustic, inductive, capacitive and optical, in which main applications are related to biomedical, wireless chargers and sensors in metal enclosures. When solids are used as transfer media, ultrasound transducers based on piezoelectricity can be used for through-wall power transfer, which can be named as electro-mechanical-acoustic con... » read more

How To Create A Physics-Based Laser Compact Model For A Photonic Process Design Kit (PDK)


This paper discusses the importance of accurate laser compact models in photonic process design kits, describes different laser models available in Ansys Lumerical INTERCONNECT, and explains optimal steps to create a laser compact model that includes temperature and noise effects. Click here to access the paper. » read more

Automotive Safety Island


The promise of autonomous vehicles is driving profound changes in the design and testing of automotive semiconductor parts. Automotive ICs, once deployed for simple functions like controlling windows, are now performing complex functions related to advanced driver-assist systems (ADAS) and autonomous driving applications. The processing power required results in very large and complex ICs that ... » read more

A Holistic Approach To Energy-Efficient System-On-Chip (SoC) Design


It takes a great deal of energy to power the modern world, and demand grows every day. This is especially true for electronics, where ever increasing automation and more intelligent devices incessantly demand more power. Many applications that use chips face a variety of pressures for reduced power consumption and better energy efficiency. In response, the semiconductor and electronic design au... » read more

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