What Does Shift Left With Calibre Mean For IC Designers

Driven by the world’s seemingly insatiable demand for electronics that constantly do more faster, integrated circuit (IC) design companies are continuously seeking ways to profitably deliver products with more functionality, reliability, and performance while reducing time-to-market. To accomplish this, a well-planned shift left strategy can free up critical time and resources in delivery sch... » read more

Exploring The 6G Spectrum Landscape

In each generation of cellular communications, new spectrum has been key to delivering more services, more capacity, and higher data throughput to end users. 5G benefited from large contiguous bandwidths of millimeter-wave (mmWave) spectrum, known as frequency range 2 (FR2). And 5G benefited from the reallocation and unlocking of midband spectrum (3.4 to 4.9 GHz) with its more favorable propaga... » read more

Universal Verification Methodology Coverage For Bluespec RISC-V Cores

Attempting to achieve complete RISC-V verification requires multiple methodologies, one of which is coverage driven simulation based on UVM constrained random methods and complaint with the Universal Verification Methodology (UVM) standard. This whitepaper explains the basics of UVM functional coverage for RISC-V cores using the Google RISCV-DV open-source project, Synopsys verification solu... » read more

Unleashing The Power Of Generative AI In Chip, System, And Product Design

The field of chip, system, and product design is a complex landscape, fraught with challenges that designers grapple with daily. The traditional design process, while robust, often falls short in addressing the increasing demands for efficiency, customization, and innovation. This white paper delves into these challenges, exploring the transformative potential of generative artificial int... » read more

Reliability Performance Of S-Connect Module (Bridge Technology) For Heterogeneous Integration Packaging

Bridge technology is a promising heterogeneous integration (HI) solution for application-specific integrated circuits (ASICs) and high bandwidth memory (HBM). The bridge dies provide localized communications among the multiple system on chips (SoCs) in a single package. In Amkor's bridge technology, S-Connect provides die-to-die connections with fine pitch [1]. Prototype S-Connect technology wa... » read more

Functionalized Carbon Nanotubes Enabled Flexible And Scalable CO2 Sensors

This work, we have demonstrated a low-cost and effective chemiresistive CO2 sensor based on a composite of functionalized carbon nanotubes (f-CNTs) with polyethyleneimine (PEI). The resulting sensor shows excellent selectivity and sensitivity, which can respond to the CO2 concentration in a wide range of 300 - 5000 ppm. The effects of ink dilution and humidity from the environment on the sen... » read more

Electro-Thermal Design Breakthrough

Electronic component manufacturers have traditionally provided models in SPICE format, so customers can simulate their application circuits and better understand the features, capabilities, and interactions of those parts in the system context. Now, with BCI ROM, a similar and parallel thermal model supply chain can develop. This technology breakthrough arrives at a time of component design-in ... » read more

Understanding UVM Coverage For RISC-V Processor Designs

Attempting to achieve complete RISC-V verification requires multiple methodologies employing a wide range of relevant tools, including: • Coverage driven simulation based on UVM constrained random methods and compliant with the Universal Verification Methodology (UVM) standard • Static and formal property verification • Equivalence checking • Emulation and FPGA based verific... » read more

The Ansys Charge Plus PiC Solve

All surfaces are exposed to radiation, whether aircraft fuselages, satellite skins, or solar panels, are subjected to ionization effects through the accumulation of charged plasmas. Such plasmas present critical hazards to these platforms as their sudden nonlinear discharges can damage or destroy surfaces and underlying electronic components. Through the Particle-in-Cell solver, Ansys Charge Pl... » read more

Arm Total Compute: Engineering For Tomorrow’s Workload

As consumers seek richer and more immersive experiences from their devices, the way compute systems are engineered must continually evolve to keep up. Arm Total Compute takes a solution-focused approach to system-on-chip design, moving beyond individual IP elements to design and optimize the system as a whole to enable more digital immersion experiences. Not only does this white paper dis... » read more

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