category: Whitepapers

category: IoT, Security & Automotive

Placement And CTS Techniques For High-Performance Computing Designs
By Siemens EDA - 09 Nov, 2023 - Comments: 0

This paper discusses the challenges of designing high-performance computing (HPC) integrated circuits (ICs) to achieve maximum performance. The design process for HPC ICs has become more complex with each new process technology, requiring new architectures and transistors. We highlight how the Siemens Aprisa digital implementation solution can solve placement and clock tree challenges in HPC de... » read more

Placement And CTS Techniques For High-Performance Computing Designs
By Siemens EDA - 09 Nov, 2023 - Comments: 0

This paper discusses the challenges of designing high-performance computing (HPC) integrated circuits (ICs) to achieve maximum performance. The design process for HPC ICs has become more complex with each new process technology, requiring new architectures and transistors. We highlight how the Siemens Aprisa digital implementation solution can solve placement and clock tree challenges in HPC de... » read more

3D Heterogenous Integration: Design And Verification Challenges
By Ansys - 08 Nov, 2023 - Comments: 0

Next-generation semiconductor products increasingly rely on vertical integration technologies to drive system density, speed, and yield improvement. Due to the increased coupling effects across multiple physics, co-simulation and co-analysis of these phenomena are critical for a robust chip-package-system design. Advanced 2.5D/3D-IC systems are constructed with multiple dice, interposers, packa... » read more

Vision Transformers Change The AI Acceleration Rules
By Quadric.io - 08 Nov, 2023 - Comments: 0

Transformers were first introduced by the team at Google Brain in 2017 in their paper, "Attention is All You Need". Since their introduction, transformers have inspired a flurry of investment and research which have produced some of the most impactful model architectures and AI products to-date, including ChatGPT which is an acronym for Chat Generative Pre-trained Transformer. Transformers a... » read more

Thermal Warpage Simulation Of A Temperature-Dependent Linear Elastic Material Package
By Cadence - 08 Nov, 2023 - Comments: 0

The shift to advanced packaging in 3D and 2.5D IC design is making the numerical analysis of thermal warpage in electronic devices a crucial part of the design process. A reliable numerical tool enables the designer to perform early design analysis that accurately predicts warpage, thereby shortening the design process. The Cadence Celsius Thermal Solver integrated within the Cadence IC, pac... » read more

Automated Constraint Management For Faster Designer Productivity
By Synopsys - 07 Nov, 2023 - Comments: 0

Constraints management helps shorten the designer’s manual constraints transformation effort across the design cycle with automated constraints management flows. The management of constraints refers to tasks that are not associated with verifying the correctness of constraints, nor associated with the generation of constraints, but with the transformation of constraints from one form to anoth... » read more

X-ray And Acoustic Inspection
By Nordson Test And Inspection - 07 Nov, 2023 - Comments: 0

X-ray and acoustic imaging are two very complimentary tools for non destructively inspecting the quality of electronics components. Both techniques give information on different aspects of component integrity. Click here to read more of this application note from Nordson's Test and Inspection division.   » read more

Automotive Safety Island
By Siemens EDA - 02 Nov, 2023 - Comments: 0

The promise of autonomous vehicles is driving profound changes in the design and testing of automotive semiconductor parts. Automotive ICs, once deployed for simple functions like controlling windows, are now performing complex functions related to advanced driver-assist systems (ADAS) and autonomous driving applications. The processing power required results in very large and complex ICs that ... » read more

Flexible Temperature Measurement with the ZSSC3241 Enables Bridge as Temperature Sensor
By Renesas - 02 Nov, 2023 - Comments: 0

Accurate measurement using sensor elements requires precise and local measurement of the element’s temperature for correction and compensation across a wide operating range. Thus, an integral part of Sensor Signal Conditioner (SSC) functionality is to provide at least one or more methods to measure temperature of the sensor element, which is typically a resistive bridge or capacitive transduc... » read more

2023 Open Source Security And Risk Analysis Report
By Synopsys - 01 Nov, 2023 - Comments: 0

The annual “Open Source Security and Risk Analysis” (OSSRA) report, now in its 8th edition, examines vulnerabilities and license conflicts found in roughly 1,700 codebases across 17 industries. The report offers recommendations for security, legal, risk, and development teams to better understand the security and risk landscape accompanying open source development and use. Click here to ... » read more

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