Architectural Considerations For Compute-In-Memory In AI Inference


Can Compute-in-Memory (CIM) bring new benefits to AI (Artificial Intelligence) inference? CIM is not an AI solution; rather, it is a memory management solution. CIM could bring advantages to AI processing by speeding up the multiplication operation at the heart of AI model execution. To read more, click here. » read more

A Formal-Based Approach For Efficient RISC-V Processor Verification


The openness of RISC-V allows customizing and extending the architecture and microarchitecture of a RISC-V based core to meet specific requirements. This appetite for more design freedom is also shifting the verification responsibility to a growing community of developers. Processor verification, however, is never easy. The very novelty and flexibility of the new specification results in new fu... » read more

Advanced RISC-V Verification Methodology Projects


The open standard of RISC-V offers developers new freedoms to explore new design flexibilities and enable innovations with optimized processors. As a design moves from concept to implementation new resources are appearing to help with standards for testbenches, verification IP reuse, and coverage analysis. RISC-V offers every SoC team the possibility to design an optimized processor, but this a... » read more

Improving Network Security Threat Detection


Collecting security-related information is one thing. Getting the most benefit from that data is another. Security analysts get lots of alerts from their security tools. This forces them to prioritize the ones that will get investigated. When additional context is added to the security data, it makes it easier to see what traffic needs a closer look. For instance, discovery, forensics, and reme... » read more

Computational Imaging Craves System-Level Design And Simulation Tools To Leverage Disruptive AI In Embedded Vision


Image quality now relies more than ever on high computing power tied to miniaturized optics and sensors, rather than on standalone and bulky but aberration-free optics. This new trend is called computational imaging and can be used either for computational photography or for computer vision. Read this white paper to learn about market trends and promising system co-design and co-optimization ap... » read more

Celsius EC Solver


The Cadence Celsius EC Solver is electronics cooling simulation software for accurate and fast analysis of the thermal performance of electronic systems. It enables electronic system designers to accurately address the most challenging thermal/electronics cooling issues today. The Celsius EC Solver utilizes a powerful computational engine and meshing technology that enables designers to model a... » read more

Smallest Thinnest Power Modules For Data Center Optical Modules


Data transmission rates in optical communication field are on a constant rise. This paper describes the ever-increasing demand for highly integrated, small form factor, low profile yet thermally superior and electrically efficient power supply solution to support these high data rates and large amount of data transfer. It then follows to highlight Renesas’s best in class mini power mo... » read more

Achieving Consistent RTL Power Accuracy


Are you struggling to accurately estimate RTL power consumption early in your design process? RTL power estimation can be inaccurate due to the complexity of the designs, the various power domains, and the use of multiple tools in the design process. Designers can make effective power-performance-area tradeoffs early by using a holistic methodology that includes both architectural and micro-arc... » read more

Breaking The 1M RAID5 Write IOPS Barrier


In today’s data-centric age, enormous amounts of data are generated, stored and processed at an unprecedented rate. Businesses are utilizing this data to make better decisions, drive greater efficiencies, develop more desirable products, improve profitability and ultimately increase user satisfaction. To continue deriving a high degree of value from a rapidly-expanding data flow, today’s en... » read more

Photonic Debond: Scalability And Advancements


Advanced packaging technology has continuously evolved over the past 10-20 years to become a major driving force in improving integrated circuit (IC) performance. This improvement in IC performance is assisted by the ability to place specialized components near each other for shorter interconnects in the IC packages. Temporary bond and debond (TB/DB) is an enabling technique for this work. TB/D... » read more

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