Revising 5G RF Calibration Procedures For RF IC Production Testing


Modern radio frequency (RF) components introduce many challenges to outsourced semiconductor assembly and test (OSAT) suppliers whose objective is to ensure products are assembled and tested to meet the product test specifications. The growing advancement and demand for RF products for cellphones, navigational instruments, global positioning systems, Wi-Fi, receiver/transmitter (Rx/Tx) componen... » read more

High-Temperature Stable Spin-On Carbon Materials For Advanced Pattern Transfer Applications


In recent years a strong demand has arisen for spin-on carbon (SOC) materials compatible with high-temperature processes. This requirement is to enable usage of high-temperature SOC (HTSOC) materials in integration schemes utilizing chemical vapor deposition (CVD) and/or atomic layer deposition (ALD) processes. In addition to compatibility with the high-temperature deposition processes, planari... » read more

Ultra-Low Resonance Frequency MEMS Gravimeter With Off-Resonance Closed-Loop Control


This paper reports on a MEMS gravimeter that has a closed-loop system to maintain an ultra-low resonance frequency of 1Hz. The low resonance frequency is attained by using a spring that is the resultant of positive mechanical stiffnesses and negative electrical stiffnesses. Voltage-tunability of the electrical stiffness enables ultra-small and tunable total stiffness. To attain a quick response... » read more

How New Storage Technologies Enhance HPC Systems


High-performance computing (HPC) has historically been available primarily to governments, research institutions, and a few very large corporations for modeling, simulation, and forecasting applications. As HPC platforms are being deployed in the cloud for shared services, high-performance computing is becoming much more accessible, and its use is benefiting organizations of all sizes. Increasi... » read more

Machine Learning-Based Optimization Of Chiral Photonic Nanostructures: Evolution- And Neural Network-Based Design


Chiral photonics opens new pathways to manipulate light-matter interactions and tailor the optical response of metasurfaces and -materials by nanostructuring nontrivial patterns. Chirality of matter, such as that of molecules, and light, which in the simplest case is given by the handedness of circular polarization, have attracted much attention for applications in chemistry, nanophotonics and ... » read more

Realizing Your Product Potential Through Pervasive Simulation And Advanced Manufacturing Processes


Global demand for resources has inevitably led to scarcity. The use of resources also generates significant levels of pollution and waste that are difficult to manage. With an ever-growing focus on sustainability, efficiency, and cost savings, the economy is changing. Consumers are demanding products that are made responsibly and optimized for energy efficiency. Many businesses are looking for ... » read more

Silicon Lifecycle Management: Actionable Silicon Insights Through Intelligent Measurement And Analysis


Semiconductors have always been challenging to develop, with many waves of innovation in electronic design automation (EDA) tools and fabrication technologies barely keeping ahead of ever-growing design size and sophistication. Once again, the industry has reached a tipping point. The combination of increasing chip and system complexity, coupled with higher expectations for product performance ... » read more

Atomic Force Microscopy Covers The Landscape Of Polymer Characterization


"Materials scientists designing a polymer-based material for a specific application must analyze how and why all these factors come together to impact the final product. Understanding the structure and properties at the microscopic level is critical to a complete understanding of the material. “Everybody wants to make their materials perform better at the macroscale,” says Bede Pittenger, a... » read more

New Method For BEOL Overlay And Process Margin Characterization


This paper presents a new method, design for inspection (DFI) to characterize overlay. Using design-assisted voltage contrast measurement, the method enables in-line test and monitoring of process induced OVL and CD variation of backend-of line (BEOL) features with litho-etch-lithoetch (LELE) patterning. While only some of the features of multi-color patterning scheme are chosen to be aligned d... » read more

Measurement Of Deep Trenches To Study The RIE Lag Effect


The demand for accurate characterization of high aspect ratio geometries such as narrow gaps, deep trenches or deep holes arises in many technologies and industries. A variety of metrology techniques have been utilized to accommodate these needs. Among the candidates for this type of metrology, 3D optical profiling characterization is becoming more and more prevalent in process control. Due to ... » read more

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