category: Whitepapers

category: IoT, Security & Automotive

Comparing And Spotting The Difference Between Two Simulations
By Vtool - 26 Jan, 2022 - Comments: 0

Comparing is a basic skill we all use in our daily lives in order to understand reality and analyze situations. When it comes to chip verification, the fundamental task of checking also involves comparing because checking is always "checking vs. something" — the ASIC specification and/or a model. In practice, when we encounter a failing test, oftentimes we have a comparable passing tes... » read more

Leveraging Multi-Protocol PHY For PCIe To Cope With SoC Design Complexity
By Cadence - 26 Jan, 2022 - Comments: 0

Now in the post-Moore’s Law era, the fast-evolving semiconductor market is continually geared toward higher performance and feature-rich integrated chip (IC) solutions. More functional design blocks integrated with growing interconnections—to not only increase the overall throughput but also expand the I/O connectivity—resulted in a more powerful system on chip (SoC). This increasing comp... » read more

6G: Going Beyond 100 Gbps To 1 Tbps
By Keysight - 26 Jan, 2022 - Comments: 0

6G research is in its very early stages. The vision for what the International Telecommunication Union calls Network 2030 continues to take shape. While the industry is years away from starting the standards development process, subterahertz (sub-THz) territory is a focus of active research. Getting to 100 gigabits per second (Gbps) to 1 terabit per second (Tbps) data throughput is a key obj... » read more

Metal Thermal Interface Material For The Next Generation FCBGA
By Amkor - 19 Jan, 2022 - Comments: 0

Thermal interface materials (TIMs) have been widely adopted for improved thermal dissipation in flip chip ball grid array (FCBGA), flip chip lidded ball grid array (FCLGA) and flip chip pin grid array (FCPGA) packaging. As the next generation devices' requirements for power get even higher, enhanced thermal performance at the package level is increasingly important. A typical TIM applies a poly... » read more

Accelerating Software Development With Fast Virtual Prototypes
By Synopsys - 12 Jan, 2022 - Comments: 0

Most of today's largest semiconductor devices are highly complex system on chip (SoC) designs, which means that they include one or more embedded processors. This indicates that software provides some of the key functionality of the chip. The system cannot be fully verified or validated without both hardware and software. However, software development generally takes more time and resources to ... » read more

Components And Tools for Functional Safety Applications
By Arm - 12 Jan, 2022 - Comments: 0

Functional safety is important across a variety of markets, including the automotive, industrial, medical, and railway sectors, and often prevalent in consumer electronics. However, the complexity of the embedded software required for functional safety is growing and security issues are rising due to connectivity requirements. This can result the failure of a safety-critical system and lead to ... » read more

High-Tech: Innovation At The Speed of Light
By Ansys - 12 Jan, 2022 - Comments: 0

As connectivity, digitalization, and autonomy proliferate, the boundaries between industries are blurring at an unprecedented pace. Promising to unleash $3TN in global technology market spending, the new competitive battleground is to be found where the system electronics and semiconductor worlds collide: The 3D Integrated Circuit System-on-a-Chip. Winning demands a new design paradigm that ... » read more

AI Goes Ultra Low Power — Part 1
By Fraunhofer IIS/EAS - 12 Jan, 2022 - Comments: 0

Based on the concept of the new Federal Agency for Jump Innovations (PSRIN-D), the BMBF initiated three pilot innovation competitions. One of them presented the participants with the task of developing the most energy-efficient AI system possible as a hardware implementation on an ASIC or FPGA. With this, a stack of hundreds of two-minute long ECG signals should be analyzed with a minimum of en... » read more

HyperRAM As A Low Pin-Count Expansion Memory For Embedded Systems
By Infineon - 12 Jan, 2022 - Comments: 0

Rapid advances in microelectronics are driving mega trends across industries, creating a need for new technologies and optimized devices with better performance. With large volumes of data being made available due to the increasing content of electronics in automotive, industrial, smart home and IoT devices, there is a requirement to seamlessly process and render information. Application platfo... » read more

High-Quality Test And Embedded Analytics For Secure Applications
By Siemens EDA - 11 Jan, 2022 - Comments: 0

Designs for secure applications such as smart cards and those used in the defense industry require security to ensure sensitive data is inaccessible to outside agents. This used to be a somewhat niche requirement and the implementation of custom solutions to meet these specific requirements was common. However, with the explosion within the semiconductor industry of automotive and cyber-phys... » read more

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