category: Whitepapers

category: IoT, Security & Automotive

An Advanced Infrastructure To Enable Secure, Cloud-Aware Design And Processed Data EDA Tool Interoperability
By Si2 - 22 Jun, 2021 - Comments: 0

By Rajeev Jain, Kerim Kalafala, and Ramond Rodriguez Significant technology disruptions are on the horizon that will provide massive efficiency gains for EDA tool suppliers and semiconductor companies alike. These disruptions include the application of artificial intelligence and machine learning to enhance supplier tools and optimize user design flows and methodologies, and the ensuing migr... » read more

High Thermal Die-Attach Paste Development For Analog Circuits
By Amkor - 16 Jun, 2021 - Comments: 0

In recent years, various die attach (DA) materials have been developed to cope with the higher power dissipation requirements of semiconductor devices. DA materials based on metals such as solder or sintered silver (Ag) are used for very high heat generating power devices. While they show outstanding thermal performance, the mechanical properties of these materials are less than ideal. This lim... » read more

Process Model Calibration: The Key To Building Predictive And Accurate 3D Process Models
By Coventor - 16 Jun, 2021 - Comments: 0

The semiconductor industry has always faced challenges caused by device scaling, architecture evolution, and process complexity and integration. These challenges are coupled with a need to provide new technology to the market quickly. In the initial stages of semiconductor technology development, innovative process flow schemes must be tested using silicon test wafers. These wafer tests are len... » read more

High-Temperature-Stable, Spin-On Carbon Materials For High-Aspect-Ratio Gap-Fill Applications
By Brewer Science - 16 Jun, 2021 - Comments: 0

Brewer Science, Inc. has developed a class of novel, high-temperature-stable spin-on carbon (SOC)-based materials with excellent processability. These SOCs are cured under mild conditions and have flow properties that enable the fill of high-aspect-ratio vias in a void-free manner. Moreover, this new class of SOCs has remarkable thermal stability and can survive temperatures of up to 550°C wit... » read more

Replacement Gate High-k/Metal Gate nMOSFETs Using A Self-Aligned Halo-Compensated Channel Implant
By UMC - 16 Jun, 2021 - Comments: 0

A device design technique for boosting output resistance (Rout) characteristics of long-channel halo-doped nMOSFETs for replacement gate (RMG) high-k/metal gate (HK/MG) devices is proposed based on numerical simulations. We show that the self-aligned halo-compensated channel implant (HCCI) that is carried out after dummy poly gate removal provides compensation for the conventional halo doping. ... » read more

Primary, Anonymous, or What?
By Siemens EDA - 09 Jun, 2021 - Comments: 0

Top level primary I/Os remain mysterious in the verification world, specifically when you consider UPF-based low power designs. In real silicon, they are usually driven by off-chip supplies; however, verification complications are multifold for RTL and gate level simulations of them. This paper studies the “simulation-impacting” features of design top IOs and the effect of each feature on v... » read more

Accelerate Adoption Of High-Speed, Low-Latency, Cache-Coherent Standards Using Formal Verification
By Cadence - 09 Jun, 2021 - Comments: 0

We continue to see huge growth in data and compute demand, fueled by increased global data traffic with the 5G rollout, the prevalence of streaming services, and expanded artificial intelligence and machine learning (AI/ML) applications. Several new industry-standard specifications have emerged in recent years to define the protocols of the underlying electronic components and IP building block... » read more

Data Center Evolution: Accelerating Computing With PCI Express 5.0
By Rambus - 09 Jun, 2021 - Comments: 0

The PCI Express (PCIe) interface is the critical backbone that moves data at high bandwidth between various compute nodes such as CPUs, GPUs, FPGAs, and workload-specific accelerators. The rise of cloud-based computing and hyperscale data centers, along with high-bandwidth applications like artificial intelligence (AI) and machine learning (ML), have pushed PCIe 4 to its limits. In this white p... » read more

How To Build A Virtual Electromagnetic Test Environment For Aerospace And Automotive Platforms
By Ansys - 09 Jun, 2021 - Comments: 0

To protect the electromagnetic compatibility (EMC) of complex systems like aircraft and automobiles, you need a full electromagnetic (EM) model. A virtual test environment allows you to assess a design and ensure system-level compatibility before physical testing. This process has been proven to save more than $1 million compared to an approach based solely on testing. Learn how to build a v... » read more

A Revolution For Power Conversion Systems — CoolSiC MOSFET
By Infineon - 09 Jun, 2021 - Comments: 0

Silicon carbide (SiC) transistors are increasingly used in power converters, placing high demands on the size, weight and/or efficiency. The outstanding material properties of SiC enable the design of fastswitching unipolar devices as opposed to bipolar IGBT devices. Thus, solutions which have been up to now possible in the low-voltage world only (< 600 V) are now possible at higher voltages... » read more

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