category: Whitepapers

category: IoT, Security & Automotive

A Production-Worthy Fan-Out Solution — ASE FOCoS Chip Last
By ASE - 16 Dec, 2020 - Comments: 0

The 5th Generation (5G) wireless systems popularity will push the package development into a high performance and heterogeneous integration form. For high I/O density and high performance packages, the promising Fan Out Chip on Substrate (FOCoS) provides a solution to match outsourced semiconductor assembly and testing (OSAT) capability. FOCoS is identified the Fan Out (FO) package, which can f... » read more

An Integrated Approach To Power Domain And Clock Domain Crossing Verification
By Mentor, a Siemens Business - 09 Dec, 2020 - Comments: 0

Reducing power consumption is essential for both mobile and data center applications. The challenge is to lower power while minimally impacting performance. The solution has been to partition designs into multiple power domains which allow selectively reducing voltage levels or powering off partitions. Traditional low power verification validates only the functional correctness of power control... » read more

Towards Self-Driving Cars: MIPI D-PHY Enabling Advanced Automotive Applications
By Mixel - 09 Dec, 2020 - Comments: 0

Because both viewing and sensing ADAS applications must handle imaging, sensing, high-speed serial communication, and downstream processing functions, Camera Video Processors (CVPs) are always located at the heart of these systems. As more cameras and sensors are added to the system to aid in increasingly complicated tasks, more integrated CVP solutions are required. Ideally, these CVPs should ... » read more

HPC Appliance Boosts Simulation Performance
By Ansys - 09 Dec, 2020 - Comments: 0

High-performance computing (HPC) resources can provide a substantial boost to simulation, but an HPC cluster can be complex and difficult to manage. By deploying a managed HPC cluster for ARA, the client was able to eliminate internal maintenance and support overhead, while improving productivity and reliability for their Ansys workloads. Click here to read more. » read more

How To Speed Up Large-Scale EM Simulation Of ICs Without Compromising Accuracy
By Cadence - 09 Dec, 2020 - Comments: 0

With growing on-chip radio frequency (RF) content, electromagnetic (EM) simulation of the passives is critical for a variety of reasons — from selecting the right RF design candidates to detecting parasitic coupling that directly impacts performance. Being on-chip, accurate EM analysis requires a tie into the process technology in the form of process design kits (PDKs) as well as a foundry-ce... » read more

Powering The Edge: Driving Optimal Performance With Ethos-N77 Processor
By Arm - 09 Dec, 2020 - Comments: 0

Repurposing a CPU, GPU, or DSP is an easy way to add ML capabilities to an edge device. However, where responsiveness or power efficiency is critical, a dedicated Neural Processing Unit (NPU) may be the best solution. In this paper, we describe how the Arm Ethos-N77 NPU delivers optimal performance. Click here to immediately download the paper. » read more

Change Management With Impact Analysis During Safety-Critical IP And SoC Development
By Synopsys - 07 Dec, 2020 - Comments: 0

Standards like ISO 26262 provide guidance to mitigate safety risks by defining safety analyses requirements and processes. The standard describes Change Management as a way to analyze and control changes in safety-related work products, items, and elements throughout the safety lifecycle. Impact analysis, a part of the Change Management process, is a systematic approach for evaluating changes t... » read more

Transforming Vision Inspection With Machine Learning
By Optimal Plus - 07 Dec, 2020 - Comments: 0

How auto-manufacturers can apply ML & AI algorithms to enhance image analytics on their factory floor and to ensure higher product quality? Discover the next generation visual inspection in our new case study. In this case study , you will learn about: Current limitations of image inspection in the manufacturing industry. The O+ end-to-end solution, which brings machine learning and... » read more

Adaptive Shot Technology To Address Severe Lithography Challenges For Advanced FOPLP
By Onto Innovation - 07 Dec, 2020 - Comments: 0

Fan-out wafer level packaging (FOWLP) is a popular new packaging technology that allows the user to increase I/O in a smaller IC size than fan-in wafer level packaging. Market drivers such as 5G, IoT, mobile and AI will all use this technology. According to Yole Développement’s analysis, the fan-out packaging market size will increase to $3 billion in 2022 from $2.44 hundred million in 2014,... » read more

Systematic Methodology To Solve Reset Challenges In Automotive SoCs
By Mentor, a Siemens Business - 02 Dec, 2020 - Comments: 0

Modern automotive SoCs typically contain multiple asynchronous reset signals to ensure systematic functional recovery from unexpected situations and faults. This complex reset architecture leads to a new set of problems such as possible reset domain crossing (RDC) issues. The conventional clock domain and CDC verification methodologies cannot identify such critical bugs. In this paper, we prese... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy