Chip Industry Technical Paper Roundup: Dec. 23

Memory at extreme temps; CXL to optimize bandwidth; partitioned security monitoring; impact of aging on clock tree design; materials beyond Si; 98 HW security failures; etching on diamond surfaces; dedoping in wafer-scale MoS2 films.

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New technical papers recently added to Semiconductor Engineering’s library:

Technical Paper Research Organizations
Nonvolatile electrochemical memory at 600°C enabled by composition phase separation University of Michigan and Sandia National Labs
Optimizing System Memory Bandwidth with Micron CXL Memory Expansion Modules on Intel Xeon 6 Processors Micron and Intel
Interstellar: Fully Partitioned and Efficient Security Monitoring Hardware Near a Processor Core for Protecting Systems against Attacks on Privileged Software KAIST
The Impact of Asymmetric Transistor Aging on Clock Tree Design Considerations Israel Institute of Technology and The Hebrew University of Jerusalem
Future materials for beyond Si integrated circuits: a Perspective Texas Instruments, AIXTRON SE and imec
Spatially Precise Light-Activated Dedoping in Wafer-Scale MoS2 Films National Renewable Energy Laboratory (NREL) and Renewable & Sustainable Energy Institute
Hardware Security Failure Scenarios: Potential Hardware Weaknesses NIST
The effects of sub-monolayer laser etching on the chemical and electrical properties of the (100) diamond surface Macquarie University and MIT

Find all technical papers here.



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