How an integrated chip–package co-analysis can quickly and accurately model package layout for inclusion in on-chip power integrity simulations.
Ansys RedHawk-CPA is an integrated chip–package co-analysis solution that enables quick and accurate modeling of the package layout for inclusion in on-chip power integrity simulations using Ansys RedHawk. With RedHawk-CPA a designer can perform static IR drop analysis and AC hotspot analysis of the package layout following RedHawk static and dynamic analyses respectively. To ensure a reliable supply of power, and stable voltage levels at the transistor connection points, the entire system power delivery network (PDN) must be optimized and validated, including the impact of package on a chip.
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