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Chip-Package Co-Analysis Using Ansys RedHawk-CPA


Ansys RedHawk-CPA is an integrated chip–package co-analysis solution that enables quick and accurate modeling of the package layout for inclusion in on-chip power integrity simulations using Ansys RedHawk. With RedHawk-CPA a designer can perform static IR drop analysis and AC hotspot analysis of the package layout following RedHawk static and dynamic analyses respectively. To ensure a reliab... » read more

Digital States, Voltage Levels, And Logic Families


Learn about digital states, voltage logic levels, and logic level families for digital signals. This tutorial is part of the Instrument Fundamentals series. To read more, click here. » read more