tag: 16nm

Tech Talk: Multipatterning, Take Two
By Brian Bailey - 31 Mar, 2014 - Comments: 0

Mentor Graphics' David Abercrombie continues with his whiteboard talk about coloring with advanced lithography, including what goes wrong and how to fix it. [youtube vid=HCBtvHCcbf4] » read more

How Much Will That Chip Cost?
By Ed Sperling - 27 Mar, 2014 - Comments: 1

From the most advanced process nodes to the trailing edge of design there is talk about the skyrocketing cost of developing increasingly complex SoCs. At 16/14nm it’s a combination of multi-patterning, multiple power domains and factoring in physical and proximity effects. At older nodes, it’s the shift to more sophisticated versions of the processes and new tools to work within those proce... » read more

One-on-One: Naoya Hayashi
By Mark LaPedus - 20 Mar, 2014 - Comments: 0

Semiconductor Engineering sat down to discuss the current and future challenges in the photomask industry with Naoya Hayashi, research fellow at Dai Nippon Printing (DNP). SE: What are the big challenges for the photomask industry today? Hayashi: There are several challenges. Most of the challenges involve mask complexity. It is also quite difficult to handle the mask data, because it is ... » read more

FinFET Reliability Issues
By Arvind Vel - 13 Mar, 2014 - Comments: 0

The 16nm FinFET node has introduced several new challenges in the IC design community. In addition to the complexity of power-noise and electromigration (EM) verification, thermal reliability has become a major concern for both chip and package designers. With the three-dimensional architecture of FinFET devices, new simulation approaches are being used to model thermal behavior of the die in o... » read more

28nm Powers TSMC Forward (Part Deux)
By Barry Pangrle - 14 Feb, 2014 - Comments: 0

TSMC’s financial results for the 4th Quarter of 2013 and for the full year were announced just a few weeks ago, with TSMC stating it had again achieved record sales and profits. TSMC continues to own the 28nm foundry market. TSMC a year ago stated plans to have 20nm as its next technology node in production in 2014 and it looks to be delivering on this projected claim with the announcement th... » read more

The Bumpy Road To 3D NAND
By Mark LaPedus - 23 Jan, 2014 - Comments: 1

The NAND flash memory market is dynamic, but it’s also sometimes predictable. Suppliers tend to roll out identical NAND flash chips and then scale them to smaller geometries. And NAND chip prices rise and fall, depending on the supply/demand equation at a given point. Going forward, though, the NAND market is expected to become less predictable, if not chaotic, amid a new and major technol... » read more

Executive Viewpoint: Qualcomm On Process Technology
By Mark LaPedus - 23 Jan, 2014 - Comments: 3

Semiconductor Engineering sat down to discuss current and future process technology challenges with Geoffrey Yeap, vice president of technology at Qualcomm. SE: You have pointed out there is a fundamental shift taking place at the 28nm logic node. This is the first node in which mobile chips have been ramped up first within the foundries, ahead of computing-based ICs. Many believe that 28nm ... » read more

Routing Closure Challenges At 28nm And Below
By Jean-Marie Brunet - 03 Jan, 2014 - Comments: 1

As I described in my last article, the gap between router tech files and signoff rule decks at 28 nm and below is generating some serious impacts on tapeout schedules. The mismatch between the router’s simplified tech file and the complex rules that represent the intricate manufacturing requirements at these leading-edge nodes means designs that come from the router “DRC/DFM-clean” will, ... » read more

Industry Restructures Around Cost
By Ed Sperling - 19 Dec, 2013 - Comments: 1

Talk to any semiconductor executive these days about what’s next for their company and you’ll probably encounter the same perspective—cost will drive future design decisions. Dig a little further, however, and you’ll find no consistent strategy for reducing that cost. While the industry has three very viable solutions for improving the power and performance characteristics of SoCs—... » read more

Different Economies Of Scale, And Lots Of Questions
By Ed Sperling - 12 Dec, 2013 - Comments: 0

Being able to shrink features and reach the next node is already an exclusive club. It will become more exclusive at 16/14nm, which is expected to hit volume production in 2015, and even more exclusive still at 10nm. In fact, it may begin to look like a semi-private affair. The argument being presented is that economies of scale will still exist for those companies with pockets deep enough ... » read more

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