Advances In Reconfigurable Intelligent Surfaces Hardware Architectures: Beyond 5G/6G


This technical paper titled "Reconfigurable Intelligent Surfaces for Wireless Communications: Overview of Hardware Designs, Channel Models, and Estimation Techniques" is from researchers at IEEE. The paper's abstract states "we overview and taxonomize the latest advances in RIS [reconfigurable intelligent surfaces] hardware architectures as well as the most recent developments in the modelin... » read more

Risks Rise As Robotic Surgery Goes Mainstream


As robotic-assisted surgery moves into the mainstream, so do concerns about security breaches, latency, and system performance. In the operating room, every second is critical, and technology failures or delays can be life-threatening. Robotic-assisted surgery (RAS) has around for a couple decades, but it is becoming more prevalent and significantly more complex. The technology often include... » read more

5G: The Telecommunications Horizon and Homeland Security


Summary "Produced in conjunction with the Department of Homeland Security (DHS) HQ Emerging Technologies Policy team, this horizon scanning report provides information and insight into the future of fifth generation (5G) and sixth generation (6G) networking technologies and the associated impacts to the homeland security enterprise. The measures taken by DHS to manage and secure its networks w... » read more

6G: Going Beyond 100 Gbps To 1 Tbps


6G research is in its very early stages. The vision for what the International Telecommunication Union calls Network 2030 continues to take shape. While the industry is years away from starting the standards development process, subterahertz (sub-THz) territory is a focus of active research. Getting to 100 gigabits per second (Gbps) to 1 terabit per second (Tbps) data throughput is a key obj... » read more

The Gargantuan 5G Chip Challenge


Blazing fast upload and download speeds for cellular data are coming, but making the technology function as expected throughout its expected lifetime is an enormous challenge that will require substantial changes across the entire chip ecosystem. While sub-6GHz is an evolutionary step from 4G LTE, the real promise of 5G kicks in with millimeter-wave (mmWave) technology. But these higher-freq... » read more

Sustainability, Ecosystems, And Consumer Requirements In 2022


Last December, my 2021 outlook focused on "industry transformations" across different verticals. I had referenced a lot of the ongoing transformations in hyperscale computing, aerospace/defense, automotive, and healthcare. 2021 didn't disappoint—most of what I discussed further accelerated pace. For instance, pretty much no booth felt complete at the annual Army AUSA event if they were not... » read more

Next Steps For Panel-Level Packaging


Tanja Braun, group manager at Fraunhofer Institute for Reliability and Microintegration (IZM), sat down with Semiconductor Engineering to talk about III-V device packaging, chiplets, fan-out and panel-level processing. Fraunhofer IZM recently announced a new phase of its panel-level packaging consortium. What follows are excerpts of that discussion. SE: IC packaging isn’t new, but years a... » read more

The Top Five Areas For 5G Improvements


A recent article by TECHnalysis's Bob O'Donnell sparked some thoughts about the critical aspects in which 5G faces improvement needs. They include coverage, cost, power, killer applications, and global ecosystems. It will be a fascinating race over the next eight to ten years, and many decisions between the evolution of 5G versus a transition to 6G are much closer than one might think. I’v... » read more

The Search For 5G mmWave Filters


Cellular telephone technology takes advantage of a large number of frequency bands to provide ever-increasing bandwidth for mobile use. Each of those bands needs a filter to keep its signals separate from other bands, but the filter technologies in current use for cellphones may not scale up to the full millimeter-wave (mmWave) range planned for 5G. “MmWave will happen,” said Mike Eddy, ... » read more

3 Technologies That Will Challenge Test


As chips are deployed in more complex systems and with new technologies, it's not clear exactly what chipmakers and systems vendors will be testing. The standard tests for voltage, temperature and electrical throughput still will be needed, of course. But that won't be sufficient to ensure that sensor fusion, machine learning, or millimeter wave 5/6G will be functioning properly. Each of tho... » read more

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