Next Steps For Panel-Level Packaging

By Mark LaPedus - 20 Dec, 2021 - Comments: 1

Tanja Braun, group manager at Fraunhofer Institute for Reliability and Microintegration (IZM), sat down with Semiconductor Engineering to talk about III-V device packaging, chiplets, fan-out and panel-level processing. Fraunhofer IZM recently announced a new phase of its panel-level packaging consortium. What follows are excerpts of that discussion. SE: IC packaging isn’t new, but years a... » read more

The Top Five Areas For 5G Improvements

By Frank Schirrmeister - 26 Aug, 2021 - Comments: 0

A recent article by TECHnalysis's Bob O'Donnell sparked some thoughts about the critical aspects in which 5G faces improvement needs. They include coverage, cost, power, killer applications, and global ecosystems. It will be a fascinating race over the next eight to ten years, and many decisions between the evolution of 5G versus a transition to 6G are much closer than one might think. I’v... » read more

The Search For 5G mmWave Filters

By Bryon Moyer - 12 Aug, 2021 - Comments: 0

Cellular telephone technology takes advantage of a large number of frequency bands to provide ever-increasing bandwidth for mobile use. Each of those bands needs a filter to keep its signals separate from other bands, but the filter technologies in current use for cellphones may not scale up to the full millimeter-wave (mmWave) range planned for 5G. “MmWave will happen,” said Mike Eddy, ... » read more

3 Technologies That Will Challenge Test

By Ed Sperling - 08 Jun, 2021 - Comments: 0

As chips are deployed in more complex systems and with new technologies, it's not clear exactly what chipmakers and systems vendors will be testing. The standard tests for voltage, temperature and electrical throughput still will be needed, of course. But that won't be sufficient to ensure that sensor fusion, machine learning, or millimeter wave 5/6G will be functioning properly. Each of tho... » read more

Hyperconnectivity And The Path To 6G

By Frank Schirrmeister - 22 Apr, 2021 - Comments: 0

Some may view the recent uptick in the news about next-generation wireless networking, specifically 6G, with some healthy skepticism as 5G is “just rolling out.” But when looking at the timelines, it becomes clear why 6G is critical and is also excellent news for electronics, and by extension, the design of semiconductors and systems. The same key elements that transformed the data center t... » read more

The Chip Industry’s Next-Gen Roadmap

By Mark LaPedus - 21 Jan, 2021 - Comments: 1

Todd Younkin, the new president and chief executive of the Semiconductor Research Corp. (SRC), sat down with Semiconductor Engineering to talk about engineering careers, R&D trends and what’s ahead for chip technologies over the next decade. What follows are excerpts of that conversation. SE: As a U.S.-based chip consortium, what is SRC's charter? Younkin: The Semiconductor Research... » read more

Power/Performance Bits: Aug. 25

By Jesse Allen - 25 Aug, 2020 - Comments: 0

AI architecture optimization Researchers at Rice University, Stanford University, University of California Santa Barbara, and Texas A&M University proposed two complementary methods for optimizing data-centric processing. The first, called TIMELY, is an architecture developed for “processing-in-memory” (PIM). A promising PIM platform is resistive random access memory, or ReRAM. Whil... » read more

What’s After 5G

By Bryon Moyer - 20 Jul, 2020 - Comments: 1

This year’s IEEE Symposia on VLSI Technology and Circuits (VLSI 2020) included a presentation by NTT Docomo that looked far into the future of cellular communications, setting the stage for a broad industry shift in communication. This is far from trivial. 5G only just recently entered the commercial world, and — especially with the higher millimeter-wave (mmWave) frequencies — it has ... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 08 May, 2020 - Comments: 0

Automotive Imagination Technologies and BAIC Capital have formed an automotive joint venture to create a new automotive fabless semiconductor company focused on China as a client. The JV will be headquartered in the Zhongguancun Integrated Circuit Design Park in Beijing, China, with Bravo Lee serving as CEO. The JV will license IP and software from Imagination to create automotive-grade SoCs. ... » read more

Manufacturing Bits: Jan. 7

By Mark LaPedus - 07 Jan, 2020 - Comments: 0

Beyond 5G chips At the recent IEEE International Electron Devices Meeting (IEDM), NTT and the Tokyo Institute of Technology presented a paper on a technology that could enable high-speed wireless devices beyond the 5G standard. Researchers have devised a 300GHz wireless transceiver (TRx) that supports a data rate of more than 100Gb/s. The device is based on a technology called indium phosph... » read more

← Older posts Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: 6G