Week in Review: IoT, Security, Auto

By Jeff Dorsch - 19 Oct, 2018 - Comments: 0

Internet of Things At Arm TechCon, Arm unveiled its Neoverse brand identity, providing an infrastructure foundation for 5G, the Internet of Things, edge computing, and other applications. The Arm Neoverse IP will proliferate next year from Arm and its technology partners. With Arm’s “Ares” platform, to be introduced in 2019, the company promises to deliver 30% per-generation performance ... » read more

EUV’s Uncertain Future

By Ed Sperling - 18 Oct, 2018 - Comments: 8

The ground appears to be solidifying under EUV. Intel announced this week it is reducing its stake in ASML to less than 3%, the second such move in a year. Apparently ASML no longer needs outside help. According to the company's earnings report, ASML turned in net sales of €2.776 billion, a slight increase over the €2.447 billion (GAAP) the company reported in Q3 and way up over the €... » read more

Wanted: Mask Equipment for Mature Nodes

By Mark LaPedus - 18 Oct, 2018 - Comments: 0

Rising demand for chips at mature nodes is impacting the photomask supply chain, causing huge demand for trailing-edge masks and a shortfall of older mask equipment. The big issue is the equipment shortfall, which could impact customers on several fronts. Tool shortages could lead to longer mask turnaround times and delivery schedules for chips being developed at 90nm and above, which are bu... » read more

The Building Blocks Of Future Compute

By Ann Mutschler - 17 Oct, 2018 - Comments: 1

Eric Hennenhoefer, vice president of research at Arm, sat down with Semiconductor Engineering to talk about privacy, security, high-performance computing, accelerators, and Arm’s research. What follows are excerpts of that conversation. SE: Privacy, cybersecurity, silicon photonics, quantum computing are all hot topics today. What do you find really interesting with these emerging areas? ... » read more

FAA Traffic Management Anticipates Flying Cars

By Kevin Fogarty - 17 Oct, 2018 - Comments: 0

It may be a year or more before the U.S. Federal Aviation Administration (FAA) changes its rules enough for Amazon or other hopefuls to deliver products by drones. But the five-year FAA Reauthorization Act of 2018, signed into law Oct. 5, confirmed controversial rules the FAA considers critical to its ability to regulate drone traffic and confirmed funding and plans for drone-specific additi... » read more

RISC-V: More Than a Core

By Brian Bailey - 15 Oct, 2018 - Comments: 2

The open-source RISC-V instruction set architecture (ISA) is attracting a lot of attention across the semiconductor industry, but its long-term success will depend on levels of cooperation never seen before in the semiconductor industry. The big question now is how committed the industry is to RISC-V's success. The real value that RISC-V brings is the promise of an ecosystem and the opportun... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 12 Oct, 2018 - Comments: 0

Chipmakers GlobalFoundries has announced the addition of nine new partners to its RFwave Partner Program, including AkronIC, Ask Radio, Catena, University of Waterloo Centre for Intelligent Antenna and Radio Systems (CIARS), Giga Solution, Helic, Incize, Mentor Graphics and Xpeedic Technology. The RFwave Partner Program builds upon GF’s radio-frequency (RF) efforts. The new partners will pro... » read more

Reliability, Machine Learning And Advanced Packaging

By Ed Sperling - 11 Oct, 2018 - Comments: 0

Semiconductor Engineering sat down to discuss reliability, resilience, machine learning and advanced packaging with Rahul Goyal, vice president in the technology and manufacturing group at Intel; Rob Aitken, R&D fellow at Arm; John Lee, vice president and general manager of the semiconductor business unit at ANSYS; and Lluis Paris, director of IP portfolio marketing at TSMC. What follows ar... » read more

Blog Review: Oct. 10

By Jesse Allen - 10 Oct, 2018 - Comments: 0

In a video, Cadence's Megha Daga dives into sparsity in neural networks and how it affects bandwidth, performance, and power efficiency. In a video, Mentor's Colin Walls takes a look at efficient embedded code, and why that means different things at different times. Synopsys' Eric Huang argues that in the realm of video standards, HDMI, DisplayPort, and USB Type-C are set to continue comp... » read more

Defect Challenges Growing In Advanced Packaging

By Mark LaPedus - 08 Oct, 2018 - Comments: 0

The current defect inspection systems for packaging are running out of steam for the latest advanced packages, prompting the need for new tools in the market. In response, several vendors are rolling out new defect inspection systems for use in various advanced packages, such as 2.5D/3D technologies and fan-out. The new defect inspection systems are more capable than the previous tools, but ... » read more

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Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

tag: Intel