tag: advanced packaging

‘More Than Moore’ Reality Check
By Ann Mutschler - 14 May, 2020 - Comments: 1

The semiconductor industry is embracing multi-die packages as feature scaling hits the limits of physics, but how to get there with the least amount of pain and at the lowest cost is a work in progress. Gaps remain in tooling and methodologies, interconnect standards are still being developed, and there are so many implementations of packaging that the number of choices is often overwhelming. ... » read more

New Uses For Manufacturing Data
By Ed Sperling - 12 May, 2020 - Comments: 0

The semiconductor industry is becoming more reliant on data analytics to ensure that a chip will work as expected over its projected lifetime, but that data is frequently inconsistent or incomplete, and some of the most useful data is being hoarded by companies for competitive reasons. The volume of data is rising at each new process node, where there are simply more things to keep track of,... » read more

An Inside Look At Testing’s Leading Edge
By Ed Sperling - 12 May, 2020 - Comments: 0

Mike Slessor, president and CEO of FormFactor, sat down with Semiconductor Engineering to discuss testing of AI and 5G chips, and why getting power into a chip for testing is becoming more difficult at each new node. SE: How does test change with AI chips, where you've got massive numbers of accelerators and processors developed at 7 and 5nm? Slessor: A lot of the AI stuff that we've been... » read more

Reliability Monitoring Of GUC 7nm High-Bandwidth Memory (HBM) Subsystem
By proteanTecs - 27 Apr, 2020 - Comments: 0

This white paper presents the use of proteanTecs’ Proteus for HBM subsystem reliability based on deep data analytics and enhanced visibility, overcoming the limitations of advanced heterogeneous packaging. It will describe the operation concept and provide results from a GUC 7nm HBM Controller ASIC. A typical CoWoS chip has hundreds of thousands of micro-bumps (u-bumps). 3-8 u-bumps are us... » read more

A Node Too Far?
By Ed Sperling - 23 Apr, 2020 - Comments: 1

Physics is an unforgiving master. While the semiconductor industry has been actively developing new transistor structures, new materials for interconnects and lining trenches, and new approaches to alleviate congestion at the lowest metal levels, it also has been playing an accelerating game of Whac-a-Mole. Whenever a problem pops up, the solution to that problem is never complete and more prob... » read more

Using Big Data For Yield And Reliability
By Ed Sperling - 22 Apr, 2020 - Comments: 0

John O’Donnell, CEO of yieldHUB, talks about the importance of clean data for traceability, yield improvement and device reliability, where and how it gets cleaned, and why that needs to be accompanied by domain expertise. » read more

Making Chips At 3nm And Beyond
By Mark LaPedus and Ed Sperling - 16 Apr, 2020 - Comments: 4

Select foundries are beginning to ramp up their new 5nm processes with 3nm in R&D. The big question is what comes after that. Work is well underway for the 2nm node and beyond, but there are numerous challenges as well as some uncertainty on the horizon. There already are signs that the foundries have pushed out their 3nm production schedules by a few months due to various technical issu... » read more

The Convergence Of Advanced Packaging And SMT
By Subodh Kulkarni - 07 Apr, 2020 - Comments: 0

One statement is almost always true in the electronics industry: smaller is better. The relentless demand for electronic systems that pack more computing power and functionality into less space has driven the development of new processes and designs since the invention of the integrated circuit. In recent years that drive has taken a new direction, literally, as manufacturers have discovered th... » read more

The Need For Traceability In Auto Chips
By Anne Meixner - 07 Apr, 2020 - Comments: 4

Someday your car will drive itself to a repair shop for a recall using a scheduling application that is both efficient and can prioritize which vehicles need to be fixed first. But that's still a ways off. Proactive identification of issues is not yet available. To be ready for that, today’s data analytics systems need to begin supporting targeted recalls, enabling predictive maintenance a... » read more

The Story Behind Advanced Packaging, Heterogeneous Integration and Test
By FormFactor - 06 Apr, 2020 - Comments: 0

The introduction of AMD’S FIJI chip a few years ago marked an important technology turning point for the semiconductor industry. This revolutionary graphics product delivered capability and innovation by relying on the first commercial example of 2.5D heterogenous integration, featuring a GPU assembled with High-Bandwidth-Memory (HBM) using Through-Silicon-Via (TSV) interconnect and interpose... » read more

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