tag: AMD

OSAT Biz: Growth And Challenges
By Mark LaPedus - 08 Feb, 2017 - Comments: 0

Amid a challenging business environment, the outsourced semiconductor assembly and test (OSAT) industry is projected to see steady to strong growth in a number of packaging segments this year. Right now, the [getkc id="83" kc_name="OSATs"]—which provide third-party IC-packaging and test services—are seeing brisk demand for both legacy and advanced chip packages. In addition, IDMs continu... » read more

What’s Missing In Advanced Packaging
By Ann Mutschler - 22 Dec, 2016 - Comments: 0

Even though Moore's Law is running out of steam, there is still a need to increase functional density. Increasingly, this is being done with heterogeneous integration at the package or module level. This is proving harder than it looks. At this point there are no standardized methodologies, and tools often are retrofitted versions of existing tools that don't take into account the challenges... » read more

Making 2.5D, Fan-Outs Cheaper
By Ed Sperling - 17 Nov, 2016 - Comments: 2

Now that it has been shown to work, the race is on to make advanced [getkc id="27" kc_name="packaging"] more affordable. While device scaling could continue for another decade or more, the number of companies that can afford to develop SoCs at the leading edge will continue to decline. The question now being addressed is what can supplant it, supplement it, or redefine it. At the center o... » read more

The Week In Review: Design
By Jesse Allen - 04 Nov, 2016 - Comments: 0

M&A Lattice Semiconductor is set for a buyout by private equity fund Canyon Bridge at a price of $1.3 billion, or $8.30 per share. Lattice will operate as a standalone subsidiary and does not expect any changes in operations or management. The deal is expected to close in early 2017. Earlier this week, Lattice announced a low power, small form factor FPGA for 5G SERDES applications. The ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 14 Oct, 2016 - Comments: 0

Chipmakers Alain Kaloyeros, president of SUNY Polytechnic Institute, has resigned. This comes amid charges that Kaloyeros was involved in an alleged bid-rigging scheme, according to multiple reports. SUNY Poly, a high-tech educational ecosystem in New York, was recently formed from the merger of the SUNY College of Nanoscale Science and Engineering (CNSE) and the SUNY Institute of Technology. ... » read more

Seeing The Future Of Vision
By Jeff Dorsch - 13 Oct, 2016 - Comments: 0

Vision systems have evolved from cameras that enable robots to “see” on a factory floor to a safety-critical element of the heterogeneous systems guiding autonomous vehicles, as well as other applications that call for parallel processing technology to quickly recognize objects, people, and the surrounding environment. Automotive electronics and mobile devices currently dominate embedded... » read more

Building Chips That Can Learn
By Ed Sperling - 29 Sep, 2016 - Comments: 0

The idea that devices can learn optimal behavior rather than relying on more generalized hardware and software is driving a resurgence in artificial intelligence, machine leaning, and cognitive computing. But architecting, building and testing these kinds of systems will require broad changes that ultimately could impact the entire semiconductor ecosystem. Many of these changes are wel... » read more

Stacked Die Changes
By Ed Sperling - 21 Sep, 2016 - Comments: 0

Semiconductor Engineering sat down to discuss advanced packaging with David Pan, associate professor in the department of electrical and computer engineering at the University of Texas; Max Min, senior technical manager at [getentity id="22865" e_name="Samsung"]; John Hunt, senior director of engineering at ASE; and Sitaram Arkalgud, vice president of 3D portfolio and technologies at Invensas. ... » read more

The Zen Of Processor Design
By Ed Sperling - 15 Sep, 2016 - Comments: 0

Mark Papermaster, chief technology officer at Advanced Micro Devices, sat down with Semiconductor Engineering to discuss how to keep improving performance per watt, new packaging options, and the increasing focus on customization for specific tasks. What follows are excerpts of that conversation. SE: As we get more into the IoT and we have to deal with more data, not to mention cars where da... » read more

Focus Shifts To Architectures
By Ed Sperling - 08 Sep, 2016 - Comments: 1

Chipmakers increasingly are relying on architectural and micro-architectural changes as the best hope for improving power and performance across a spectrum of markets, process nodes and price points. While discussion about the death of [getkc id="74" comment="Moore's Law"] predates the 1-micron process node, there is no question that it is getting harder for even the largest chipmakers to st... » read more

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