tag: Amkor Technology

AI In Inspection, Metrology, And Test
By Susan Rambo And Ed Sperling - 06 Apr, 2021 - Comments: 0

AI/ML is creeping into multiple processes within the fab and packaging houses, although not necessarily for the purpose it was originally intended. The chip industry is just beginning to learn where AI makes sense and where it doesn't. In general, AI works best as a tool in the hands of someone with deep domain expertise. AI can do certain things well, particularly when it comes to pattern m... » read more

What Goes Wrong In Advanced Packages
By Ed Sperling - 24 Mar, 2021 - Comments: 1

Advanced packaging may be the best way forward for massive improvements in performance, lower power, and different form factors, but it adds a whole new set of issues that were much better understood when Moore's Law and the ITRS roadmap created a semi-standardized path forward for the chip industry. Different advanced packaging options — system-in-package, fan-outs, 2.5D, 3D-IC — have a... » read more

Chip Board Interaction Analysis Of 22nm FD-SOI Technology In WLP
By Amkor - 17 Mar, 2021 - Comments: 0

Recently, Wafer Level Packaging (WLP) has been in high demand, especially in mobile device applications as a path to enable miniaturization while maintaining good electrical performance. The relatively inexpensive package cost and simplified supply chain are encouraging other industries to adapt WLP capabilities for radio frequency (RF), communications/sensing (mmWave) and automotive applicatio... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 05 Mar, 2021 - Comments: 0

Automotive/Mobility Chip-telemetry company proteanTecs has joined TSMC’s IP Alliance Program, which puts proteanTecs’ Universal Chip Telemetry (UCT) IP into TSMC’s catalog of production-proven IP. UCT is a monitoring system designed directly into chips to pull measurements from inside the chip throughout its lifecycle, including after placement in systems in the field. Monitoring the hea... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 26 Feb, 2021 - Comments: 0

Automotive/Mobility Toyota Motor Corporation developed a hydrogen fuel cell (FC) system packaged in a compact module. Toyota plans to start selling it in the spring of 2021. The module can be used by other companies developing products powered by fuel cells. Micron is sampling an ASIL D level LPDDR5. The low-power memory is qualified for automotive safety applications. Samsung Foundry ce... » read more

Increasing The Conductive Density Of Packaging
By Shaun Bowers - 18 Feb, 2021 - Comments: 0

Wide bandgap (WBG) semiconductor technologies have created new challenges and opportunities for power packages. Developments such as silicon carbide (SiC) and gallium nitride (GaN), have a higher figure of merit (FOM) compared to silicon MOSFETs and have extended the efficiency, output power and/or switching frequency range and operating temperature range for power electronics. With lower lo... » read more

WLFO For High-Performance Low-Cost Packaging Of RFMEMS-CMOS
By Amkor - 17 Feb, 2021 - Comments: 0

Navigating the trade-offs between performance, size, cost and reliability can be a challenge when considering integrated circuit (IC) packaging and the end-application. The integration of micro-electromechanical systems (MEMS), either monolithic or heterogeneous, introduces yet another level of complexity that has only recently been a major focus of multi-device packaging. Wafer-level fanout (W... » read more

Data Issues Mount In Chip Manufacturing
By Anne Meixner - 09 Feb, 2021 - Comments: 2

For yield management systems the old calculation adage, "garbage in/garbage out" still rings true. Aligning and cleaning data remains a dirty business. With the increased value in data in the semiconductor supply chain, there now are essentially two supply chains running in parallel. One involves the physical product being created, while the other includes the data associated with each proce... » read more

A Look Inside ADAS Modules
By Prasad Dhond - 21 Jan, 2021 - Comments: 0

You glance down at your phone while rolling in slow-moving traffic. Against your better judgment, you proceed to read your latest email, oblivious to the fact that the car in front of you has braked. In the nick of time, your car starts beeping and flashing. You look up and slam the brakes. Whew! That was close. If this has happened to you, don't forget to thank the radar and camera modules in ... » read more

Hard-To-Hire Engineering Jobs
By Susan Rambo - 13 Jan, 2021 - Comments: 3

While the pandemic has hurt many job sectors, the semiconductor industry can't get enough qualified people. And that shortage is expected to persist for years, as companies reach deep into untapped talent pools around the globe. Most in demand are experienced engineers and engineers with hybrid knowledge. Skills in machine learning and artificial intelligence are very desirable. Combined kno... » read more

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