tag: analog

Wanted: Mask Equipment for Mature Nodes
By Mark LaPedus - 18 Oct, 2018 - Comments: 0

Rising demand for chips at mature nodes is impacting the photomask supply chain, causing huge demand for trailing-edge masks and a shortfall of older mask equipment. The big issue is the equipment shortfall, which could impact customers on several fronts. Tool shortages could lead to longer mask turnaround times and delivery schedules for chips being developed at 90nm and above, which are bu... » read more

Power Delivery Affecting Performance At 7nm
By Brian Bailey - 11 Oct, 2018 - Comments: 4

Complex interactions and dependencies at 7nm and beyond can create unexpected performance drops in chips that cannot always be caught by signoff tools. This isn't for lack of effort. The amount of time spent trying to determine if an advanced-node chip will work after it is fabricated has been rising steadily for several process nodes. Additional design rules handle everything from variation... » read more

Lab-To-Fab Testing
By Ed Sperling - 08 Oct, 2018 - Comments: 0

Test equipment vendors are working on integrating testing and simulation in the lab with testing done later in the fab, setting the stage for what potentially could be the most significant change in semiconductor test in years. If they are successful, this could greatly simplify design for test, which has become increasingly difficult as chips get more complex, denser, and as more heterogene... » read more

Proof-Of-Concept To Product: Initial Design Of A MEMS Sensor
By Mentor, a Siemens Business - 03 Oct, 2018 - Comments: 0

In previous papers, we have covered how to design and verify an IoT tank fluid-level monitoring system. We covered how to create a proof-of-concept and prototype. In this series of white papers, we explore the detailed product design of the MEMS pressure sensor within this system. In this initial whitepaper, we introduce the piezoelectric micro-machined ultrasonic transducer (PMUT) sensor, show... » read more

Domain Crossing Nightmares
By Brian Bailey - 27 Sep, 2018 - Comments: 1

Semiconductor Engineering sat down to discuss problems associated with domain crossings with Alex Gnusin, design verification technologist for Aldec; Pete Hardee, director, product management for Cadence; Joe Hupcey, product manager and verification product technologist for Mentor, a Siemens Business; Sven Beyer, product manager design verification for OneSpin; and Godwin Maben, applications en... » read more

Analog Reliability Analysis for Mission-Critical Applications
By Cadence - 26 Sep, 2018 - Comments: 0

Rapidly increasing electrical content in automobiles is driving the need for revolution in analog integrated circuit (IC) design methodology. Compared to designing for consumer electronics, designing for mission-critical applications—industrial, medical, space, and automotive—requires a different approach to reliability analysis. We will explore how reliability analysis needs to change for ... » read more

Market Trends For Large Volume Semi Products
By Joanne Itow - 24 Sep, 2018 - Comments: 0

Material and capacity shortages typically prompt changes in normal operating procedures, especially purchasing strategies. If the uncertainty regarding world trade policies and tariffs are added on top of the shortages, the impact results in unusual gyrations in industry sales data and possible misleading signals. Discretes, analog and opto are the three largest semiconductor product categories... » read more

Where FD-SOI Works Best (Part 2)
By Ed Sperling - 15 Aug, 2018 - Comments: 0

Semiconductor Engineering sat down to discuss changes in the FD-SOI world and what's behind them, with James Lamb, deputy CTO for advanced semiconductor manufacturing and corporate technical fellow at Brewer Science; Giorgio Cesana, director of technical marketing at STMicroelectronics; Olivier Vatel, senior vice president and CTO at Screen Semiconductor Solutions; and Carlos Mazure, CTO at Soi... » read more

Dynamic Fault Injection For System-Level Simulation Of MEMS
By Fraunhofer IIS/EAS - 08 Aug, 2018 - Comments: 0

In this paper a method for dynamic fault injection and fault simulation as well as its application to MEMS based sensor systems is described. The prerequisite for this approach is the availability of accurate, but numerically efficient models for the MEMS element. Simulations based on SystemC and SystemC AMS are suitable to analyze the nominal behavior of complex sys- tems including electronics... » read more

More Sigmas In Auto Chips
By Ann Mutschler - 02 Aug, 2018 - Comments: 0

The journey to autonomous cars is forcing fundamental changes in the way chips are designed, tested and tracked, from the overall system functionality to the IP that goes into those systems. This includes everything from new requirements for automotive-grade chips to longer mean time between failures. But it also makes it far more challenging, time-consuming and complicated to create these d... » read more

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