Blog Review: Aug. 26


Cadence's Paul McLellan shares some highlights from Hot Chips, including the massive growth in deep learning models, the basics of designing neural network models, and challenges involved in different approaches. Mentor's Colin Walls explores memory management units, its job of translating an address used by the CPU to an alternative address, and why this remapping is desirable and useful. ... » read more

Week In Review: Design, Low Power


Tools & IP SiFive announced OpenFive, a self-contained and autonomous business unit that will offer custom silicon solutions with differentiated IP. OpenFive will be led by Dr. Shafy Eltoukhy, SVP, and general manager of OpenFive. OpenFive debuted with a new Die-to-Die (D2D) interface IP portfolio to serve next-generation chipset based designs for networking, HPC, and AI markets. The D2D p... » read more

Week In Review: Auto, Security, Pervasive Computing


Pervasive computing — data center, edge, IoT SEMI formed a new standards committee to develop global standards for flexible hybrid electronics (FHE). The SEMI Standards Flexible Hybrid Electronics Global Technical Committee will develop FHE standards for design, materials, manufacturing, packaging and systems and to drive industry growth. IPC is also working on FHE standards as an industry s... » read more

The Challenge Of Keeping AI Systems Current


Semiconductor Engineering sat down to discuss AI and its move to the edge with Steven Woo, vice president of enterprise solutions technology and distinguished inventor at Rambus; Kris Ardis, executive director at Maxim Integrated; Steve Roddy, vice president of Arm's Products Learning Group; and Vinay Mehta, inference technical marketing manager at Flex Logix. What follows are excerpts of that ... » read more

Blog Review: Aug. 19


Rambus' Scott Best digs into some of the most sophisticated attacks used to target and compromise security chips, such as laser voltage probing, focused ion beam editing, reverse engineering, and NVM extraction, and ways to counter them. Synopsys' Chris Clark proposes a way to identify problems earlier and better ensure safety and reliability in automotive SoCs by moving from a linear develo... » read more

From Cloud To Cloudlets


Cloudlets, or mini-clouds, are starting to roll out closer to the sources of data in an effort to reduce latency and improve overall processing performance. But as this approach gains steam, it also is creating some new challenges involving data distribution, storage and security. The growing popularity of distributed clouds is a recognition that the cloud model has limitations. Sending the ... » read more

Redefining The Power Delivery Network


Reliably getting power around a package containing multiple dies, potentially coming from multiple sources, or implemented in diverse technologies, is becoming much more difficult. The tools and needed to do this in an optimized manner are not all there today. Nevertheless, the industry is confident that we can get there. For a single die, the problem has evolved slowly over time. "For a ... » read more

Semiconductors And The Climate Curve


On July 22 I participated in a panel at the virtual SEMICON West conference called “Bending the Climate Curve: Enabling Sustainable Growth of Big Data, AI, and Cloud Computing.” Virtual conferences are mandatory these days, but give a different experience than physical ones. They are very good at disseminating information and are reasonably effective at networking. But, in my experience... » read more

An Introduction To The ARMv8-M Architecture


The ARMv8-M architecture is used for the next-generation ARMv8-M processor family of real-time deterministic embedded processors. It is aimed at low cost deeply embedded systems, where low-latency interrupt processing is vital. The ARMv8-M architecture reduces the complexity of developing secure embedded solutions that scale all the way from the smallest IoT device to complex SoCs. ARM uses ... » read more

Blog Review: Aug. 12


Arm's Greg Yeric takes a look at what semiconductor manufacturing might look like in 2030 as the price of equipment rises and possibilities for when the next upgrade to EUV, high numerical aperture, eventually runs out of steam. Synopsys' Taylor Armerding explains the difference between bugs and security flaws and why it's so important to pay attention to potential problems in a design's spe... » read more

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