Challenges And Approaches To Developing Automotive Grade 1/0 FCBGA Package Capability

By Amkor - 18 Nov, 2020 - Comments: 0

Automotive Grade 1 and 0 package requirements, defined by Automotive Electronics Council (AEC) Document AEC-100, require more severe temperature cycling and high temperature storage conditions to meet harsh automotive field requirements, such as a maximum 150°C device operating temperature, 15-year reliability and zero-defect quality level. Moreover, increased integration of device functionali... » read more

Side Wettable Flanks For Leadless Automotive Packaging

By Amkor - 21 Oct, 2020 - Comments: 0

The MicroLeadFrame (MLF)/Quad Flat No-Lead (QFN) packaging solution is extremely popular in the semiconductor industry. It is used in applications ranging from consumer electronics and communications to those requiring high reliability performance, such as the automotive industry. The wide acceptance of this packaging design is primarily due to its flexible form factors, size, scalability and t... » read more

PowerPR Virtualization: A Critical Feature For Automotive GPUs

By Imagination Technologies - 26 Feb, 2020 - Comments: 0

What is GPU virtualization? Conceptually, virtualization is the capability of a device to host one or more virtual machines (VMs) that each behave like actual independent machines with their own operating system (OS), all running on the same underlying device hardware. In regard to GPUs, this means the capability to support multiple concurrently running operating systems, each capable of submit... » read more

Best Practices for Traceability of Functional Safety Requirements In Automotive IP & SoCs

By Synopsys - 25 Sep, 2019 - Comments: 0

Automotive functional safety systems continue to incorporate complex features to meet wide range of consumer demands. Developing functional safety systems, including all the components such as the system-on-chip (SoC) and IP, hinges on the ability to meet the stringent automotive functional safety requirements such as definition, implementation, verification, and validation. Functional safety S... » read more

Combating Counterfeit Semiconductors in the Automotive Supply Chain

By Rambus - 04 Sep, 2019 - Comments: 0

The counterfeit market for semiconductors is real, sizable and growing. Industry analysts peg the current market for fake semiconductors at $75B. Counterfeit chips pose great risk to driver comfort and safety, to say nothing of the severe negative consequences they present to automaker revenues and brand. The good news is there are immediate and cost-effective measures available to secu... » read more

Gaps Emerge In Automotive Test

By Ed Sperling - 07 May, 2019 - Comments: 1

Demands by automakers for zero defects over 18 years are colliding with real-world limitations of testing complex circuitry and interactions, and they are exposing a fundamental disconnect between mechanical and electronic expectations that could be very expensive to fix. This is especially apparent at leading-edge nodes, where much of the logic is being developed for AI systems and image se... » read more

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tag: automotive chips

Challenges And Approaches To Developing Automotive Grade 1/0 FCBGA Package Capability

Side Wettable Flanks For Leadless Automotive Packaging

PowerPR Virtualization: A Critical Feature For Automotive GPUs

Best Practices for Traceability of Functional Safety Requirements In Automotive IP & SoCs

Combating Counterfeit Semiconductors in the Automotive Supply Chain

Gaps Emerge In Automotive Test

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