中文 English

Automotive: Innovations, Trends And The Intersection With Semiconductors


The semiconductor industry performed better than expected in 2020 despite the impact of COVID-19 on the global economy and is preparing for accelerated growth in 2021 and beyond. The global coronavirus pandemic significantly increased demand for communications electronics and fueled the growth in cloud computing to support remote work and learning. Semiconductor manufacturers, many running at p... » read more

Auto Displays: Bigger, Brighter, More Numerous


Displays are rapidly becoming more critical to the central brains in automobiles, accelerating the adoption and evolution of this technology to handle multiple types of audio, visual, and other data traffic coming into and flowing throughout the vehicle. These changes are having a broad impact on the entire design-through-manufacturing flow for display chip architectures. In the past, these ... » read more

Adding Value With Unit Level Traceability (ULT) In Automotive Packaging


Automotive product traceability has existed in one form or another for several decades. Traceability generally refers to tracking and tracing each component that comprises every subsystem in a car. Traditionally, this has been achieved with direct part marking on mechanical or electronic components, using 1D or 2D barcodes or radio-frequency identification (RFID). Since vehicle recalls are cost... » read more

Automotive IC Shortage Drags On


The current automotive semiconductor shortages won’t end anytime soon. When the COVID-19 pandemic hit in early 2020, it wreaked havoc on the worldwide supply chain, but it especially caught automakers flat-footed. When the auto OEMs canceled chip orders during a roughly eight-week period of plant shutdowns, they later found their supplies of critical ICs had evaporated. To make it an ev... » read more

Why Improving Auto Chip Reliability Is So Hard


Tools and ecosystems that focus on reliability and the long-term health of chips are starting to coalesce for the automotive electronics industry. Data gleaned from a chip’s lifecycle — design, verification, test, manufacturing, and in-field operation — will become key to achieving the longevity, reliability, functional safety, and security of newer generations of automobiles. Having s... » read more

Automotive IC Production Wafer Test In A Zero-Defect World


By Amy Leong, FormFactor. Innovations in automotive semiconductor ICs post a high bar for wafer test. FormFactor’s Chief Marketing Officer, Amy Leong, provides insights into the challenges associated with automotive IC production wafer testing amid the requirement for zero-defects. Click here to continue reading. » read more

Challenges And Approaches To Developing Automotive Grade 1/0 FCBGA Package Capability


Automotive Grade 1 and 0 package requirements, defined by Automotive Electronics Council (AEC) Document AEC-100, require more severe temperature cycling and high temperature storage conditions to meet harsh automotive field requirements, such as a maximum 150°C device operating temperature, 15-year reliability and zero-defect quality level. Moreover, increased integration of device functionali... » read more

Side Wettable Flanks For Leadless Automotive Packaging


The MicroLeadFrame (MLF)/Quad Flat No-Lead (QFN) packaging solution is extremely popular in the semiconductor industry. It is used in applications ranging from consumer electronics and communications to those requiring high reliability performance, such as the automotive industry. The wide acceptance of this packaging design is primarily due to its flexible form factors, size, scalability and t... » read more

PowerPR Virtualization: A Critical Feature For Automotive GPUs


What is GPU virtualization? Conceptually, virtualization is the capability of a device to host one or more virtual machines (VMs) that each behave like actual independent machines with their own operating system (OS), all running on the same underlying device hardware. In regard to GPUs, this means the capability to support multiple concurrently running operating systems, each capable of submit... » read more

Best Practices for Traceability of Functional Safety Requirements In Automotive IP & SoCs


Automotive functional safety systems continue to incorporate complex features to meet wide range of consumer demands. Developing functional safety systems, including all the components such as the system-on-chip (SoC) and IP, hinges on the ability to meet the stringent automotive functional safety requirements such as definition, implementation, verification, and validation. Functional safety S... » read more

← Older posts