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Making More Reliable And More Efficient Auto ICs


Sam Geha, executive vice president of memory solutions at Infineon Technologies, sat down with Semiconductor Engineering to talk about automotive chips, supply chain issues, and integration challenges. What follows are excerpts of that conversation. SE: How do you build an automotive chip that will work in any environment? Geha: The automotive market is, of course, one of the most demand... » read more

Case Study — 3D Wire Bond Inspection and Metrology


The growing amount of electronics within modern vehicles has made the inspection process for wire bonds increasingly challenging, as active devices shrink and bonds are arranged in complex ways. CyberOptics addressed the need for an automated solution to replace labor-intensive and imprecise manual inspection methods for wire bonds and loop heights. After consideration of competitive products, ... » read more

RF/Microwave Technology Driving The Connected Car


In-car networks and advanced driver-assistance systems (ADAS), made possible through wireless sensors, driver-assist radar, vehicle communications, and related electronics, present many design challenges to engineers. Simulation software enables design teams to effectively manage the complex design and integration challenges associated with developing these high-speed and RF-enabled networks. T... » read more

Automotive: Innovations, Trends And The Intersection With Semiconductors


The semiconductor industry performed better than expected in 2020 despite the impact of COVID-19 on the global economy and is preparing for accelerated growth in 2021 and beyond. The global coronavirus pandemic significantly increased demand for communications electronics and fueled the growth in cloud computing to support remote work and learning. Semiconductor manufacturers, many running at p... » read more

Auto Displays: Bigger, Brighter, More Numerous


Displays are rapidly becoming more critical to the central brains in automobiles, accelerating the adoption and evolution of this technology to handle multiple types of audio, visual, and other data traffic coming into and flowing throughout the vehicle. These changes are having a broad impact on the entire design-through-manufacturing flow for display chip architectures. In the past, these ... » read more

Adding Value With Unit Level Traceability (ULT) In Automotive Packaging


Automotive product traceability has existed in one form or another for several decades. Traceability generally refers to tracking and tracing each component that comprises every subsystem in a car. Traditionally, this has been achieved with direct part marking on mechanical or electronic components, using 1D or 2D barcodes or radio-frequency identification (RFID). Since vehicle recalls are cost... » read more

Automotive IC Shortage Drags On


The current automotive semiconductor shortages won’t end anytime soon. When the COVID-19 pandemic hit in early 2020, it wreaked havoc on the worldwide supply chain, but it especially caught automakers flat-footed. When the auto OEMs canceled chip orders during a roughly eight-week period of plant shutdowns, they later found their supplies of critical ICs had evaporated. To make it an ev... » read more

Why Improving Auto Chip Reliability Is So Hard


Tools and ecosystems that focus on reliability and the long-term health of chips are starting to coalesce for the automotive electronics industry. Data gleaned from a chip’s lifecycle — design, verification, test, manufacturing, and in-field operation — will become key to achieving the longevity, reliability, functional safety, and security of newer generations of automobiles. Having s... » read more

Automotive IC Production Wafer Test In A Zero-Defect World


By Amy Leong, FormFactor. Innovations in automotive semiconductor ICs post a high bar for wafer test. FormFactor’s Chief Marketing Officer, Amy Leong, provides insights into the challenges associated with automotive IC production wafer testing amid the requirement for zero-defects. Click here to continue reading. » read more

Challenges And Approaches To Developing Automotive Grade 1/0 FCBGA Package Capability


Automotive Grade 1 and 0 package requirements, defined by Automotive Electronics Council (AEC) Document AEC-100, require more severe temperature cycling and high temperature storage conditions to meet harsh automotive field requirements, such as a maximum 150°C device operating temperature, 15-year reliability and zero-defect quality level. Moreover, increased integration of device functionali... » read more

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