Overview Of Medical Chip Challenges


Medical devices are adopting, and increasingly adapting, a variety of semiconductor technologies to provide new functions and capabilities in smaller form factors. In doing so, they are leveraging increasing processing capabilities, lower power, and new types of sensors to propel health care forward. Many different chip types have been used in medical devices for years, many of them develope... » read more

Blog Review: Sept. 29


Cadence's Paul McLellan checks out two of the biggest chips presented at the recent Hot Chips: a graphics chip from Intel for an upcoming supercomputer and Cerebras' wafer-scale AI chip. Synopsys' Datsen Davies Tharakan lists the top five design challenges for electric vehicles and power semiconductors and why a robust design flow can accelerate the growth of hybrid and electric vehicles goi... » read more

EDA Vendors Widen Use Of AI


EDA vendors are widening the use of AI and machine learning to incorporate multiple tools, providing continuity and access to consistent data at multiple points in the semiconductor design flow. While gaps remain, early results from a number of EDA tools providers point to significant improvements in performance, power, and time to market. AI/ML has been deployed for some time in EDA. Still,... » read more

Low-Power Always-On Circuits


Some circuits are always on. A smart phone wakes up when it senses a user, and a smart speaker responds to keywords. The challenge is to make sure these devices don’t consume a lot of power while the rest of a device is powered down, that it remains secure, and that it can quickly wake up whatever other functions are needed. All of this requires a significant amount of engineering work. Amol ... » read more

Software-Hardware Co-Design Becomes Real


For the past 20 years, the industry has sought to deploy hardware/software co-design concepts. While it is making progress, software/hardware co-design appears to have a much brighter future. In order to understand the distinction between the two approaches, it is important to define some of the basics. Hardware/software co-design is essentially a bottom-up process, where hardware is deve... » read more

Week In Review: Design, Low Power


U.S. government officials met with semiconductor industry companies and automakers to request supply chain information it hopes could address the current semiconductor shortage, Reuters reports. Secretary of Commerce Gina Raimondo hopes the information will enable them and industry to "get more granular into the bottlenecks and then ultimately predict challenges before they happen," but also wa... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive Cadence announced its new platform for speeding up the creation of virtual and hybrid prototypes of complex systems, such as those found in automotive systems. The Cadence Helium Virtual and Hybrid Studio enables teams to verify embedded software and firmware on virtual and hybrid configurations before the RTL is ready, in systems where software and hardware need to be created simul... » read more

Microelectronics And The AI Revolution


It is no secret that artificial intelligence and machine learning (AI/ML) are critical drivers for growth in electronics, and particularly, for semiconductors. The recent AI Hardware Summit showcased trends in AI/ML, both in enabling and using it in various application domains, including EDA. As part of the summit, Imec had organized a panel on “Advanced Microelectronics Technologies Driving ... » read more

Containing The Explosion In Data


The amount of data that could be kept for every design is gargantuan, but even that may not be enough these days as lifecycle management, continuous verification, regulatory requirements, and globalization add to the data that needs to be stored. But data has no value if it cannot be found or used in ways that provide more benefit than the cost of storing it. "Data management is not unique t... » read more

Data Tsunami Pushes Boundaries Of IC Interconnects


Rapid increases in machine-generated data are fueling demand for higher-performance multi-core computing, forcing design teams to rethink the movement of data on-chip, off-chip, and between chips in a package. In the past, this was largely handled by the on-chip interconnects, which often were a secondary consideration in the design. But with the rising volumes of data in markets ranging fro... » read more

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