tag: CVD

More Than Just Carbon Dioxide
By Katherine Derbyshire - 14 Dec, 2016 - Comments: 0

As discussed in Part Two of this series, lifecycle analyses of greenhouse gas emissions consider both direct and indirect sources. Indirect CO2 emissions, attributed to electricity and other forms of energy purchased by the fab, are the semiconductor industry’s single largest environmental impact. Of those emissions, a large fraction are attributable to plasma-based etch and deposition steps,... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 12 Aug, 2016 - Comments: 0

Chipmakers At this week’s Flash Memory Summit, Samsung rolled out several new products, including its next-generation 3D NAND device and a solid-state drive (SSD) with capacities up to 32 terabytes. At the same time, Samsung introduced a new and high-performance SSD solution, dubbed the Z-SSD. Samsung’s Z-SSD shares the fundamental structure of V-NAND and has a unique circuit design and... » read more

Interconnect Challenges Rising
By Mark LaPedus - 27 Jun, 2016 - Comments: 1

Chipmakers are ramping up their 14nm finFET processes, with 10nm and 7nm slated to ship possibly later this year or next. At 10nm and beyond, IC vendors are determined to scale the two main parts of the [getkc id="185" kc_name="finFET"] structure—the transistor and interconnects. Generally, transistor scaling will remain challenging at advanced nodes. And on top of that, the interconnects ... » read more

Next Challenge: Contact Resistance
By Mark LaPedus - 23 Jun, 2016 - Comments: 0

In chip scaling, there is no shortage of challenges. Scaling the finFET transistor and the interconnects are the biggest challenges for current and future devices. But now, there is another part of the device that’s becoming an issue—the contact. Typically, the contact doesn’t get that much attention, but the industry is beginning to worry about the resistance in the contacts, or conta... » read more

The Trouble With MEMS
By Ed Sperling - 25 May, 2016 - Comments: 0

The advent of the Internet of Things will open up a slew of new opportunities for MEMS-based sensors, but chipmakers are proceeding cautiously. There are a number of reasons for that restraint. Microelectromechanical systems are difficult to design, manufacture and test, which initially fueled optimism in the MEMS ecosystem that this market would command the same kinds of premiums that analo... » read more

How To Make 3D NAND
By Mark LaPedus - 23 May, 2016 - Comments: 0

In 2013, Samsung reached a major milestone in the IC industry by shipping the world’s first 3D NAND device. Now, after some delays and uncertainty, Intel, Micron, SK Hynix and the SanDisk/Toshiba duo are finally ramping up or sampling 3D NAND. 3D NAND is the long-awaited successor to today’s planar or 2D NAND, which is used in memory cards, solid-state storage drives (SSDs), USB flash dr... » read more

The Internet Of Power Also Benefits From Moore’s Law
By Imec - 21 Jan, 2016 - Comments: 0

By Jef Poortmans It may sound strange, but striving to achieve smaller dimensions with Moore’s Law is an important enabler for producing increasingly better solar cells, with a more elaborate technology toolbox (including ALD, epitaxy, etc.) Improved process steps are constantly being developed to achieve these small transistor dimensions (for growing material layers or to etch away str... » read more

Lam To Acquire KLA-Tencor
By Mark LaPedus - 21 Oct, 2015 - Comments: 1

In a major and surprising move in the fab tool business, Lam Research has entered into a definitive agreement to acquire KLA-Tencor for about $10.6 billion in cash and stock. Lam’s proposed move to acquire KLA-Tencor would create a powerhouse in the fab tool industry. The combined company will have approximately $8.7 billion in annual revenue, propelling it to become the world’s second l... » read more

ALD Market Heats Up
By Mark LaPedus - 17 Sep, 2015 - Comments: 1

Amid the shift to 3D NAND, finFETs and other device architectures, the atomic layer deposition (ALD) market is heating up on several fronts. Applied Materials, for example, recently moved to shakeup the landscape by rolling out a new, high-throughput ALD tool. Generally, [getkc id="250" kc_name="ALD"] is a process that deposits materials layer-by-layer at the atomic level, enabling thin and ... » read more

Surprises At SEMICON West
By Joanne Itow - 23 Jul, 2015 - Comments: 0

As companies such as TSMC and Intel spend less on capital expenditures this year, expectations for SEMICON West 2015 were pretty bleak. I thought I’d have fewer appointments and nothing to really write home about. Au contraire. Although traffic on the show floor was nothing compared to events like CES, there are three things that are driving growth and excitement at semiconductor equipment... » read more

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