tag: directed self assembly

Applied-TEL Watch
By Mark LaPedus - 17 Oct, 2013 - Comments: 0

By Mark LaPedus So far this year, the biggest story in the fab tool industry is fairly obvious—Applied Materials recently signed a definitive agreement to acquire rival Tokyo Electron Ltd. (TEL) for about $9.3 billion. The blockbuster announcement will likely be the top story of 2013. Of course, the integration of Applied and TEL will be a challenge. In any case, the Applied-TEL deal is i... » read more

The Week In Review: Aug 5
By Ed Sperling - 05 Aug, 2013 - Comments: 0

By Mark LaPedus According to a nationwide online survey conducted by Harris Interactive on behalf of Crucial.com, 36% of those Americans who experienced PC problems in the past six months admit they have lashed out at their slow, underperforming computers by using profanity, screaming and shouting, or by striking it with a fist or other object. Those who experienced computer problems also indi... » read more

Inside Leti’s Litho Lab
By Mark LaPedus - 16 May, 2013 - Comments: 0

By Mark LaPedus Semiconductor Manufacturing & Design sat down to discuss future lithography challenges with Serge Tedesco, lithography program manager at CEA-Leti; Laurent Pain, lithography lab manager at CEA-Leti; and Raluca Tiron, a senior scientist at CEA-Leti. SMD: CEA-Leti has two major and separate programs, including one in directed self-assembly (DSA) and another in multi-beam ... » read more

Experts At The Table: Issues In Metrology And Inspection
By Mark LaPedus - 06 May, 2013 - Comments: 0

By Mark LaPedus Semiconductor Manufacturing & Design sat down to discuss future metrology and inspection challenges with John Allgair, senior member of the technical staff at GlobalFoundries; Kevin Heidrich, vice president of marketing and business development at Nanometrics; Robert Newcomb, executive vice president at Qcept Technologies; and Shrinivas Shetty, vice president of marketing f... » read more

Design-For-DSA Industry Begins To Assemble
By Mark LaPedus - 18 Apr, 2013 - Comments: 0

By Mark LaPedus The industry is aggressively pursuing directed self-assembly (DSA) as an alternative patterning technology for future chip designs. DSA, which enables fine pitches through the use of block copolymers, is in the R&D pilot line stage today. The fab tools, process flows and materials are basically ready, but there are still several challenges to bring the technology from th... » read more

Waiting For 3D Metrology
By Mark LaPedus - 18 Apr, 2013 - Comments: 0

By Mark LaPedus Over the years, suppliers of metrology equipment have managed to meet the requirements for conventional planar chips. But tool vendors now find themselves behind in the emerging 3D chip era, prompting the urgent need for a new class of 3D metrology gear. 3D is a catch-all phrase that includes a range of new architectures, such as finFET transistors, 3D NAND and stacked-die ... » read more

Throw In The Kitchen Sink
By Ed Sperling - 05 Apr, 2013 - Comments: 0

By Ed Sperling The number of options available for reducing power and improving performance are increasing for the first time in a decade. This is good news for chipmakers. It’s far less clear who stands to benefit on the tools, IP, capital equipment and manufacturing side. Choice is always a good thing in design. It allows teams to trade off one IP block for another, based upon the needs... » read more

Reaching For The Reset Button In Lithography
By Mark LaPedus - 21 Mar, 2013 - Comments: 0

By Mark LaPedus Amid ongoing delays and setbacks, extreme ultraviolet (EUV) lithography and multi-beam e-beam have both missed the 10nm logic node. So for the present, chipmakers must take the brute force route at 10nm by using 193nm immersion with multiple patterning. Now, it’s time to hit the reset button. For the 7nm node, chipmakers currently are lining up the lithographic competition... » read more

Directed Self-Assembly Grows Up
By Mark LaPedus - 21 Mar, 2013 - Comments: 1

By Mark LaPedus At last year’s SPIE Advanced Lithography conference, Christopher Bencher, a member of the technical staff at Applied Materials, said the buzz surrounding directed self-assembly (DSA) technology resembled the fervor generated at the famous Woodstock rock concert in 1969. This was clearly evident from the tumultuous and free-flowing movement that threatened the status quo o... » read more

Bit Mapping
By Ed Sperling - 22 Feb, 2013 - Comments: 0

The rule of thumb for semiconductor manufacturing is that big breakthroughs tend to last a decade, or about five process nodes. While the transistor already has spanned more than five decades and the IC more than four decades, the technology used to create them typically only lasts about one. 193nm lithography has been around more than a decade. Bets were being made publicly back at 45nm—o... » read more

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