Signals In The Noise: Tackling High-Frequency IC Test


The need for high-frequency semiconductor devices is surging, fueled by growing demand for advanced telecommunications, faster sensors, and increasingly autonomous vehicles. The advent of millimeter-wave communication in 5G and 6G is pushing manufacturers to develop chips capable of handling frequencies that were once considered out of reach. However, while these technologies promise faster ... » read more

Managing EMI in High-Density Integration


The relentless drive for higher performance and increased functional integration has ushered in new challenges for managing electromagnetic interference (EMI) in densely packed mixed-signal environments. Integrating analog, RF, and digital circuits into a single system-on-chip (SoC) or advanced package requires solutions that reduce system size and improve performance. However, this tight in... » read more

Integration Hurdles For Analog And RF In Next-Gen Packages


A rapid increase in wireless connectivity and more sensors, coupled with a shift away from monolithic SoCs toward heterogeneous integration, is driving up the amount of analog/RF content in systems and changing the dynamics within a package. Since the early 2000s, the majority of chips used at the most advanced nodes were systems-on-chip (SoCs). All features had to fit into a single planar S... » read more

Reducing Noise Issues In Microcontroller Systems: Part 1


In my ideal digital world, of which I often dream, signal voltage margins are always positive, signal timing margins are always positive, power supply voltages are always within the operating voltage range, and our environment is completely benign. Unfortunately, none of us live in this ideal world, no matter how much I would like to. The real world is dirty and noisy, and the power distribu... » read more

EMC Pre-Compliance Fundamentals


Once you’ve designed your electronic product, it’s time to release it to market, right? Well, not exactly. As with any product development, you need to first test the device you’re designing to validate that it behaves as expected. One such important test that all electronic devices must eventually pass are EMI (electromagnetic interference) compliance tests. Passing EMI tests d... » read more

Similar But Different — The Tale Of Transient And Permanent Faults


When determining whether an IC is safe from random hardware faults, applying safety metrics such as PMHF, SPFM, and LFM, engineers must analyze both transient and permanent faults. This paper highlights the fundamental differences between permanent and transient faults on digital circuits, and why this distinction is important in the context of the ISO 26262:2018 functional safety standard. ... » read more

Electromagnetic Simulation And 3D-IC Interposers


By Matt Commens, Juliano Mologni, and Pete Gasperini Today’s 3D integrated circuit (3D-IC) technology is the culmination of 40 years of research in universities and laboratories scattered across the globe. Beginning with dynamic random-access memory (DRAM) deployments that appeared on the market a decade ago, 3D-IC has since expanded its reach. It is now decisively beginning to achieve the... » read more

Clocks Getting Skewed Up


At a logical level, synchronous designs are very simple and the clock just happens. But the clocking network is possibly the most complex in a chip, and it's fraught with the most problems at the physical level. To some, the clock is the AC power supply of the chip. To others, it is an analog network almost beyond analysis. Ironically, there are no languages to describe clocking, few tools t... » read more

Parasitic Characterization Comes To Power Design Simulation


Two power design challenges are taking teams into unfamiliar territory. Wide bandgap (WBG) semiconductors target greater efficiency and density. Stricter EMI compliance regulations now come standard in mission-critical industries. Power design practices are still catching up. Simulation often takes a back seat to respinning hardware prototypes until success. What’s missing that could make sim... » read more

PCB Design Rules For Wiring And Crosstalk


Today’s electronic devices market demands miniaturized printed circuit boards (PCBs) with a multitude of high-speed functions integrated on a single board. This causes the designers to have traces routed very close to each other to optimize packaging and space. This proximity may cause unintentional coupling of electromagnetic fields, a phenomenon which we know by the name of crosstalk (see f... » read more

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