tag: ETH Zurich

Week In Review: Design, Low Power
By Marie C. Baca - 22 Dec, 2022 - Comments: 0

RISC-V The European Union said it will spend the equivalent of $286.5 million on a high performance computing ecosystem based on RISC-V. According to the call for proposals, the aim of the project is to “establish a partnership between the EuroHPC JU and a consortium of industry, research organizations and institutions in HPC to the development of innovative HPC hardware and software technol... » read more

RISC-V Pushes Into The Mainstream
By Marie C. Baca and Ed Sperling - 21 Dec, 2022 - Comments: 1

RISC-V cores are beginning to show up in heterogeneous SoCs and packages, shifting from one-off standalone designs toward mainstream applications where they are used for everything from accelerators and extra processing cores to security applications. These changes are subtle but significant. They point to a growing acceptance that chips or chiplets based on an open-source instruction set ar... » read more

Rowhammer Mitigation: In-DRAM Mechanism Scaling The Number of Refreshes With Activations (ETH Zurich)
By Technical Paper Link - 20 Dec, 2022 - Comments: 0

A technical paper titled "REGA: Scalable Rowhammer Mitigation with Refresh-Generating Activations" was written by researchers at Computer Security Group (COMSEC), ETH Zurich and Zentel Japan. The paper will be presented at IEEE's Symposium on Security and Privacy in May 2023. "With REGA, we propose the first fully in-DRAM mitigation capable of protecting devices independently from their blas... » read more

Chip Industry’s Technical Paper Roundup: Dec. 20
By Linda Christensen - 20 Dec, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=71 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us po... » read more

Step Towards A 5G Software-Defined RAN Over A Fully Open-Source Parallel RISC-V Architecture (ETH Zurich)
By Technical Paper Link - 15 Dec, 2022 - Comments: 0

A technical paper titled "Efficient Parallelization of 5G-PUSCH on a Scalable RISC-V Many-core Processor" was published by researchers at ETH Zurich. Abstract (partial) "5G Radio access network disaggregation and softwarization pose challenges in terms of computational performance to the processing units. At the physical layer level, the baseband processing computational effort is typicall... » read more

Heterogeneous Ultra-Low-Power RISC-V SoC Running Linux
By Technical Paper Link - 13 Dec, 2022 - Comments: 0

A technical paper titled "HULK-V: a Heterogeneous Ultra-low-power Linux capable RISC-V SoC" was published by researchers at University of Bologna, University of Modena and Reggio Emilia, and ETH Zurich. "We present HULK-V: an open-source Heterogeneous Linux-capable RISC-V-based SoC coupling a 64-bit RISC-V processor with an 8-core Programmable Multi-Core Accelerator (PMCA), delivering up to... » read more

Chip Industry’s Technical Paper Roundup: Dec. 5
By Linda Christensen - 05 Dec, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=67 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for u... » read more

An Arrangement of Chiplets That Outperforms A Grid Arrangement (ETH Zurich / U. of Bologna)
By Technical Paper Link - 01 Dec, 2022 - Comments: 0

A research paper titled "HexaMesh: Scaling to Hundreds of Chiplets with an Optimized Chiplet Arrangement" was published by researchers at ETH Zurich and University of Bologna. Abstract: "2.5D integration is an important technique to tackle the growing cost of manufacturing chips in advanced technology nodes. This poses the challenge of providing high-performance inter-chiplet interconnects ... » read more

Chip Industry’s Technical Paper Roundup: Nov. 21
By Linda Christensen - 21 Nov, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=65 /] » read more

Rowhammer: Recent Developments & Future Directions (ETH Zurich)
By Technical Paper Link - 20 Nov, 2022 - Comments: 0

A new technical paper titled "Fundamentally Understanding and Solving RowHammer" was published by researchers at ETH Zurich. Abstract: "We provide an overview of recent developments and future directions in the RowHammer vulnerability that plagues modern DRAM (Dynamic Random Memory Access) chips, which are used in almost all computing systems as main memory. RowHammer is the phenomenon i... » read more

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