tag: EUV

Fab Equipment Challenges For 2019
By Mark LaPedus - 17 Dec, 2018 - Comments: 0

After a period of record growth, the semiconductor equipment industry is facing a slowdown in 2019, in addition to several technical challenges that still need to be resolved. Generally, the equipment industry saw enormous demand in 2017, and the momentum extended into the first part of 2018. But then the memory market began deteriorating in the middle of this year, causing both DRAM and NAND ... » read more

Foundries See Growth, New Issues In 2019
By Mark LaPedus - 17 Dec, 2018 - Comments: 0

The silicon foundry business is poised for growth in 2019, although the industry faces several challenges across a number of market segments next year. Generally, foundry vendors saw steady growth in 2018, but many are ending the year on a sour note. Weak demand for Apple’s new iPhone XR and a downturn in the cryptocurrency market have impacted several IC suppliers and foundries, causing t... » read more

2018 eBeam Initiative Perceptions Survey Results
By eBeam Initiative - 14 Dec, 2018 - Comments: 0

EUV confidence and multi-beam remains high in the 7th Annual Perceptions Survey – 2018 (July). EUV perceptions remain positive. 82% of respondents predict EUV in HVM by end of 2021. Only 1% predict EUV will never happen. Confidence is high again for EUV lithography in high-volume manufacturing and expectations continue to grow around actinic mask inspection for EUV. Perceptions on the nee... » read more

Planarization Challenges At 7nm And Beyond
By Ed Sperling - 10 Dec, 2018 - Comments: 0

Dan Sullivan, executive director of semiconductor technology at Brewer Science, digs into the challenges of planarizing a thin film on a wafer for etch and optical control. The problem becomes more difficult at advanced nodes because the films are thinner. https://youtu.be/iNA6EGpoYZU     _________________________________ See more tech talk videos here   » read more

EUV Mask Blank Battle Brewing
By Mark LaPedus - 15 Nov, 2018 - Comments: 2

Amid the ramp of extreme ultraviolet (EUV) lithography in the market, suppliers of EUV mask blanks are expanding their production. And a new player—Applied Materials—is looking to enter the market. AGC and Hoya, the two main suppliers of EUV mask blanks, are adding capacity for these critical components that are used for EUV photomasks. A mask blank serves as the substrate for a photomas... » read more

Multi-Beam Mask Writing Finally Comes Of Age
By Mark LaPedus - 15 Nov, 2018 - Comments: 0

Elmar Platzgummer, chief executive of IMS Nanofabrication, sat down with Semiconductor Engineering to discuss photomask and mask writing trends. IMS, a subsidiary of Intel, is a supplier of multi-beam e-beam systems for photomask production. What follows are excerpts of that conversation. SE: For years, photomask makers have used single-beam e-beam tools to pattern or write the features on ... » read more

Using DSA With EUV
By Ed Sperling - 05 Nov, 2018 - Comments: 1

James Lamb, deputy CTO for advanced semiconductor manufacturing and corporate technical fellow at Brewer Science, looks at how directed self-assembly can be used to supplement EUV at advanced nodes. https://youtu.be/PItF4egHOxc     See other tech talk videos here » read more

The Impact of Moore’s Law Ending
By Brian Bailey - 29 Oct, 2018 - Comments: 2

Over the past couple of process nodes the chip industry has come to grips with the fact that Moore's Law is slowing down or ending for many market segments. What isn't clear is what comes next, because even if chipmakers stay at older nodes they will face a series of new challenges that will drive up costs and increase design complexity. Chip design has faced a number of hurdles just to get ... » read more

Wanted: Mask Equipment for Mature Nodes
By Mark LaPedus - 18 Oct, 2018 - Comments: 0

Rising demand for chips at mature nodes is impacting the photomask supply chain, causing huge demand for trailing-edge masks and a shortfall of older mask equipment. The big issue is the equipment shortfall, which could impact customers on several fronts. Tool shortages could lead to longer mask turnaround times and delivery schedules for chips being developed at 90nm and above, which are bu... » read more

EUV Pellicle, Uptime And Resist Issues Continue
By Mark LaPedus - 26 Sep, 2018 - Comments: 0

Extreme ultraviolet (EUV) lithography is moving closer to realization, but several problems involving scanner uptime, photoresists and pellicles need to be resolved before this long-overdue technology is put into full production. Intel, Samsung and TSMC are hoping to insert EUV into production at 7nm and/or 5nm. While the remaining issues don’t necessarily pre-empt using EUV, they do affec... » read more

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