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Fab Fingerprint For Proactive Yield Management


The following paper presents a case study describing how to improve yield and fab productivity by implementing a frequent pattern database that utilizes artificial intelligence-based spatial pattern recognition (SPR) and wafer process history. This is important because associating spatial yield issues with process and tools is often performed as a reactive analysis, resulting in increased wafer... » read more

Making Sure AI/ML Works In Test Systems


Artificial intelligence/machine learning is being utilized increasingly to find patterns and outlier data in chip manufacturing and test, improving the overall yield and reliability of end devices. But there are too many variables and unknowns to reliably predict how a chip will behave in the field using just AI. Today, every AI use case — whether a self-driving car or an industrial sortin... » read more

What’s WAT? An Overview Of WAT/PCM Data


Wafer acceptance testing (WAT) also known as process control monitoring (PCM) data is data generated by the fab at the end of manufacturing and generally made available to the fabless customer for every wafer. The data will typically have between forty and one hundred tests, each test having a result for each site (or “drop-in”) on the wafer. The sites are located so that the fab can monito... » read more

Upturn Seen In Semi Equipment Biz


Business continues to get better in the semiconductor equipment sector. VLSI Research, for one, has raised its forecast in the arena. But there is still some uncertainty amid mixed growth for semiconductors, trade wars and other factors. After a downturn in 2019, the semiconductor equipment market expected an upturn in 2020. Then, the Covid-19 pandemic struck. Suddenly, a large percentage... » read more

Manufacturing Bits: Oct. 15


Sandia’s fab upgrade Sandia National Laboratories has completed the first phase of a three-year upgrade program in its semiconductor wafer fab. The goal of the program is to convert Sandia’s Albuquerque, N.M.-based fab from 150mm (6-inch) to 200mm (8-inch) wafer sizes. As part of the move, Sandia is converting its 0.35-micron (350nm) rad-hard process from 150mm to 200mm. The process is ... » read more

Week In Review: Manufacturing, Test


Chipmakers Shares of Intel fell amid lackluster results for the company, according to a report from CNBC. But Intel is also boosting its capital spending to $15.5 billion, according to the report. Here’s more on Intel from PC World. Meanwhile, Intel is expanding its research fab in Oregon, dubbed D1X, according to a report from The Oregonian. The company is in the process of building an ... » read more

5 Observations From Intel’s Event


Not long ago, Intel hosted its “Architecture Day,” where top executives from the chip giant revealed the company’s latest products and next-generation technologies. The company also discussed its strategy. To be sure, it’s a critical time for Intel. In June, Brian Krzanich was forced out as chief executive and the company is still looking for a permanent CEO. Plus, Intel has delayed it... » read more

Week In Review: Manufacturing, Test


Packaging Brewer Science has introduced the latest additions to its family of temporary bonding materials. The company also rolled out its new line of thin spin-on packaging materials. The company’s temporary bonding materials are called BrewerBOND. The new products, called the BrewerBOND T1100 and BrewerBOND C1300 series, are combine to create a dual-layer system for temporary bonding a... » read more

The Week In Review: Manufacturing


Chipmakers Through a joint venture with the government of Chongqing, GlobalFoundries will take over an existing 200mm fab in China. Then, GlobalFoundries plans to retrofit the facility and turn it into a 300mm fab. The foundry vendor is transferring its 180nm and 130nm processes to the China fab. Meanwhile, TSMC, UMC and others are also building fabs in China. Samsung Electronics has begu... » read more

10nm Fab Watch


When will the 10nm logic node happen? Analysts believe that foundry vendors will move into 10nm finFET volume production around 2017. Still others say the 10nm finFET ramp could take place anywhere from 2018 to 2020. The predictions are all over the map. One way to predict the timing, progress and demand for 10nm is simple: Follow the fabs. In fact, Intel, Samsung, TSMC and GlobalFound... » read more

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