tag: Georgia Tech

ISA and Microarchitecture Extensions Over Dense Matrix Engines to Support Flexible Structured Sparsity for CPUs (Georgia Tech, Intel Labs)
By Technical Paper Link - 24 Feb, 2023 - Comments: 0

A technical paper titled "VEGETA: Vertically-Integrated Extensions for Sparse/Dense GEMM Tile Acceleration on CPUs" was published (preprint) by researchers at Georgia Tech and Intel Labs. Abstract: "Deep Learning (DL) acceleration support in CPUs has recently gained a lot of traction, with several companies (Arm, Intel, IBM) announcing products with specialized matrix engines accessible v... » read more

Week In Review: Semiconductor Manufacturing, Test
By Karen Heyman - 06 Jan, 2023 - Comments: 0

TSMC is in advanced talks with key suppliers about setting up its first potential European plant in Dresden, Germany, according to Nikkei Asia. The company held a 3nm volume production and capacity expansion ceremony at its Fab 18. TSMC also is building 3nm capacity at its Arizona site, as well as opening a global R&D Center in the Hsinchu Science Park in the second quarter of 2023, to be ... » read more

Week In Review: Design, Low Power
By Marie C. Baca - 06 Jan, 2023 - Comments: 0

Top Of The News Google announced it will support the RISC-V architecture with the Android open-source operating system. In a keynote at the RISC-V Summit, Lars Bergstrom, Google's director of engineering for the Android Platform Programming Languages, noted that Android currently has more than 3 billion users and the support of more than 24,000 vendors. "We've been following RISC-V for a very ... » read more

Chip Industry’s Technical Paper Roundup: Jan 3
By Linda Christensen - 03 Jan, 2023 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=72 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us ... » read more

Graphene-Based Electronics (Georgia Tech)
By Technical Paper Link - 02 Jan, 2023 - Comments: 0

A technical paper titled "An epitaxial graphene platform for zero-energy edge state nanoelectronics" was published by researchers at Georgia Tech, Tianjin University, CNRS, Synchrotron SOLEIL, National High Magnetic Field Laboratory and others. “Graphene’s power lies in its flat, two-dimensional structure that is held together by the strongest chemical bonds known,” said Walter de Heer... » read more

Chip Industry’s Technical Paper Roundup: Dec. 5
By Linda Christensen - 05 Dec, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=67 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for u... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 02 Dec, 2022 - Comments: 0

Automotive, Mobility The U.S. space agency NASA entered a $57.2 million contract with ICON to develop technology to build roads on the moon. ICON, a Texas-based 3D printing construction company, has been working with NASA and the U.S. Air Force on construction technologies that can use local materials to build infrastructure on Mars. NASA is working on advanced 3D printing construction systems... » read more

HW Security: Fingerprints Of Digital Circuits Using Electromagnetic Side-Channel Sensing & Simulations (Georgia Tech)
By Technical Paper Link - 01 Dec, 2022 - Comments: 0

A technical paper titled "Circuit Activity Fingerprinting Using Electromagnetic Side-Channel Sensing and Digital Circuit Simulations" was published by researchers at Georgia Tech. The work "introduces a novel circuit identification method based on “fingerprints” of periodic circuit activity that does not rely on any circuit-specific reference measurements. We capture these “fingerprint... » read more

Blog Review: Oct. 5
By Jesse Allen - 05 Oct, 2022 - Comments: 0

Arm's Andrew Pickard chats with Georgia Tech's Azad Naeemi and Da Eun Shim about an effort to evaluate the benefit of new interconnect materials and wire geometry and determine their impacts at the microprocessor level. Synopsys' Shekhar Kapoor shares highlights from a recent panel exploring the promises, challenges, and realities of 3D IC technology, including the potential of 3D nanosystem... » read more

Strengthening The Global Semi Supply Chain
By Ann Mutschler - 22 Sep, 2022 - Comments: 0

Within the semiconductor ecosystem, there are a number of dynamics pointing to the need for new ways of partnering in more meaningful ways that bring resiliency to the global semiconductor supply chain. One of these is the move to bespoke silicon, stemming from a shift in the companies that create most SoCs today -- the hyperscalar cloud providers. These market leaders know their workloads so w... » read more

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