Manufacturing Bits: May 26

By Mark LaPedus - 26 May, 2020 - Comments: 0

7-level nanosheets The 2020 Symposia on VLSI Technology & Circuits for the first time will be held as a virtual conference. The event, to be held from June 15-18, is organized around the theme “The Next 40 Years of VLSI for Ubiquitous Intelligence.” Among the papers at the event include advanced nanosheet transistors, 3D stacked memory devices and even an artificial iris. At the ... » read more

Manufacturing Bits: May 19

By Mark LaPedus - 19 May, 2020 - Comments: 0

Virus simulations Using an advanced building simulator and testbed, Lawrence Berkeley National Laboratory (Berkeley Lab) is launching a study of the risk of airborne transmission of viruses in buildings. Researchers will also explore the ways to mitigate those risks. The experiments will take place in Berkeley Lab’s FLEXLAB, which is an advanced building simulator. Used by builders, archi... » read more

Next EUV Issue: Mask 3D Effects

By Mark LaPedus - 25 Apr, 2018 - Comments: 6

As extreme ultraviolet (EUV) lithography moves closer to production, the industry is paying more attention to a problematic phenomenon called mask 3D effects. Mask 3D effects involve the photomask for EUV. In simple terms, a chipmaker designs an IC, which is translated from a file format into a photomask. The mask is a master template for a given IC design. It is placed in a lithography scan... » read more

Power/Performance Bits: July 26

By Jesse Allen - 26 Jul, 2016 - Comments: 0

Flexible MRAM Researchers from the National University of Singapore, Yonsei University, Ghent University and Singapore's Institute of Materials Research and Engineering embedded a magnetic memory chip on a plastic material, flexible enough to be bent into a tube. The new device operates on magnetoresistive random access memory (MRAM), which uses a magnesium oxide (MgO)-based magnetic tunn... » read more

Manufacturing Bits: Sept. 22

By Mark LaPedus - 22 Sep, 2015 - Comments: 0

Superconductor puddles Superconductors are devices that have zero electrical resistance, making them attractive for a range of applications. But superconductors must be cooled down to temperatures near zero to work, which, in turn, limits their applications. High-temperature superconductors are more promising technologies, but once again, they must be cooled down to function. The industr... » read more

System Bits: Feb. 17

By Ann Mutschler - 17 Feb, 2015 - Comments: 2

Can you hear light? Silicon photonics has gained increasing attention as a key driver of lab-on-a-chip biosensors and of faster-than-electronics communication between computer chips. The technology builds on tiny structures known as silicon photonic wires. The wires work because light moves slower in the silicon core than in surrounding air and glass. Thus, the light is trapped inside the wire... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer