Week In Review: Auto, Security, Pervasive Computing

By Liz Allan - 01 Sep, 2023 - Comments: 0

The U.S. Department of Energy (DOE) announced $15.5 billion in funding and loans for retooling existing automotive factories for the transition to electric vehicles (EVs) and supporting local jobs, plus a notice of intent for $3.5 billion in funding to expand domestic manufacturing of batteries for EVs and the nation’s grid, and for battery materials and components that are currently imported... » read more

Formally Modeling A Security Monitor For Virtual Machine-Based Confidential Computing Systems (IBM)

By Technical Paper Link - 28 Aug, 2023 - Comments: 0

A technical paper titled “Towards a Formally Verified Security Monitor for VM-based Confidential Computing” was published by researchers at IBM Research and IBM T.J. Watson Research Center. Abstract: "Confidential computing is a key technology for isolating high-assurance applications from the large amounts of untrusted code typical in modern systems. Existing confidential computing syste... » read more

Chip Industry’s Technical Paper Roundup: May 23

By Linda Christensen - 23 May, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=104 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us... » read more

Optimizing Projected PCM for Analog Computing-In-Memory Inferencing (IBM)

By Technical Paper Link - 22 May, 2023 - Comments: 0

A new technical paper titled "Optimization of Projected Phase Change Memory for Analog In-Memory Computing Inference" was published by researchers at IBM Research. "A systematic study of the electrical properties-including resistance values, memory window, resistance drift, read noise, and their impact on the accuracy of large neural networks of various types and with tens of millions of wei... » read more

Innovations in Device Design of The Gate-All-Around (GAA) Nanosheet FETs (IBM Research)

By Technical Paper Link - 23 Mar, 2023 - Comments: 0

A technical paper titled "A Review of the Gate-All-Around Nanosheet FET Process Opportunities" was published by researchers at IBM Research Albany. Abstract: "In this paper, the innovations in device design of the gate-all-around (GAA) nanosheet FET are reviewed. These innovations span enablement of multiple threshold voltages and bottom dielectric isolation in addition to impact of channel... » read more

Big Changes Ahead In Power Delivery, Materials, And Interconnects

By Laura Peters - 22 Mar, 2023 - Comments: 0

Part one of this forecast looked at evolving transistor architectures and lithography platforms. This report examines revolutions in interconnects and packaging. When it comes to device interconnects, it’s hard to beat copper. Its low resistivity and high reliability have served the industry exceedingly well as both on-chip interconnect and wires between chips. But in logic chips, with int... » read more

Chip Industry’s Technical Paper Roundup: Feb. 14

By Linda Christensen - 14 Feb, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=80 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us p... » read more

Week In Review: Design, Low Power

By Jesse Allen - 20 Jan, 2023 - Comments: 0

Worldwide semiconductor revenue increased 1.1% in 2022 to $601.7 billion, up from $595 billion in 2021, according to preliminary results from Gartner. The combined revenue of the top 25 semiconductor vendors increased 2.8% in 2022 and accounted for 77.5% of the market. The memory segment posted a 10% revenue decrease. Analog showed the strongest growth, up 19% from 2021, followed by discretes, ... » read more

Can ML Help Verification? Maybe

By Brian Bailey - 22 Sep, 2022 - Comments: 0

Functional verification produces an enormous amount of data that could be used to train a machine learning system, but it's not always clear which data is useful or whether it can help. The challenge with ML is understanding when and where to use it, and how to integrate it with other tools and approaches. With a big enough hammer, it is tempting to call everything a nail, and just throwing ... » read more

Cryogenic CMOS Becomes Cool

By Brian Bailey - 11 Aug, 2022 - Comments: 1

Cryogenic CMOS is a technology on the cusp, promising higher performance and lower power with no change in fabrication technology. The question now is whether it becomes viable and mainstream. Technologies often appear to be just on the horizon, not quite making it, but never too far out of sight. That's usually because some issue plagues it, and the incentive is not big enough to solve the ... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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