tag: imec

Manufacturing Bits: March 11
By Mark LaPedus - 11 Mar, 2019 - Comments: 0

Measuring molecules The Technical University of Munich (TUM) has developed a new metrology technique that determines the properties of individual molecules. The technique, called single-molecule excitation–emission spectroscopy, improves upon the traditional methods to explore molecules. The traditional method, dubbed single-molecule spectroscopy (SMS), is not new and is used to analyze f... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 01 Mar, 2019 - Comments: 1

Trade Trade tensions between the United States and China continue. The U.S. last year slapped a 10% tariff on $200 billion worth of Chinese goods. China retaliated with a 10% tariff on $60 billion of U.S. imports. The U.S. said it wants to increase the tariffs on Chinese goods to 25%, but that action has been postponed. This was the week that the U.S. was supposed to raise tariffs by 25%. I... » read more

The Good And Bad Of 2D Materials
By Katherine Derbyshire - 27 Feb, 2019 - Comments: 0

Despite years of warnings about reaching the limits of silicon, particularly at leading-edge process nodes where electron mobility is limited, there still is no obvious replacement. Silicon’s decades-long dominance of the integrated circuit industry is only partly due to the material’s electronic properties. Germanium, gallium arsenide, and many other semiconductors offer superior mobili... » read more

Comparative Stochastic Process Variation Bands For N7, N5, And N3 At EUV
By KLA - 21 Feb, 2019 - Comments: 0

By Alessandro Vaglio Preta, Trey Gravesa, David Blankenshipa, Kunlun Baib, Stewart Robertsona, Peter De Bisschopc, John J. Biaforea a) KLA-Tencor Corporation, Austin, TX 78759, U.S.A. b) KLA-Tencor Corporation, Milpitas, CA 95035, U.S.A. c) IMEC, Kapeldreef 75, 3000, BE ABSTRACT Stochastics effects are the ultimate limiter of optical lithography technology and are a major concern for n... » read more

Lithography Challenges For Fan-out
By Mark LaPedus - 12 Feb, 2019 - Comments: 3

Higher density fan-out packages are moving toward more complex structures with finer routing layers, all of which requires more capable lithography equipment and other tools. The latest high-density fan-out packages are migrating toward the 1µm line/space barrier and beyond, which is considered a milestone in the industry. At these critical dimensions (CDs), fan-outs will provide better per... » read more

In-Memory Computing Challenges Come Into Focus
By Katherine Derbyshire - 06 Feb, 2019 - Comments: 6

For the last several decades, gains in computing performance have come by processing larger volumes of data more quickly and with superior precision. Memory and storage space are measured in gigabytes and terabytes now, not kilobytes and megabytes. Processors operate on 64-bit rather than 8-bit chunks of data. And yet the semiconductor industry’s ability to create and collect high quality ... » read more

China’s Foundry Biz Takes Big Leap Forward
By Mark LaPedus - 28 Jan, 2019 - Comments: 1

China continues to advance its foundry industry with huge investments in new fabs and technology, despite trade tensions and a slowdown in the IC market. China has the most fab projects in the world, with 30 new facilities or lines in construction or on the drawing board, according to data from SEMI’s World Fab Forecast Report. Of those, 13 fabs are targeted for the foundry market, accordi... » read more

What’s Next For AI, Quantum Chips
By Mark LaPedus - 24 Jan, 2019 - Comments: 1

Semiconductor Engineering sat down to discuss the latest R&D trends with Luc Van den hove, president and chief executive of Imec; Emmanuel Sabonnadière, chief executive of Leti; and An Chen, executive director for the Nanoelectronics Research Initiative at the Semiconductor Research Corp. (SRC). Chen is on assignment from IBM. What follows are excerpts of those conversations, which took pl... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 11 Jan, 2019 - Comments: 0

Trade and fab equipment The SEMI Industry Strategy Symposium (ISS) this week opened with the theme “Golden Age of Semiconductor: Enabling the Next Industrial Revolution.” The annual three-day conference gave the year’s first outlook of the global electronics manufacturing industry. Click here for a recap. SEMI and Imec are joining forces to drive innovation and deepen industry align... » read more

Manufacturing Bits: Jan. 2
By Mark LaPedus - 02 Jan, 2019 - Comments: 0

Better nanowire MOSFETs At the recent IEEE International Electron Devices Meeting (IEDM), Imec and Applied Materials presented a paper on a new and improved way to fabricate vertically stacked gate-all-around MOSFETs. More specifically, Imec and Applied reported on process improvements for a silicon nanowire MOSFET, which is integrated in a CMOS dual work function metal replacement metal ga... » read more

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