tag: imec

Week In Review: Manufacturing, Test
By Ed Sperling - 25 Jun, 2021 - Comments: 0

Lots more fabs and capacity The chip industry sees opportunity in shortages, and is racing to meet demand. SEMI reports 19 new worldwide high-volume fabs already have started construction, or will start by end of this year, and another 10 are scheduled in 2022. “Equipment spending for these 29 fabs is expected to surpass $140 billion over the next few years as the industry pushes to addre... » read more

Bumps Vs. Hybrid Bonding For Advanced Packaging
By Mark LaPedus - 23 Jun, 2021 - Comments: 3

Advanced packaging continues to gain steam, but now customers must decide whether to design their next high-end packages using existing interconnect schemes or move to a next-generation, higher-density technology called copper hybrid bonding. The decision is far from simple, and in some cases both technologies may be used. Each technology adds new capabilities in next-generation advanced pac... » read more

Thinner Channels With 2D Semiconductors
By Katherine Derbyshire - 21 Jun, 2021 - Comments: 0

Moving to future nodes will require more than just smaller features. At 3/2nm and beyond, new materials are likely to be added, but which ones and exactly when will depend upon an explosion of material science research underway at universities and companies around the globe. With field-effect transistors, a voltage applied to the gate creates an electric field in the channel, bending the ban... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 18 Jun, 2021 - Comments: 0

Fab tools TEL plans to ship its leading-edge coater/developer system to the joint Imec-ASML research lab, which is working on high-NA extreme ultraviolet (EUV) lithography. The equipment will be integrated with the EXE:5000, ASML’s next-generation high-NA EUV lithography system. The 0.55 numerical aperture (NA) tool is slated to be operational in 2023. Today's EUV is in production, but there... » read more

Finding, Predicting EUV Stochastic Defects
By Mark LaPedus - 17 Jun, 2021 - Comments: 0

Several vendors are rolling out next-generation inspection systems and software that locates problematic defects in chips caused by processes in extreme ultraviolet (EUV) lithography. Each defect detection technology involves various tradeoffs. But it’s imperative to use one or more of them in the fab. Ultimately, these so-called stochastic-induced defects caused by EUV can impact the perf... » read more

Manufacturing Bits: May 25
By Mark LaPedus - 25 May, 2021 - Comments: 0

Higher voltage GaN Imec and Aixtron have demonstrated the ability to extend gallium-nitride (GaN) to new voltage levels in the power semiconductor market, enabling the technology to compete in much broader segments. Imec and Aixtron have demonstrated epitaxial growth of GaN buffer layers qualified for 1,200-volt applications on specialized 200mm substrates with a hard breakdown exceeding 1,... » read more

Manufacturing Bits: April 27
By Mark LaPedus - 27 Apr, 2021 - Comments: 0

Next-gen neuromorphic computing The European Union (EU) has launched a new project to develop next-generation devices for neuromorphic computing systems. The project, called MeM-Scales, plans to develop a novel class of algorithms, devices, and circuits that reproduce multi-timescale processing of biological neural systems. The results will be used to build neuromorphic computing systems th... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 23 Apr, 2021 - Comments: 0

Chipmakers and OEMs Several foundry vendors are building new fabs. The memory vendors, such as Samsung and SK Hynix, are also building new capacity. In another example, Taiwan DRAM supplier Nanya Technology plans to construct a new 300mm fab in the Taishan Nanlin Technology Park in New Taipei City. The plant will produce DRAMs with Nanya’s in-house developed 10nm-class process technologies a... » read more

Making Chip Packaging More Reliable
By Mark LaPedus - 15 Apr, 2021 - Comments: 0

Packaging houses are readying the next wave of IC packages, but these products must prove to be reliable before they are incorporated into systems. These packages involve several advanced technologies, such as 2.5D/3D, chiplets and fan-out, but vendors also are working on new versions of more mature package types, like wirebond and leadframe technologies. As with previous products, packaging... » read more

EUV Pellicles Finally Ready
By Mark LaPedus - 22 Mar, 2021 - Comments: 0

After a period of delays, EUV pellicles are emerging and becoming a requirement in high-volume production of critical chips. At the same time, the pellicle landscape for extreme ultraviolet (EUV) lithography is changing. ASML, the sole supplier of EUV pellicles, is transferring the assembly and distribution of these products to Mitsui. Others are also developing pellicles for EUV, a next-gen... » read more

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