Data Converters For Automotive Applications

By Manuel Mota - 04 Oct, 2018 - Comments: 0

Sensor applications requiring data converters range from temperature sensors identifying different engine status to radar/LIDAR enabling Automotive Driver Assistance Systems (ADAS). Other applications involving data converters include wireless transceivers for communicating with other vehicles or with a fixed network. The data converter IP (analog-to-digital and digital-to-analog) provides an i... » read more

Week In Review: Design, Low Power

By Jesse Allen - 21 Sep, 2018 - Comments: 0

Tools & IP Cadence unveiled deep neural-network accelerator (DNA) AI processor IP, Tensilica DNA 100, targeted at on-device neural network inference applications. The processor is scalable from 0.5 TMAC (Tera multiply-accumulate) to 12 TMACs, or 100s of TMACs with multiple processors stacked, and the company claims it delivers up to 4.7X better performance and up to 2.3X more performance p... » read more

Auto Chip Design, Test Changes Ahead

By Kevin Fogarty - 19 Sep, 2018 - Comments: 0

The automotive industry’s unceasing demand for performance, coupled with larger and more complex processors, are driving broad changes in how electronics are designed, verified and tested. What's changing is that these systems, which include AI-oriented logic developed at the most advanced process nodes, need to last several times longer than traditional IT and consumer devices, and they n... » read more

Chipping Away At Functional Safety Flaws In Automotive Electronics

By Ansys - 17 Sep, 2018 - Comments: 0

Today’s automobiles are packed with electronics. From autonomous driving support and infotainment systems to mission-critical functions like braking, a car’s performance depends on the reliability of these electronics systems. While the semiconductors that lie at the heart of these systems have been not been a focus in the past, today their reliability is coming under closer scrutiny by bot... » read more

Aging In Advanced Nodes

By Ann Mutschler - 17 Sep, 2018 - Comments: 0

Semiconductor Engineering sat down to discuss design reliability and circuit aging with João Geada, chief technologist for the semiconductor business unit at ANSYS; Hany Elhak, product management director, simulation and characterization in the custom IC and PCB group at Cadence; Christoph Sohrmann, advanced physical verification at Fraunhofer EAS; Magdy Abadir, vice president of marketing at ... » read more

IP For Centralized ADAS Domain Controllers

By Synopsys - 12 Sep, 2018 - Comments: 0

A centralized architecture is becoming more popular to integrate the ADAS applications into a centralized ADAS domain controller. A centralized architecture reduces cost, minimizes development of separate software applications and reduces system complexity. As automakers adopt multi-domain controllers with centralized ADAS processors, the required performance and functionality of the ADAS proce... » read more

Build In Functional Safety Early

By Robert Vamosi - 06 Sep, 2018 - Comments: 0

In the automotive world, recalls for electronics affect about five percent of the vehicles on the road. That means 5 out of every 100 vehicles today have a problem with their electronics. If we want to see more autonomous driving vehicles, that number must be improved. There needs be more robustness in the development process. Making cars safer today is Advanced Driver Assistance System (ADA... » read more

How To Efficiently Achieve ASIL-D Compliance Using NoC Technology

By Arteris - 05 Sep, 2018 - Comments: 0

Increasing layers of electronics and software are being added to vehicles, from infotainment to engine, brakes, and various sensors for ADAS and autonomous driving. To address the increasing use of electronics in automobiles, the ISO 26262 Functional Safety for Road Vehicles standard was developed. This standard is intended to ensure that the electronics are designed to specified levels in o... » read more

Demystifying EDA Support For ISO 26262 Tool Qualification

By Sergio Marchese - 23 Aug, 2018 - Comments: 0

My new, mid-size car is equipped with many advanced driver-assistance systems. To be honest, it’s taking me time to get used to some of them, as, for example, lane-centering assist that seamlessly takes control of my steering wheel. However, I cannot wait to get my hands off a fully autonomous vehicle and be able to take a nap while 7nm chips run machine learning and other artificial intellig... » read more

Big Shifts In Tech Conferences

By Ed Sperling - 16 Aug, 2018 - Comments: 0

By Ed Sperling and Katherine Derbyshire Identifying central themes in technology conferences, or finding enough latitude where the theme is extremely well defined, is becoming challenging throughout the tech industry. Throughout the semiconductor industry, in particular, many are asking how various organizations will differentiate conferences in the future and who will be the target audience... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: ISO 26262