tag: Lam Research

Using Data To Improve Yield
By Jeff Dorsch - 17 Aug, 2017 - Comments: 0

Semiconductor manufacturers are always looking for an edge to improve operating efficiency and to increase yields on chip lots. For some, the answers include big data analytics, as well as technology to move that data around more quickly. Chipmakers, board assemblers, and related businesses are turning to the Internet of Things, especially [getkc id="78" kc_name="Industrial IoT"] technology... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 11 Aug, 2017 - Comments: 0

Fab tools Lam Research held an analyst event this week. The company indicated that the industry is in the midst of a memory boom, including both DRAM and 3D NAND. According to Amit Daryanani, an analyst with RBC, here was one of the big takeaways at the event: “The memory spend portion of WFE is more sustainable than previously assumed due to end-market drivers such as big data, automation, ... » read more

Rethinking Computing Fundamentals
By Ed Sperling - 10 Aug, 2017 - Comments: 0

New compute architectures—not just new chips—are becoming a common theme in Silicon Valley these days. The whole semiconductor industry is racing to find the fastest, cheapest, lowest-power approach to processing. The drivers of this shift are well documented. Moore's Law is slowing down, in part because it's becoming more difficult to route signals across an SoC at the latest process no... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 28 Jul, 2017 - Comments: 0

Chipmakers UMC has generated sales from its recently-announced 14nm finFET technology. The foundry vendor also plans to enter the 22nm process technology market. UMC will join other players in the 22nm arena, such as GlobalFoundries, Intel and TSMC. “So we do have a plan to introduce our 22nm as well and it will be available around 2018,” said Jason Wang, the newly appointed co-president o... » read more

Blog Review: July 26
By Jesse Allen - 26 Jul, 2017 - Comments: 1

Mentor's Dan Driscoll digs into designing for safety and security on the Xilinx UltraScale+ MPSoC and the different mechanisms that support subsystem isolation. Cadence's Paul McLellan listens in on a talk by Bosch's Volkmar Denner on the future of communications and AI in connected autos. Synopsys' Robert Vamosi points to a recently-discovered vulnerability that could be present in thous... » read more

What’s After FinFETs?
By Mark LaPedus - 24 Jul, 2017 - Comments: 3

Chipmakers are readying their next-generation technologies based on 10nm and/or 7nm finFETs, but it's still not clear how long the finFET will last, how long the 10nm and 7nm nodes for high-end devices will be extended, and what comes next. The industry faces a multitude of uncertainties and challenges at 5nm, 3nm and beyond. Even today, traditional chip scaling continues to slow as process ... » read more

Blog Review: July 5
By Jesse Allen - 05 Jul, 2017 - Comments: 0

Cadence's Paul McLellan checks out the current state of System-in-Package technology and how different products incorporate SiP. Synopsys' Robert Vamosi digs into the differences between two major recent ransomware outbreaks, WanaCry and Petya. A Mentor staff writer shares some highlights from this year's DAC. ARM's Rene Haas examines what consumers think about AI and the impact it wil... » read more

Blog Review: June 28
By Jesse Allen - 28 Jun, 2017 - Comments: 0

Mentor's Craig Armenti notes the benefits, and challenges, of investing in modular design in the PCB domain. Cadence's Paul McLellan covers a DAC chat with CEO Lip-Bu Tan on the rise of advanced packaging and investments in AI and autonomous driving. Synopsys' Jim Hartnett examines some of the challenges and tradeoffs involved in building good security practices in hospital environments. ... » read more

Blog Review: June 21
By Jesse Allen - 21 Jun, 2017 - Comments: 0

Mentor's John McMillan looks into the unique form-factors and components influencing IoT PCB designs. Cadence's Paul McLellan notes some big topics at the Samsung Foundry Forum: FD-SOI, embedded MRAM, and which gate-all-around FET architecture may be the winner. Synopsys' Eric Huang has a lighthearted look at why to buy IP versus building it. Rambus' Aharon Etengoff points to another U... » read more

NAND Market Hits Speed Bump
By Mark LaPedus - 21 Jun, 2017 - Comments: 5

Demand for NAND flash memory remains robust due to the onslaught of data in systems, but the overall NAND flash market is stuck in the middle of a challenging period beset by product shortages, supply chain issues and a difficult technology transition. Intel, Micron, Samsung, SK Hynix and the Toshiba/Western Digital duo continue to ship traditional planar NAND in the market, but this technol... » read more

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