Mixed Picture Seen For EUV Masks


The confidence level of extreme ultraviolet (EUV) lithography continues to grow as the technology moves into production, but the EUV mask infrastructure remains a mixed picture, according to new surveys released by the eBeam Initiative. The EUV mask infrastructure involves several technologies that are in various stages of development. On one front, the outlook for several mask tool technol... » read more

Week In Review: Manufacturing, Test


Chipmakers and OEMs Delphi Technologies is in volume production with a 800 volt silicon carbide (SiC) inverter for next-generation electric and hybrid vehicles. The inverter extends electric vehicle (EV) ranges. It also halves the charging times compared with today's 400 volt systems. In a separate announcement, Delphi Technologies and Cree have announce a partnership to utilize SiC semicon... » read more

Week In Review: Manufacturing, Test


Trade wars Talks between the United States and China continue to stall and the two nations are still embroiled in a trade war. So this week, U.S. President Donald Trump would like to impose a 10% tariff on the remaining $300 billion list of China-based imports starting Sept. 1, according to a report from Reuters. This in turn will impact the electronics and IC industries. In response to the... » read more

Inspection, Metrology Challenges Grow For SiC


Inspection and metrology are becoming more critical in the silicon carbide (SiC) industry amid a pressing need to find problematic defects in current and future SiC devices. Finding defects always has been a challenging task for SiC devices. But it’s becoming more imperative to find killer defects and reduce them as SiC device vendors begin to expand their production for the next wave of a... » read more

EUV Pellicle, Uptime And Resist Issues Continue


Extreme ultraviolet (EUV) lithography is moving closer to realization, but several problems involving scanner uptime, photoresists and pellicles need to be resolved before this long-overdue technology is put into full production. Intel, Samsung and TSMC are hoping to insert EUV into production at 7nm and/or 5nm. While the remaining issues don’t necessarily pre-empt using EUV, they do affec... » read more

What’s Missing In EUV?


Extreme ultraviolet (EUV) lithography is expected to move into production at 7nm and/or 5nm, but as previously reported, there are some gaps in the arena. At one time, the power source was the big problem, but that appears to be solved in the near term. Now, a phenomenon called stochastic effects, or random variations, are the biggest challenge for EUV lithography. But at most events, th... » read more

Searching For EUV Mask Defects


Chipmakers hope to insert extreme ultraviolet (EUV) lithography at 7nm and/or 5nm, but several challenges need to be solved before this technology can be used in production. One lingering issue that is becoming more worrisome is how to find [gettech id="31045" comment="EUV"] mask defects. That isn't the only issue, of course. The industry continues to work on the power source and resists. Bu... » read more

5 Takeaways From BACUS


As usual, the recent SPIE Photomask Technology Conference, sometimes called BACUS, was a busy event. The event, which took place in San Jose, Calif., featured presentations on the usual subjects in the photomask sector. There were presentations on mask writers, inspection, metrology, repair and cleaning. And, of course, the papers included masks based on extreme ultraviolet (EUV) lithography... » read more

Mask Maker Worries Grow


Leading-edge photomask makers face a multitude of challenges as they migrate from the 14nm node and beyond. Mask making is becoming more challenging and expensive at each node on at least two fronts. On one front, mask makers must continue to invest in the development of traditional optical masks at advanced nodes. On another front, several photomask vendors are preparing for the possible ra... » read more

Gaps Remain For EUV Masks


Extreme ultraviolet (EUV) lithography is once again at a critical juncture. The oft-delayed technology is now being targeted for 7nm. But there are still a number of technologies that must come together before EUV is inserted into mass production at that node. First, the EUV source must generate more power. Second, tool uptime must improve. Third, the industry needs better EUV resists. A... » read more

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