Manufacturing Bits: Sept. 17

By Mark LaPedus - 17 Sep, 2019 - Comments: 0

Full-chip inverse lithography D2S has developed new hardware and software that enables a long-awaited technology--full-chip masks using inverse lithography technology (ILT). For years, ILT has been a promising technology. ILT is a next-generation reticle enhancement technique (RET) that enables an optimal photomask pattern for both optical and extreme ultraviolet (EUV) lithography reticles.... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 30 Aug, 2019 - Comments: 0

Chipmakers GlobalFoundries has filed suits in the U.S. and Germany, alleging that semiconductor manufacturing technologies used by TSMC infringe upon 16 of GF's patents. The suits were filed in the U.S. International Trade Commission (ITC), the U.S. Federal District Courts in the Districts of Delaware and the Western District of Texas, and the Regional Courts of Dusseldorf and Mannheim in Germ... » read more

Fast LFD Flows With Pattern Matching And Machine Learning Can Deliver Higher-Yielding Designs Faster

By Wael elManhawy - 22 Aug, 2019 - Comments: 0

By Wael ElManhawy and Joe Kwan A lithographic (litho) hotspot is a defect on a wafer that is created during manufacturing by a combination of systematic process variation and resolution enhancement technology (RET) limitations. Litho hotspots typically represent severe yield detractors, so detecting and eliminating potential litho hotspots prior to manufacturing is crucial to achieving a com... » read more

200mm Cools Off, But Not For Long

By Mark LaPedus - 18 Jul, 2019 - Comments: 4

After years of acute shortages, 200mm fab capacity is finally loosening up, but the supply/demand picture could soon change with several challenges on the horizon. 200mm fabs are older facilities with more mature processes, although they still churn out a multitude of today’s critical chips, such as analog, MEMS, RF and others. From 2016 to 2018, booming demand for these and other chips ca... » read more

Advanced Process Control

By Ed Sperling - 20 Jun, 2019 - Comments: 0

David Fried, vice president of computational products at Lam Research, looks at shrinking tolerances at advanced processes, how that affects variation in semiconductor manufacturing, and what can be done to achieve the benefits of scaling without moving to new transistor architectures. » read more

Clean Focus, Dose And CD Metrology For CD Uniformity Improvement

By KLA - 11 Jun, 2019 - Comments: 0

Authors: Honggoo Leea, Sangjun Hana, Minhyung Honga, Seungyong Kima, Jieun Leea, DongYoung Leea, Eungryong Oha, Ahlin Choia, Nakyoon Kimb, John C. Robinsonc, Markus Mengelc, Pablo Rovirac, Sungchul Yooc, Raphael Getinc, Dongsub Choib, Sanghuck Jeonb aSK Hynix, 2091, Gyeongchung-daero, Bubal-eub, Icheon-si, Gyeonggi-do, 467-701, Korea bKLA-Tencor Korea, Starplaza bldg., 53 Metapolis-ro, Hwasung... » read more

Controlling Variability And Cost At 3nm And Beyond

By Ed Sperling - 22 May, 2019 - Comments: 1

Richard Gottscho, executive vice president and CTO of Lam Research, sat down with Semiconductor Engineering to talk about how to utilize more data from sensors in manufacturing equipment, the migration to new process nodes, and advancements in ALE and materials that could have a big impact on controlling costs. What follows are excerpts of that conversation. SE: As more sensors are added int... » read more

Renaissance In The Photomask Market?

By Lara Chamness - 08 May, 2019 - Comments: 0

The semiconductor industry has been on a roll for the past few years – and the rising tide has lifted segments spanning the supply chain. The photomask market, in particular, has seen exceptionally strong growth of 13 percent and 8 percent in 2017 and 2018, respectively. The upsurge is striking given that, in the early to mid-2000s, the photomask market averaged less than 4 percent annual gro... » read more

EUV Mask Gaps And Issues

By Mark LaPedus - 08 May, 2019 - Comments: 1

Semiconductor Engineering sat down to discuss extreme ultraviolet (EUV) lithography and photomask technologies with Emily Gallagher, principal member of the technical staff at Imec; Harry Levinson, principal at HJL Lithography; Chris Spence, vice president of advanced technology development at ASML; Banqiu Wu, senior director of process development at Applied Materials; and Aki Fujimura, chief ... » read more

Lithography Options For Next-Gen Devices

By Mark LaPedus - 18 Apr, 2019 - Comments: 2

Chipmakers are ramping up extreme ultraviolet (EUV) lithography for advanced logic at 7nm and/or 5nm, but EUV isn’t the only lithographic option on the table. For some time, the industry has been working on an assortment of other next-generation lithography technologies, including a new version of EUV. Each technology is different and aimed at different applications. Some are here today, w... » read more

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tag: lithography