tag: lithography

How Much Multipatterning?
By Ed Sperling - 19 Jun, 2014 - Comments: 2

The latest consensus among litho experts is that extreme ultraviolet (EUV) will appear in the market sometime in coming months in a commercially viable form. The only question is the degree of commercially viability, and what it will actually cost. While some debate lingers about whether EUV will ever get going, the general feeling is that enough progress has been made recently to make it work.... » read more

Manufacturing Bits: June 3
By Mark LaPedus - 03 Jun, 2014 - Comments: 0

World’s thinnest TFTs The U.S. Department of Energy’s Argonne National Laboratory has devised the world’s thinnest flexible, 2D thin-film transistors (TFTs). The transistors are just 10 atomic layers thick. TFTs are typically used in screens and displays. In the lab, Argonne researchers fabricated the TFTs on both a conventional silicon platform and a flexible substrate. [caption i... » read more

EDA Races To 7nm, Despite Litho Uncertainties
By Ann Mutschler - 16 May, 2014 - Comments: 0

It’s becoming almost painful to refer to the delay with EUV, but it certainly isn’t stopping anyone on the design side from tweaking design tools or working on test chips. Clearly, things are moving ahead to 7nm even though lithography plans aren't yet clear. Steve Carlson, group marketing director in Cadence’s Office of Chief Strategy, said with regard to EUV, “They have the power p... » read more

Self-Aligned Double Patterning, Part One
By David Abercrombie - 15 May, 2014 - Comments: 0

I’m sure most of you have seen a Rorschach test ink blot (Figure 1). Psychiatrists ask the subjects to tell them what they “see” in the ink blot. The answers are used to characterize the respondent’s personality and emotional functioning. I am never sure if I would feel more uncertain being the psychiatrist asking the question, or the subject trying to decide what to say, given there ar... » read more

One-On-One: Linyong Pang
By Mark LaPedus - 12 May, 2014 - Comments: 1

Semiconductor Engineering sat down to discuss trends in the lithography and photomask business with Linyong “Leo” Pang, the new chief product officer and executive vice president at D2S, which focuses on model-based mask data preparation as well as other mask writing technologies. What follows are excerpts of that conversation. SE: Before you arrived at D2S you were at Luminescent, whic... » read more

FinFET Learning
By Ed Sperling - 08 May, 2014 - Comments: 0

FinFETs are not simple to work with. They’re difficult to manufacture, tricky to design, and they run the risk of greatly increased dynamic power density—particularly at 14/16nm, where extra margin is hard to justify—which affects everything from electromigration to signal integrity. Moreover, while finFETs have been on the drawing board for more than a decade, it’s taken four years ... » read more

Manufacturing Bits: May 6
By Mark LaPedus - 06 May, 2014 - Comments: 0

Litho beam startup A startup has developed a new beam technology for advanced lithography applications. The company, called Digibeam, has demonstrated the ability to shoot a particle beam through a slow wave RF structure to create a train of compressed beam packets for high-throughput lithography. “Synchronized with high-speed deflection, the core technology enables shot rates well into t... » read more

Manufacturing Bits: April 29
By Mark LaPedus - 29 Apr, 2014 - Comments: 0

Silky e-beam lithography Tufts University has put a soft and silky spin on direct-write electron-beam lithography. Researchers used common silk as the resist material, enabling the production of photonic lattices, quantum dots and other structures. This approach is a green alternative to traditional and toxic resists. The silk-based resist is developed using a water-based process. It starts... » read more

Stopping Mask Hotspots Before They Escape The Mask Shop
By eBeam Initiative - 28 Apr, 2014 - Comments: 3

By Aki Fujimura The same types of physics-based issues that have haunted lithography for decades have started to impact mask writing as well. The increasingly small and complex mask shapes specified by optical proximity correction (OPC) that are now required for faithful wafer lithography at 28nm-and-below nodes have given rise to an increase in mask hotspots. Mask hotspots occur when the shap... » read more

Mask Issues Ahead
By eBeam Initiative - 17 Apr, 2014 - Comments: 0

It's not just the lithography that's getting complicated. Check out this video by Dai Nippon Printing's Naoya Hayashi. [youtube vid=a6WmvhTdEv4] » read more

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