tag: manufacturing

Secure SoC Manufacturing
By Rambus - 07 Jul, 2014 - Comments: 0

As mobile usage continues to permeate daily lives with increasingly sensitive data and high-value transactions, the importance of device security has become even more important. Information security begins at the point when Internet- connected devices are designed and manufactured. But today’s complex global supply chains are fraught with numerous challenges that can result in both security b... » read more

Tech Talk: Concurrent Test
By Ed Sperling - 18 Jun, 2014 - Comments: 2

Dave Armstrong, director of business development at Advantest, discusses the usefulness of concurrent test and describes how to maximize the value of this approach. [youtube vid=UFPxTlB2LWQ] » read more

Manufacturing Bits: June 10
By Ed Sperling - 10 Jun, 2014 - Comments: 2

Self-Assembling Nano Films Applying thin films with uniformity has always been an engineering challenge, but as feature sizes shrink the problem become even more pronounced. But a new approach developed by Lawrence Berkeley National Labs’ Materials Science Division could end up simplifying this process. The new approach used chloroform as an annealing solvent to create self-assembling arr... » read more

Shootout At 28nm
By Ed Sperling - 15 May, 2014 - Comments: 0

By Ed Sperling & Mark LaPedus Samsung, Soitec and STMicroelectronics are joining forces on 28nm FD-SOI, creating a showdown with TSMC and others over the best single-patterned processes and materials and raising questions about how quickly companies need to move to the finFET technology generation. The multi-source manufacturing collaboration agreement for fully depleted silicon-on-insulato... » read more

Atomic Layer Etch Finally Emerges
By Mark LaPedus - 15 May, 2014 - Comments: 1

The migration towards finFETs and other devices at the 20nm node and beyond will require a new array of chip-manufacturing technologies. Multiple patterning, hybrid metrology and newfangled interconnect schemes are just a few of the technologies required for future scaling. In addition, the industry also will require new techniques that can process structures at the atomic level. For example... » read more

The Sensor Revolution
By Kenji Tsuda - 05 May, 2014 - Comments: 0

“Sensors will transform manufacturing from now on,” said Eric Janson, senior vice president of sales and marketing at AMS (Austria Micro Systeme), an analog mixed-signal semiconductor manufacturer based in Austria. There have been many such predictions in the past—lithography, processors, memory and various materials all have been predicted to change semiconductor manufacturing. But se... » read more

Stopping Mask Hotspots Before They Escape The Mask Shop
By eBeam Initiative - 28 Apr, 2014 - Comments: 3

By Aki Fujimura The same types of physics-based issues that have haunted lithography for decades have started to impact mask writing as well. The increasingly small and complex mask shapes specified by optical proximity correction (OPC) that are now required for faithful wafer lithography at 28nm-and-below nodes have given rise to an increase in mask hotspots. Mask hotspots occur when the shap... » read more

Gaps In Metrology Could Impact Yield
By Mark LaPedus - 17 Apr, 2014 - Comments: 0

For some time, chipmakers have been developing new and complex chip architectures, such as 3D NAND, finFETs and stacked die. But manufacturing these types of chips is no simple task. It requires a robust fab flow to enable new IC designs with good yields. In fact, yield is becoming a more critical part of the flow. Yield is a broad term that means different things to different parts of the ... » read more

Time To Revisit 2.5D And 3D
By Mark LaPedus - 17 Apr, 2014 - Comments: 2

Chipmakers are reaching various and challenging inflection points. In logic, many IC makers face a daunting transition from planar transistors at 20nm to finFETs at 14nm. And on another front, the industry is nearing the memory bandwidth wall. So perhaps it’s time to look at new alternatives. In fact, chipmakers are taking a hard look, or re-examining, one alternative—stacked 2.5D/3D chi... » read more

Effectively Manage Material Obsolescence To Avoid Costly Surprises
By Various Writers - 16 Apr, 2014 - Comments: 0

This paper describes the solution that allows complete management and control for companies to optimize their business and their performance on commitment to customers, specifically with respect to effective management of material obsolescence. To view this paper, click here. » read more

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