tag: Mentor

Emulation-Centric Power Analysis Of SoC Designs
By Lauro Rizzatti - 09 Jun, 2022 - Comments: 0

Verification expert Lauro Rizzatti recently interviewed Jean-Marie Brunet, senior marketing director, Scalable Verification Solutions Division (SVSD), Siemens EDA, about the importance of accurate power estimation and optimization for system-on-chip (SoC) designs. What is the problem facing the semiconductor industry today regarding pre-silicon power estimation? The problem is the discrep... » read more

DRAM Thermal Issues Reach Crisis Point
By Karen Heyman - 09 Jun, 2022 - Comments: 5

Within the DRAM world, thermal issues are at a crisis point. At 14nm and below, and in the most advanced packaging schemes, an entirely new metric may be needed to address the multiplier effect of how thermal density increasingly turns minor issues into major problems. A few overheated transistors may not greatly affect reliability, but the heat generated from a few billion transistors does.... » read more

IP Industry Transformation
By Brian Bailey - 09 Jun, 2022 - Comments: 0

The design IP industry is developing an assortment of new options and licensing schemes that could affect everything from how semiconductor companies collaborate to how ICs are designed, packaged, and brought to market. The IP market already has witnessed a sweeping shift from a "design once, use everywhere" approach, to an "architect once, customize everywhere" model, in which IP is highly ... » read more

Keeping IC Packages Cool
By Laura Peters and Karen Heyman - 07 Jun, 2022 - Comments: 0

Placing multiple chips into a package side-by-side can alleviate thermal issues, but as companies dive further into die stacking and denser packaging to boost performance and reduce power, they are wrestling with a whole new set of heat-related issues. The shift to advanced packaging enables chipmakers to meet demands for increasing bandwidth, clock speeds, and power density for high perform... » read more

Removing Barriers For End-To-End Analytics
By Anne Meixner - 07 Jun, 2022 - Comments: 0

Parties are coming together, generating guidelines for sharing data from IC design and manufacturing through end of life, setting the stage for true end-to-end analytics. While the promise of big data analytics is well understood, data sharing through the semiconductor supply chain has been stymied by an inability to link together data sources throughout the lifecycle of a chip, package, or ... » read more

Automotive Bandwidth Issues Grow As Data Skyrockets
By Ann Mutschler - 02 Jun, 2022 - Comments: 0

Bandwidth requirements for future vehicles are set to explode as the amount of data moving within vehicles, between vehicles, and between vehicles and infrastructure, continues to grow rapidly. That data will be necessary for a variety of functions, some of which are here today and many of which are still in development. On the safety side, that includes everything from early warning systems... » read more

Data Security Drives Innovative Verification Capabilities For SoCs
By Richard Pugh - 02 Jun, 2022 - Comments: 0

The protection and integrity of data is a key challenge for organizations and businesses as human interactions with computers have expanded enormously. This has created a vast amount of information and led to the age of “Big Data” where massive, rich data sets are collected and analyzed to advance knowledge and progress in multiple fields. The security of this data has become a critical nee... » read more

AI-Powered Verification
By Brian Bailey - 01 Jun, 2022 - Comments: 1

With functional verification consuming more time and effort than design, the chip industry is looking at every possible way to make the verification process more effective and more efficient. Artificial intelligence (AI) and machine learning (ML) are being tested to see how big an impact they can have. While there is progress, it still appears to be just touching the periphery of the problem... » read more

Navigating The Intersection Of Safety And Security
By Rambus - 01 Jun, 2022 - Comments: 0

Vehicle systems and the semiconductors used within them are some of the most complex electronics seen today. In the past, electronics going into vehicle systems implemented flat architectures with isolated functions controlling various components of the power train and vehicle dynamics. However, to support the realization of Level 4 and Level 5 (L4/L5) autonomous driving, a massive restructure ... » read more

Blog Review: June 1
By Jesse Allen - 01 Jun, 2022 - Comments: 0

Analog Photonics' Erman Timurdogan, Ren-Jye Shiue, and Mohammad H. Teimourpour, and Ansys' Bozidar Novakovic, Ahsan Alam, and Peter Hallschmid consider the development of photonic process design kits and the importance of choosing a laser model that can optimally satisfy often conflicting requirements between the number of known laser parameters, the model accuracy, and the computational time. ... » read more

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